Microchip Technology KSZ8895MQXIA
Microchip Technology KSZ8895MQXIA
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Microchip Technology KSZ8895MQXIA

10/100 Base-T/TX I2C, SPI Controllers Interface ICs

Manufacturer No:

KSZ8895MQXIA

Utmel No:

1610-KSZ8895MQXIA

Package:

128-BFQFP

ECAD Model:

Description:

1.8V 2.5V 3.3V 10/100 Base-T/TX I2C, SPI Controllers Interface ICs QUAD KSZ8895 128 Pins Switch 128-BFQFP

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KSZ8895MQXIA information

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Microchip Technology KSZ8895MQXIA technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology KSZ8895MQXIA.
  • Type
    Parameter
  • Factory Lead Time
    13 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    128-BFQFP
  • Number of Pins
    128
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    128
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn) - annealed
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.8V 2.5V 3.3V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.2V
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    KSZ8895
  • Function

    The parameter "Function" in electronic components refers to the specific role or purpose that the component serves within an electronic circuit. It defines how the component interacts with other elements, influences the flow of electrical signals, and contributes to the overall behavior of the system. Functions can include amplification, signal processing, switching, filtering, and energy storage, among others. Understanding the function of each component is essential for designing effective and efficient electronic systems.

    Switch
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3V
  • Number of Channels
    5
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    I2C, SPI
  • Operating Supply Current

    Operating Supply Current, also known as supply current or quiescent current, is a crucial parameter in electronic components that indicates the amount of current required for the device to operate under normal conditions. It represents the current drawn by the component from the power supply while it is functioning. This parameter is important for determining the power consumption of the component and is typically specified in datasheets to help designers calculate the overall power requirements of their circuits. Understanding the operating supply current is essential for ensuring proper functionality and efficiency of electronic systems.

    129mA
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    100 Mbps
  • Protocol

    In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.

    Ethernet
  • Simplex/Duplex

    In electronic components, the parameter "Simplex/Duplex" refers to the type of communication or data transmission mode supported by the component. Simplex communication is a one-way communication mode where data flows only in one direction, from the sender to the receiver. This means that the sender can only transmit data, and the receiver can only receive data. On the other hand, duplex communication is a two-way communication mode where data can flow in both directions, allowing for simultaneous transmission and reception of data between two devices. Understanding whether a component supports simplex or duplex communication is important for determining how data will be exchanged between devices and ensuring compatibility in a given system.

    Full Duplex
  • Standards

    The parameter "Standards" in electronic components refers to established criteria or specifications that ensure interoperability, safety, and performance across various electronic devices and systems. These standards are often set by recognized organizations and describe the characteristics, dimensions, and testing methods for components. Adherence to these standards helps manufacturers produce compatible and reliable products, facilitates communication between devices, and ensures compliance with regulatory requirements. Standards play a crucial role in the consistency and quality of electronic components in the industry.

    10/100 Base-T/TX
  • Max Junction Temperature (Tj)

    Max Junction Temperature (Tj) refers to the maximum allowable temperature at the junction of a semiconductor device, such as a transistor or integrated circuit. It is a critical parameter that influences the performance, reliability, and lifespan of the component. Exceeding this temperature can lead to thermal runaway, breakdown, or permanent damage to the device. Proper thermal management is essential to ensure the junction temperature remains within safe operating limits during device operation.

    125°C
  • Ambient Temperature Range High

    This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.

    85°C
  • Height
    3.4mm
  • Length
    20mm
  • Width
    14mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Product Description:

The KSZ8895MQXIA is a high-performance, 5-channel Ethernet switch from Microchip Technology, designed to provide reliable and efficient data transmission in a variety of applications. This surface-mount, 128-pin BGA package is RoHS3 compliant and features a lead-free matte tin (Sn) - annealed terminal finish.

Features:

  • High-Speed Data Transmission: The KSZ8895MQXIA supports data rates of up to 100 Mbps, making it suitable for demanding Ethernet applications.
  • Multi-Channel Capability: With five channels, this switch can handle multiple Ethernet connections simultaneously, increasing overall network bandwidth and efficiency.
  • Flexible Interface Options: The device supports both I2C and SPI interfaces, providing flexibility in system design and integration.
  • Wide Operating Temperature Range: The switch operates reliably within an ambient temperature range of -40°C to 85°C, making it suitable for use in a variety of environments.
  • Low Power Consumption: The KSZ8895MQXIA has an operating supply current of 129mA, making it energy-efficient and suitable for battery-powered devices.

Applications:

  • Primary Applications: The KSZ8895MQXIA is ideal for use in industrial automation, medical devices, and consumer electronics where high-speed Ethernet connectivity is required.
  • Secondary Applications: This switch can also be used in other applications such as networking equipment, automotive systems, and IoT devices.

Alternative Parts:

  • KSZ8895: The base part number for this product, which is a single-channel Ethernet switch.
  • KSZ8895MQXIA: The variant of the KSZ8895 with additional features such as multi-channel capability and higher data rates.

Embedded Modules:

  • Ethernet Modules: The KSZ8895MQXIA is often used in embedded systems that require high-speed Ethernet connectivity, such as industrial control systems, medical devices, and consumer electronics.

FAQs:

Q: What is the maximum data rate supported by the KSZ8895MQXIA? A: The KSZ8895MQXIA supports data rates of up to 100 Mbps.

Q: What are the operating temperature ranges for the KSZ8895MQXIA? A: The KSZ8895MQXIA operates within an ambient temperature range of -40°C to 85°C.

Q: What are the interface options available on the KSZ8895MQXIA? A: The KSZ8895MQXIA supports both I2C and SPI interfaces.

Q: What is the packaging option for the KSZ8895MQXIA? A: The KSZ8895MQXIA is available in a 128-pin BGA package with a tray packaging option.

Q: What is the lead time for the KSZ8895MQXIA? A: The lead time for the KSZ8895MQXIA is 13 weeks.

Q: Is the KSZ8895MQXIA RoHS compliant? A: Yes, the KSZ8895MQXIA is RoHS3 compliant.

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