

Microchip Technology MCP79411T-I/MS
RTC 8 Pin 8 Terminations Real Time Clocks IC
Manufacturer No:
MCP79411T-I/MS
Tiny WHSLManufacturer:
Utmel No:
1610-MCP79411T-I/MS
Package:
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Datasheet:
Usage Grade:
Industrial
Description:
8 Terminations 5V 8 Pin MCP79411 Real Time Clocks 0.4MHz
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In Stock : 5000
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- TypeParameter
- Factory Lead Time7 Weeks
- Mount
In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.
Surface Mount - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) - Number of Pins8
- Usage LevelIndustrial grade
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~85°C - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - Published2007
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e3 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - Number of Terminations8
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - TypeClock/Calendar
- Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Matte Tin (Sn) - annealed - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
1.8V~5.5V - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Supply Voltage
Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.
5V - Terminal Pitch
The center distance from one pole to the next.
0.65mm - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
40 - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
MCP79411 - Pin Count
a count of all of the component leads (or pins)
8 - Power Supplies
an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?
2/5V - Interface
In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.
I2C, 2-Wire Serial - Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
64B 1Kb - Clock Frequency
Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.
0.4MHz - Logic Function
In electronic components, the term "Logic Function" refers to the specific operation or behavior of a component based on its input signals. It describes how the component processes the input signals to produce the desired output. Logic functions are fundamental to digital circuits and are used to perform logical operations such as AND, OR, NOT, and XOR.Each electronic component, such as logic gates or flip-flops, is designed to perform a specific logic function based on its internal circuitry. By understanding the logic function of a component, engineers can design and analyze complex digital systems to ensure proper functionality and performance. Different logic functions can be combined to create more complex operations, allowing for the creation of sophisticated digital devices and systems.
Clock - Time Format
Time is based on a 24 hour system. This is frequently referred to as "military time". The 24 hour system is the default format.
HH:MM:SS (12/24 hr) - Date Format
The international standard recommends writing the date as year, then month, then the day:?YYYY-MM-DD.
YY-MM-DD-dd - Current - Timekeeping (Max)
The parameter "Current - Timekeeping (Max)" in electronic components refers to the maximum current that a device can draw while performing timekeeping functions. Timekeeping functions typically involve maintaining accurate time and date information within a device, such as in a real-time clock (RTC) or a microcontroller with a built-in clock. The maximum current specified for timekeeping is important for determining the power consumption of the device when it is in standby or low-power modes, as excessive current draw can drain the battery quickly. Designers need to consider this parameter when selecting components for battery-powered devices to ensure efficient power management and longer battery life.
1.2μA @ 3.3V - Time-Min
Time-Min is a parameter in electronic components that refers to the minimum amount of time required for a specific operation or function to be completed. This parameter is crucial in determining the speed and efficiency of the component's performance. It is often specified in datasheets and technical documentation to provide users with information on the component's timing characteristics. Understanding the "Time-Min" parameter is essential for designing and integrating electronic components into circuits to ensure proper functionality and timing synchronization.
SECONDS - Interrupt Capability
Returns the number of interrupts available for a specified hardware device and interrupt type.
Y - Voltage - Supply, Battery
Voltage - Supply, Battery refers to the nominal voltage level provided by a battery to power electronic components or circuits. It indicates the standard voltage output that a battery can deliver under typical operating conditions. This parameter is crucial for ensuring compatibility between the battery and the electronic device, as it affects performance and functionality. The voltage supply rating helps in selecting the appropriate battery for specific applications, ensuring that the device operates efficiently and safely.
1.3V~5.5V - Volatile
In the context of electronic components, the term "Volatile" refers to a type of memory or storage that requires power to maintain the stored data. When power is removed or lost, the data stored in volatile memory is also lost. This is in contrast to non-volatile memory, which retains data even when power is turned off.Volatile memory is commonly used in devices like RAM (Random Access Memory) in computers, where data needs to be quickly accessed and modified. However, it is not suitable for long-term storage of important data as it requires continuous power supply to retain information.Overall, the volatile nature of this type of memory makes it fast and efficient for temporary data storage and processing, but it is not ideal for permanent data storage due to its dependency on power supply.
NO - Information Access Method
Information Access Method refers to the techniques and protocols used to retrieve, manage, and manipulate data stored in electronic systems. It encompasses various approaches such as direct memory access, polling, interrupts, and data buses, enabling efficient communication between different components within a system. This method is crucial for optimizing data retrieval speed and ensuring effective interaction between hardware and software in electronic devices.
I2C - Features
In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.
Alarm, Leap Year, Square Wave Output, SRAM, Unique ID - Length3mm
- Height Seated (Max)
Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.
1.1mm - Width3mm
- Radiation Hardening
Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.
No - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant