Microchip Technology PL123-05SI

Clock Timing IC 3.3V -40°C~85°C Tube Timer IC Chip with 1 Circuits

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

Output characteristics in electronic components refer to the relationship between the output voltage and output current across a range of input conditions. This parameter is essential for understanding how a device, such as a transistor or operational amplifier, behaves under various loads and operating points. It provides insights into the efficiency, performance, and limitations of the component, helping designers to make informed choices for circuits and applications.

In electronic components, "Input" refers to the signal or data that is provided to a device or system for processing or manipulation. It is the information or command that is received by the component to initiate a specific function or operation. The input can come from various sources such as sensors, other electronic devices, or user interactions. It is crucial for the proper functioning of the component as it determines how the device will respond or behave based on the input received. Understanding and managing the input parameters is essential in designing and using electronic components effectively.

The parameter "Ratio - Input:Output" in electronic components refers to the relationship between the input and output quantities of a device or system. It is a measure of how the input signal or energy is transformed or converted into the output signal or energy. This ratio is often expressed as a numerical value or percentage, indicating the efficiency or effectiveness of the component in converting the input to the desired output. A higher ratio typically signifies better performance or higher efficiency, while a lower ratio may indicate losses or inefficiencies in the conversion process. Understanding and optimizing the input-output ratio is crucial in designing and evaluating electronic components for various applications.

PLL stands for Phase-Locked Loop, which is a control system that generates an output signal whose phase is related to the phase of an input signal. It is commonly used in electronic components to synchronize, modulate, demodulate, filter, or recover a signal's frequency. A PLL typically consists of a phase detector, a loop filter, a voltage-controlled oscillator (VCO), and a feedback circuit. The PLL locks the phase of the output signal to the phase of the input signal, making it a versatile tool in various applications such as frequency synthesis, clock recovery, and frequency modulation.

Differential - Input:Output refers to the relationship between the input and output signals in differential amplifiers or circuits. It measures the difference in voltage between two input terminals and produces an output that is proportional to this difference. This parameter is essential for noise rejection and improving signal integrity in various applications, such as operational amplifiers and data acquisition systems. It allows circuits to effectively amplify small signals while minimizing interference and common-mode noise.

Propagation delay (tpd) is a crucial parameter in electronic components, especially in digital circuits. It refers to the time taken for a signal to travel from the input of a component to its output. This delay is caused by various factors such as the internal circuitry, interconnections, and the physical properties of the component. Propagation delay is essential to consider in designing circuits to ensure proper timing and functionality. It is typically measured in nanoseconds or picoseconds and plays a significant role in determining the overall performance and speed of electronic systems.

The parameter "Same Edge Skew-Max (tskwd)" in electronic components refers to the maximum allowable difference in propagation delay between signals that are traveling along the same edge of a component, such as a flip-flop or a register. Skew refers to the timing misalignment between signals, and this parameter sets a limit on how much skew is acceptable for signals that are supposed to arrive at the same time. Exceeding this maximum skew value can lead to timing violations and affect the overall performance and reliability of the electronic system. Designers need to carefully consider and manage skew to ensure proper signal synchronization and timing integrity in their electronic designs.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.