Laird Technologies - Thermal Materials A15973-08
Laird Technologies - Thermal Materials A15973-08
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Laird Technologies - Thermal Materials A15973-08

Manufacturer No:

A15973-08

Utmel No:

1412-A15973-08

Package:

-

ECAD Model:

Description:

THERM PAD 228.6MMX228.6MM GREEN

Quantity:

Delivery:

DHLTNTUPSFedExSF-Express

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In Stock : Please Inquire

Please send RFQ , we will respond immediately.

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User Guide

Purchase & Inquiry
Package
Shipping Information
Shopping Manual
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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
A15973-08 information

Specifications
Documents & Media
Laird Technologies - Thermal Materials A15973-08 technical specifications, attributes, parameters and parts with similar specifications to Laird Technologies - Thermal Materials A15973-08.
  • Type
    Parameter
  • Factory Lead Time
    4 Weeks
  • Material

    In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

    Silicone Elastomer
  • Shape

    In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

    Square
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Tflex™ 300
  • Published
    2010
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Type
    Gap Filler Pad, Sheet
  • Color
    Green
  • Outline

    In electronic components, the parameter "Outline" refers to the physical dimensions and shape of the component. It includes details such as the length, width, height, and overall form of the component. The outline is important for determining how the component will fit into a circuit board or system, as well as for ensuring compatibility with other components and devices. Manufacturers typically provide outline drawings or specifications to help designers and engineers understand the physical characteristics of the component. Paying attention to the outline parameter is crucial for proper installation, assembly, and functionality of electronic components in a circuit or system.

    228.60mm x 228.60mm
  • Thermal Conductivity

    a measure of a material's ability to?conduct heat.?

    1.2W/m-K
  • Natural Thermal Resistance

    Natural thermal resistance in electronic components refers to the ability of a device to dissipate heat without the assistance of external cooling methods such as fans or liquid cooling. It is a measure of how effectively a component can transfer heat from its junction to its surrounding environment through natural convection and radiation. This parameter is critical for assessing the thermal performance and reliability of electronic devices, as excessive heat can lead to failure or diminished efficiency. Natural thermal resistance is typically expressed in degrees Celsius per watt (°C/W) and is influenced by factors such as the material properties, component design, and ambient conditions.

    1.81 °C/W
  • Thermal Resistivity

    Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance.

    1.81°C/W
  • Thickness

    Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

    0.0800 2.032mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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