Maxim Integrated MAX4951BECTP TGH7
Maxim Integrated MAX4951BECTP TGH7
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Maxim Integrated MAX4951BECTP TGH7

Signal Buffers, Repeaters, Splitters Tape & Reel (TR) 3.3V V Signal Buffers, Repeaters, Splitters

Manufacturer No:

MAX4951BECTP TGH7

Manufacturer:

Maxim Integrated

Utmel No:

1551-MAX4951BECTP TGH7

Package:

20-WFQFN Exposed Pad

ECAD Model:

Description:

Surface Mount Tape & Reel (TR) 3.3V V Signal Buffers, Repeaters, Splitters 3V~3.6V V 240 ps ns 20

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In Stock : 1260

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MAX4951BECTP TGH7 information

Specifications
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Maxim Integrated MAX4951BECTP TGH7 technical specifications, attributes, parameters and parts with similar specifications to Maxim Integrated MAX4951BECTP TGH7.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    20-WFQFN Exposed Pad
  • Number of Pins
    20
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2010
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    20
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Type
    Buffer, ReDriver
  • Applications

    The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

    eSATA
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    2.051W
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    3V~3.6V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3.3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    MAX4951
  • Number of Channels
    1
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    240 ps
  • Current - Supply

    Current - Supply is a parameter in electronic components that refers to the maximum amount of electrical current that the component can provide to the circuit it is connected to. It is typically measured in units of amperes (A) and is crucial for determining the power handling capability of the component. Understanding the current supply rating is important for ensuring that the component can safely deliver the required current without overheating or failing. It is essential to consider this parameter when designing circuits to prevent damage to the component and ensure proper functionality of the overall system.

    77mA
  • Low Level Output Current

    The current into the output terminal with input conditions applied that, according to the product specification, will establish a low level at the output.

    500μA
  • Data Rate (Max)

    Data Rate (Max) refers to the maximum rate at which data can be transferred or processed within an electronic component or device. It is typically measured in bits per second (bps) or megabits per second (Mbps). This parameter is important for determining the speed and efficiency of data transmission or processing in various electronic applications such as computer systems, networking devices, and memory modules. A higher data rate indicates that the component is capable of handling larger volumes of data at a faster pace, leading to improved performance and responsiveness in electronic systems. It is crucial to consider the Data Rate (Max) specification when selecting electronic components to ensure compatibility and optimal functionality for specific applications.

    3Gbps
  • Built-in Protections

    Built-in protections in electronic components refer to the safety features and mechanisms that are integrated into the component to prevent damage or malfunction in various situations. These protections are designed to safeguard the component from overvoltage, overcurrent, overheating, short circuits, and other potential hazards that could occur during operation. By having built-in protections, electronic components can operate more reliably and safely, extending their lifespan and reducing the risk of failure. These protections are essential for ensuring the overall performance and longevity of electronic devices and systems.

    TRANSIENT
  • Delay Time

    The amount of time by which the arrival of a signal is retarded after transmission through physical equipment or systems.

    150ps
  • Signal Conditioning

    In electronics, signal conditioning is the manipulation of an analog signal in such a way that it meets the requirements of the next stage for further processing.

    Input Equalization, Output Pre-Emphasis
  • Length
    4mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    0.8mm
  • Width
    4mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Maxim Integrated MAX4951BECTP TGH7.

MAX4951BECTP TGH7 Overview

For convenience, power buffer comes packaged in 20-WFQFN Exposed Pad.Power buffer ready in Tape & Reel (TR) packages.The Surface Mount universal mout is designed for easy adaptability.As far as types go, this is a typical Buffer, ReDriver.It works on 3V~3.6V voltage.It is the cooperation of the 1 channels that maintains the quality of the output.It is recommended that the operating temperature is set to 0°C~70°C to prevent malfunctions.Among other applications, this operational amplifier buffer targets the eSATA platform.To find more pin-to-pin solutions, search with "MAX4951".An op amp buffer with 20 terminals can be found.This splitter is supplied with 3.3V voltage, which allows it to perform a variety of demanding tasks.In addition, it has 20 pins.OP amp buffers 77mA.A mounting hole is provided for mounting on PCBs and other boards.Power dissipation is 2.051W at most for this splitter.

MAX4951BECTP TGH7 Features

1 channels.
Mainly used in eSATA.

MAX4951BECTP TGH7 Applications

There are a lot of Maxim Integrated
MAX4951BECTP TGH7 Signal Buffers, Repeaters, Splitters applications.


  • Network Switches/Routers
  • Backplane Interconnect
  • Clock Distribution
  • Protection Switching
  • Loopback
  • Clock Distribution
  • Servers
  • Industrial PCs
  • Test Equipment
  • Desktop Computers
The three parts on the right have similar specifications to Maxim Integrated & MAX4951BECTP TGH7.
MAX4951BECTP TGH7 Relevant information

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