

Maxim Integrated MAX9175EUB T
Signal Buffers, Repeaters, Splitters Tape & Reel (TR) 3.3V V 25mA μA Signal Buffers, Repeaters, Splitters
Manufacturer No:
MAX9175EUB T
Tiny WHSLManufacturer:
Utmel No:
1551-MAX9175EUB T
Package:
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Datasheet:
Description:
Surface Mount Tape & Reel (TR) 3.3V V 25mA μA Signal Buffers, Repeaters, Splitters 3V~3.6V V 3.23 ns ns 4.5pF pF 10
Quantity:
Unit Price: $2.024363
Ext Price: $2.02
Delivery:





Payment:











In Stock : 25
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$2.024363
$2.02
10
$1.909777
$19.10
100
$1.801676
$180.17
500
$1.699694
$849.85
1000
$1.603485
$1,603.48
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- TypeParameter
- Factory Lead Time6 Weeks
- Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) - Number of Pins10
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - Published1998
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e3 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
yes - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Number of Terminations10
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - TypeBuffer, Multiplexer
- Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Matte Tin (Sn) - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
3V~3.6V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Number of Functions1
- Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
3.3V - Terminal Pitch
The center distance from one pole to the next.
0.5mm - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
MAX9175 - Output
In electronic components, the parameter "Output" typically refers to the signal or data that is produced by the component and sent to another part of the circuit or system. The output can be in the form of voltage, current, frequency, or any other measurable quantity depending on the specific component. The output of a component is often crucial in determining its functionality and how it interacts with other components in the circuit. Understanding the output characteristics of electronic components is essential for designing and troubleshooting electronic circuits effectively.
LVDS - Pin Count
a count of all of the component leads (or pins)
10 - Operating Supply Voltage
The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.
3.3V - Supply Voltage-Max (Vsup)
The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.
3.6V - Supply Voltage-Min (Vsup)
The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.
3V - Number of Channels1 x 1:2
- Operating Supply Current
Operating Supply Current, also known as supply current or quiescent current, is a crucial parameter in electronic components that indicates the amount of current required for the device to operate under normal conditions. It represents the current drawn by the component from the power supply while it is functioning. This parameter is important for determining the power consumption of the component and is typically specified in datasheets to help designers calculate the overall power requirements of their circuits. Understanding the operating supply current is essential for ensuring proper functionality and efficiency of electronic systems.
25mA - Propagation Delay
the flight time of packets over the transmission link and is limited by the speed of light.
3.23 ns - Turn On Delay Time
Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.
3.23 ns - Number of Drivers2
- Data Rate (Max)
Data Rate (Max) refers to the maximum rate at which data can be transferred or processed within an electronic component or device. It is typically measured in bits per second (bps) or megabits per second (Mbps). This parameter is important for determining the speed and efficiency of data transmission or processing in various electronic applications such as computer systems, networking devices, and memory modules. A higher data rate indicates that the component is capable of handling larger volumes of data at a faster pace, leading to improved performance and responsiveness in electronic systems. It is crucial to consider the Data Rate (Max) specification when selecting electronic components to ensure compatibility and optimal functionality for specific applications.
800Mbps - Same Edge Skew-Max (tskwd)
The parameter "Same Edge Skew-Max (tskwd)" in electronic components refers to the maximum allowable difference in propagation delay between signals that are traveling along the same edge of a component, such as a flip-flop or a register. Skew refers to the timing misalignment between signals, and this parameter sets a limit on how much skew is acceptable for signals that are supposed to arrive at the same time. Exceeding this maximum skew value can lead to timing violations and affect the overall performance and reliability of the electronic system. Designers need to carefully consider and manage skew to ensure proper signal synchronization and timing integrity in their electronic designs.
0.045 ns - Delay Time
The amount of time by which the arrival of a signal is retarded after transmission through physical equipment or systems.
2.39ns - Input Conditioning
Input conditioning refers to the process of preparing an input signal for processing by electronic components or systems. This involves filtering, amplifying, and converting the signal to ensure it meets the required specifications for accurate interpretation and processing. Input conditioning typically aims to reduce noise, adjust signal levels, and ensure compatibility with the receiving system's input requirements. It is a critical step in ensuring reliable and accurate performance of electronic devices.
DIFFERENTIAL - Capacitance - Input
Capacitance - Input is a parameter that describes the input capacitance of an electronic component, such as a transistor or an integrated circuit. It represents the amount of charge that the input of the component can store when a voltage is applied to it. This capacitance affects the speed and performance of the component, as it can influence the time it takes for the input signal to be processed. A higher input capacitance can result in slower response times and may require additional circuitry to mitigate its effects. It is an important parameter to consider when designing and analyzing electronic circuits to ensure proper functionality and performance.
4.5pF - Length3mm
- Height Seated (Max)
Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.
1.1mm - Width3mm
- Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant