Microchip Technology SY100EP16UKG
Microchip Technology SY100EP16UKG
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Microchip Technology SY100EP16UKG

Specialty Logic 2.375V~3.6V Differential Receiver/Driver Specialty Logic IC 8 Pin

Manufacturer No:

SY100EP16UKG

Utmel No:

1610-SY100EP16UKG

Package:

8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

Datasheet:

SY10/100EP16U

Usage Grade:

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ECAD Model:

Description:

Differential Receiver/Driver -40°C~85°C Specialty Logic IC 100EP Series 100EP16 8 Pin 0.65mm 2.375V~3.6V 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

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In Stock : 18136

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SY100EP16UKG information

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Microchip Technology SY100EP16UKG technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology SY100EP16UKG.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
  • Number of Pins
    8
  • Interface Standards
    GENERAL PURPOSE
  • Usage Level
    Industrial grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    100EP
  • Published
    2008
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    NICKEL PALLADIUM GOLD
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    2.375V~3.6V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    100EP16
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    3.6V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    2.375V
  • Nominal Supply Current

    Nominal current is the same as the rated current. It is the current drawn by the motor while delivering rated mechanical output at its shaft.

    25mA
  • Logic Function

    In electronic components, the term "Logic Function" refers to the specific operation or behavior of a component based on its input signals. It describes how the component processes the input signals to produce the desired output. Logic functions are fundamental to digital circuits and are used to perform logical operations such as AND, OR, NOT, and XOR.Each electronic component, such as logic gates or flip-flops, is designed to perform a specific logic function based on its internal circuitry. By understanding the logic function of a component, engineers can design and analyze complex digital systems to ensure proper functionality and performance. Different logic functions can be combined to create more complex operations, allowing for the creation of sophisticated digital devices and systems.

    Receiver
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    2.5 Gbps
  • Logic Type

    Logic Type in electronic components refers to the classification of circuits based on the logical operations they perform. It includes types such as AND, OR, NOT, NAND, NOR, XOR, and XNOR, each defining the relationship between binary inputs and outputs. The logic type determines how the inputs affect the output state based on specific rules of Boolean algebra. This classification is crucial for designing digital circuits and systems, enabling engineers to select appropriate components for desired functionalities.

    Differential Receiver/Driver
  • Differential Output

    a differential output voltage in electronics is the difference between the values of two AC voltages, 180° out of phase, present at the output terminals of an amplifier when you apply a differential input voltage to the input terminals of an amplifier.

    YES
  • Interface IC Type

    The parameter "Interface IC Type" in electronic components refers to the type of integrated circuit (IC) that is used to facilitate communication between different electronic devices or subsystems. This IC is responsible for managing the exchange of data and control signals between the devices, ensuring proper communication and coordination. The specific type of interface IC used can vary depending on the requirements of the system, such as serial communication (e.g., UART, SPI, I2C), parallel communication, or specialized interfaces like USB or Ethernet. Choosing the appropriate interface IC type is crucial for ensuring compatibility, reliability, and efficiency in electronic systems.

    LINE TRANSCEIVER
  • Driver Number of Bits
    1
  • Receiver Number of Bits
    1
  • Number of Transceivers
    1
  • Receive Delay-Max

    Receive Delay-Max is a parameter in electronic components that refers to the maximum amount of time it takes for a device to receive and process incoming signals or data after they have been transmitted. This parameter is crucial in determining the overall performance and efficiency of the component, especially in applications where timing is critical. A lower Receive Delay-Max value indicates faster response times and better overall performance, while a higher value may result in delays and potential issues in data transmission. It is important to consider and optimize the Receive Delay-Max parameter when designing or selecting electronic components for specific applications to ensure reliable and efficient operation.

    0.33 ns
  • Transmit Delay-Max

    Transmit Delay-Max refers to the maximum time interval it takes for a signal to be transmitted from the input to the output of an electronic component or system. This parameter is critical in digital circuits and communication systems, as it affects the overall performance and timing of data transmission. A lower Transmit Delay-Max indicates faster signal propagation, which is essential for high-speed applications. It is typically specified in nanoseconds or microseconds, depending on the technology and design of the component.

    0.33 ns
  • Height
    920μm
  • Length
    3mm
  • Width
    4.9mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    No SVHC
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Microchip Technology SY100EP16UKG.

SY100EP16UKG Overview

A packaging method that uses Tube is employed.It is included in package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width).2.375V~3.6V is provided to ensure that the device works normally.It is a type of electronic part mounted in the manner of Surface Mount.It operates at a temperature of -40°C~85°C.Electronic components in the 100EP series have many similarities.In addition to its base part number 100EP16, other related parts are available.8 terminations are designed to prevent signals from reflecting off the end of the transmission line.Surface Mount is the way to mount it.For its construction, 8 pins are used.With the minimum supply voltage set to 2.375V, normal use can be maintained.The maximum supply voltage of 3.6V is sufficient for normal use.As far as the interface IC type is concerned, it uses LINE TRANSCEIVER.

SY100EP16UKG Features


SY100EP16UKG Applications

There are a lot of Microchip Technology
SY100EP16UKG Specialty Logic ICs applications.


  • Ethernet circuitry
  • Wired telephone
  • Cordless telephone
  • Desktop PC
  • Notebook
  • Pocket PC
  • Desktop radio
  • Clock radio
  • Tuner
  • Portable radio
The three parts on the right have similar specifications to Microchip Technology & SY100EP16UKG.
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