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Linear Technology / Analog Devices LT1785IN8

BIPOLAR Controllers Interface ICs

Manufacturer No:

LT1785IN8

Utmel No:

153-LT1785IN8

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-

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Description:

BIPOLAR Controllers Interface ICs DUAL 2.54 mm

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LT1785IN8 information

Specifications
Documents & Media
Product Details
Linear Technology / Analog Devices LT1785IN8 technical specifications, attributes, parameters and parts with similar specifications to Linear Technology / Analog Devices LT1785IN8.
  • Type
    Parameter
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Terminals
    8
  • Package Description
    0.300 INCH, PLASTIC, DIP-8
  • Package Style
    IN-LINE
  • Moisture Sensitivity Levels
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Min
    -40 °C
  • Supply Voltage-Nom
    5 V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Supply Voltage-Min
    4.75 V
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    No
  • Manufacturer Part Number
    LT1785IN8
  • Interface Standards
    EIA-422; EIA-485
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Manufacturer
    Analog Devices Inc
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    ANALOG DEVICES INC
  • Supply Voltage-Max
    5.25 V
  • Risk Rank
    5.04
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e0
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Lead (Sn/Pb)
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    BIPOLAR
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54 mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    not_compliant
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PDIP-T8
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Seated Height-Max

    Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.

    3.937 mm
  • Differential Output

    a differential output voltage in electronics is the difference between the values of two AC voltages, 180° out of phase, present at the output terminals of an amplifier when you apply a differential input voltage to the input terminals of an amplifier.

    YES
  • Input Characteristics

    In electronic components, "Input Characteristics" refer to the set of specifications that describe how the component behaves in response to signals or inputs applied to it. These characteristics typically include parameters such as input voltage, input current, input impedance, input capacitance, and input frequency range. Understanding the input characteristics of a component is crucial for designing circuits and systems, as it helps ensure compatibility and proper functioning. By analyzing these parameters, engineers can determine how the component will interact with the signals it receives and make informed decisions about its use in a particular application.

    DIFFERENTIAL SCHMITT TRIGGER
  • Interface IC Type

    The parameter "Interface IC Type" in electronic components refers to the type of integrated circuit (IC) that is used to facilitate communication between different electronic devices or subsystems. This IC is responsible for managing the exchange of data and control signals between the devices, ensuring proper communication and coordination. The specific type of interface IC used can vary depending on the requirements of the system, such as serial communication (e.g., UART, SPI, I2C), parallel communication, or specialized interfaces like USB or Ethernet. Choosing the appropriate interface IC type is crucial for ensuring compatibility, reliability, and efficiency in electronic systems.

    LINE TRANSCEIVER
  • Driver Number of Bits
    1
  • Receiver Number of Bits
    1
  • Receive Delay-Max

    Receive Delay-Max is a parameter in electronic components that refers to the maximum amount of time it takes for a device to receive and process incoming signals or data after they have been transmitted. This parameter is crucial in determining the overall performance and efficiency of the component, especially in applications where timing is critical. A lower Receive Delay-Max value indicates faster response times and better overall performance, while a higher value may result in delays and potential issues in data transmission. It is important to consider and optimize the Receive Delay-Max parameter when designing or selecting electronic components for specific applications to ensure reliable and efficient operation.

    900 ns
  • Transmit Delay-Max

    Transmit Delay-Max refers to the maximum time interval it takes for a signal to be transmitted from the input to the output of an electronic component or system. This parameter is critical in digital circuits and communication systems, as it affects the overall performance and timing of data transmission. A lower Transmit Delay-Max indicates faster signal propagation, which is essential for high-speed applications. It is typically specified in nanoseconds or microseconds, depending on the technology and design of the component.

    2000 ns
  • Width
    7.62 mm
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LT1785IN8 Overview


LT1785IN8 Features


LT1785IN8 Applications

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LT1785IN8 Controllers Interface ICs applications.


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