Micron MT62F1536M32D4DS-023 FAAT:B
Micron MT62F1536M32D4DS-023 FAAT:B
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Micron MT62F1536M32D4DS-023 FAAT:B

Memory IC Automotive, AEC-Q100 Memory IC

Manufacturer No:

MT62F1536M32D4DS-023 FAAT:B

Manufacturer:

Micron

Utmel No:

1616-MT62F1536M32D4DS-023 FAAT:B

Package:

200-WFBGA

ECAD Model:

Description:

Automotive, AEC-Q100 Memory IC Automotive, AEC-Q100 Series

Quantity:

Unit Price: $65.255938

Ext Price: $65.26

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 30

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $65.255938

    $65.26

  • 10

    $61.562206

    $615.62

  • 100

    $58.077553

    $5,807.76

  • 500

    $54.790144

    $27,395.07

  • 1000

    $51.688815

    $51,688.82

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
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MT62F1536M32D4DS-023 FAAT:B information

Specifications
Product Details
Micron MT62F1536M32D4DS-023 FAAT:B technical specifications, attributes, parameters and parts with similar specifications to Micron MT62F1536M32D4DS-023 FAAT:B.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    200-WFBGA
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    200-WFBGA (10x14.5)
  • RoHS
    Details
  • Mounting Styles
    SMD/SMT
  • Factory Pack QuantityFactory Pack Quantity
    1050
  • Package
    Box
  • Mfr
    Micron Technology Inc.
  • Product Status
    Active
  • Memory Types
    Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Automotive, AEC-Q100
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    SDRAM - Mobile LPDDR5
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    -
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    48 Gbit
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    4.266 GHz
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    DRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    1.5 G x 32
  • Write Cycle Time - Word, Page

    Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.

    -
  • Memory Organization

    Memory organization in electronic components refers to the way data is stored and accessed within the memory system. It includes the structure and arrangement of memory cells, addressing schemes, data organization, and access methods. The memory organization determines how data is stored in different memory locations, how it is retrieved, and how it is managed. Different types of memory, such as RAM, ROM, and cache memory, have specific memory organizations tailored to their intended functions and performance requirements. Overall, memory organization plays a crucial role in the efficiency and effectiveness of data storage and retrieval in electronic devices.

    1.5G x 32
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MT62F1536M32D4DS-023 FAAT:B Overview

In the case of 200-WFBGA, it is embedded within the case. A memory chip with a capacity of 48 Gbit is used on this device. There is a mainstream memory format used by this device, which is called DRAM-format memory. This device has an extended operating temperature range of -, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of -. As far as the mounting type is concerned, Surface Mount is recommended. In the memory, there is a clock frequency rotation that ranges 4.266 GHz. This part plays an important role in applications that target the Automotive, AEC-Q100 series of memory devices.

MT62F1536M32D4DS-023 FAAT:B Features

Package / Case: 200-WFBGA

MT62F1536M32D4DS-023 FAAT:B Applications

There are a lot of Micron
MT62F1536M32D4DS-023 FAAT:B Memory applications.


  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
MT62F1536M32D4DS-023 FAAT:B Relevant information

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