Microchip Technology SY58032UMG-TR
Microchip Technology SY58032UMG-TR
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Microchip Technology SY58032UMG-TR

Driver QUAD 2.5V 1:8 Clock Buffer

Manufacturer No:

SY58032UMG-TR

Utmel No:

1610-SY58032UMG-TR

Package:

32-VFQFN Exposed Pad, 32-MLF®

Datasheet:

SY58032U

ECAD Model:

Description:

1 Circuit 2.5V 1:8 Clock Buffer QUAD SY58032 Precision Edge® Series 32-VFQFN Exposed Pad, 32-MLF®

Quantity:

Unit Price: $13.614950

Ext Price: $13.61

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In Stock : 7038

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SY58032UMG-TR information

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Microchip Technology SY58032UMG-TR technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology SY58032UMG-TR.
  • Type
    Parameter
  • Factory Lead Time
    8 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    32-VFQFN Exposed Pad, 32-MLF®
  • Number of Pins
    32
  • Frequency(Max)
    4GHz
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Precision Edge®
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    2 (1 Year)
  • Number of Terminations
    32
  • Type
    Fanout Buffer (Distribution)
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    CAN ALSO OPERATE WITH 3.3V SUPPLY
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    2.375V~3.6V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    2.5V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    SY58032
  • Output

    In electronic components, the parameter "Output" typically refers to the signal or data that is produced by the component and sent to another part of the circuit or system. The output can be in the form of voltage, current, frequency, or any other measurable quantity depending on the specific component. The output of a component is often crucial in determining its functionality and how it interacts with other components in the circuit. Understanding the output characteristics of electronic components is essential for designing and troubleshooting electronic circuits effectively.

    LVPECL
  • Number of Outputs
    16
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3V
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    2.625V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    2.375V
  • Number of Circuits
    1
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    330 ps
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    330 ps
  • Input

    In electronic components, "Input" refers to the signal or data that is provided to a device or system for processing or manipulation. It is the information or command that is received by the component to initiate a specific function or operation. The input can come from various sources such as sensors, other electronic devices, or user interactions. It is crucial for the proper functioning of the component as it determines how the device will respond or behave based on the input received. Understanding and managing the input parameters is essential in designing and using electronic components effectively.

    CML, LVDS, LVPECL
  • Ratio - Input:Output

    The parameter "Ratio - Input:Output" in electronic components refers to the relationship between the input and output quantities of a device or system. It is a measure of how the input signal or energy is transformed or converted into the output signal or energy. This ratio is often expressed as a numerical value or percentage, indicating the efficiency or effectiveness of the component in converting the input to the desired output. A higher ratio typically signifies better performance or higher efficiency, while a lower ratio may indicate losses or inefficiencies in the conversion process. Understanding and optimizing the input-output ratio is crucial in designing and evaluating electronic components for various applications.

    1:8
  • Differential - Input:Output

    Differential - Input:Output refers to the relationship between the input and output signals in differential amplifiers or circuits. It measures the difference in voltage between two input terminals and produces an output that is proportional to this difference. This parameter is essential for noise rejection and improving signal integrity in various applications, such as operational amplifiers and data acquisition systems. It allows circuits to effectively amplify small signals while minimizing interference and common-mode noise.

    Yes/Yes
  • fmax-Min

    fmax-Min refers to the frequency range that an electronic component or system can operate within. It represents the difference between the maximum frequency (fmax) and the minimum frequency (Min) limits of operation. This parameter is crucial in defining the bandwidth of the component, indicating how effectively it can transmit or receive signals over that range. A wider fmax-Min value typically signifies better performance for applications that require broad frequency response.

    4000 MHz
  • Same Edge Skew-Max (tskwd)

    The parameter "Same Edge Skew-Max (tskwd)" in electronic components refers to the maximum allowable difference in propagation delay between signals that are traveling along the same edge of a component, such as a flip-flop or a register. Skew refers to the timing misalignment between signals, and this parameter sets a limit on how much skew is acceptable for signals that are supposed to arrive at the same time. Exceeding this maximum skew value can lead to timing violations and affect the overall performance and reliability of the electronic system. Designers need to carefully consider and manage skew to ensure proper signal synchronization and timing integrity in their electronic designs.

    0.02 ns
  • Length
    5mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    0.9mm
  • Width
    5mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for Microchip Technology SY58032UMG-TR.

Product Description

Description

The SY58032UMG-TR from Microchip Technology is a high-performance, surface-mountable fanout buffer designed to distribute clock signals with precision and reliability. This IC is part of the Precision Edge series and is optimized for applications requiring low skew and high frequency operation. It can operate with a 3.3V supply voltage, making it versatile for various electronic systems.

Features

  • High Frequency Operation: The SY58032UMG-TR supports frequencies up to 4GHz, making it suitable for high-speed digital systems.
  • Differential Input/Output: It features differential inputs and outputs, ensuring low noise and high signal integrity.
  • Multiple Input Formats: The IC can handle various input formats including CML, LVDS, and LVPECL.
  • Low Propagation Delay: With a propagation delay of 330 ps, this buffer ensures minimal signal distortion.
  • Low Skew: The same edge skew is maximally 0.02 ns, ensuring that all outputs are synchronized.
  • Lead-Free and RoHS Compliant: The device is lead-free and compliant with ROHS3 standards, ensuring environmental sustainability.
  • Surface Mount Package: Available in a 32-VFQFN exposed pad package for easy surface mounting.

Applications

  1. Primary Applications:
  2. High-speed digital systems requiring precise clock distribution.
  3. Data centers and server farms where low skew and high frequency operation are critical.
  4. Advanced telecommunications equipment needing reliable clock buffering.

  5. Secondary Applications:

  6. Industrial control systems requiring precise timing signals.
  7. Medical devices that need reliable clock distribution for diagnostic equipment.
  8. Automotive systems where high-speed data transmission is essential.

Alternative Parts

If the SY58032UMG-TR is not available or if an alternative solution is needed, consider the following parts from Microchip Technology:

  • SY58032: The base part number without the additional features of the SY58032UMG-TR.
  • Other fanout buffers from the Precision Edge series with similar specifications but different pin counts or package types.

Embedded Modules

The SY58032UMG-TR can be used in various embedded modules designed for high-speed digital applications:

  • FPGA/ASIC Boards: For distributing clock signals within FPGA or ASIC boards.
  • High-Speed Data Acquisition Systems: To ensure precise timing in data acquisition systems.
  • Networking Equipment: In routers, switches, and other networking equipment where low skew and high frequency operation are crucial.

By integrating the SY58032UMG-TR into these modules, designers can achieve reliable and efficient clock distribution in complex electronic systems.

The three parts on the right have similar specifications to Microchip Technology & SY58032UMG-TR.
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