Micron Technology Inc. MT29F4G08ABADAWP-AITX:D
Micron Technology Inc. MT29F4G08ABADAWP-AITX:D
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Micron Technology Inc. MT29F4G08ABADAWP-AITX:D

Memory IC Memory IC

Manufacturer No:

MT29F4G08ABADAWP-AITX:D

Utmel No:

1616-MT29F4G08ABADAWP-AITX:D

Package:

48-TFSOP (0.724, 18.40mm Width)

Usage Grade:

  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
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ECAD Model:

Description:

Surface Mount Memory IC 4 Gb kb

Quantity:

Unit Price: $7.332945

Ext Price: $7.33

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 2212

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $7.332945

    $7.33

  • 10

    $6.917873

    $69.18

  • 100

    $6.526295

    $652.63

  • 500

    $6.156882

    $3,078.44

  • 1000

    $5.808379

    $5,808.38

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
MT29F4G08ABADAWP-AITX:D information

Specifications
Product Details
Product Comparison
Micron Technology Inc. MT29F4G08ABADAWP-AITX:D technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT29F4G08ABADAWP-AITX:D.
  • Type
    Parameter
  • Factory Lead Time
    4 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    48-TFSOP (0.724, 18.40mm Width)
  • Number of Pins
    48
  • Memory Types
    Non-Volatile
  • Usage Level
    Automotive grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Number of Terminations
    48
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    2.7V~3.6V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    4Gb 512M x 8
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    FLASH
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    512MX8
  • Memory Width

    Memory width refers to the number of bits that can be read or written to memory at one time. It is an important specification in electronic components, particularly in memory devices like RAM and cache. A wider memory width allows for greater data throughput, enabling faster performance as more data can be processed simultaneously. Memory width can vary among different types of memory and can impact both the complexity and efficiency of data handling within electronic systems.

    8
  • Density

    In electronic components, "Density" refers to the mass or weight of a material per unit volume. It is a physical property that indicates how tightly packed the atoms or molecules are within the material. The density of a component can affect its performance and characteristics, such as its strength, thermal conductivity, and electrical properties. Understanding the density of electronic components is important for designing and manufacturing processes to ensure optimal performance and reliability.

    4 Gb
  • Standby Current-Max

    Standby Current-Max refers to the maximum amount of current that an electronic component or device consumes while in a low-power standby mode. This parameter is critical for power management, especially in battery-operated devices, as it indicates how efficiently the device can conserve energy when not actively in use. A lower Standby Current-Max value is typically desirable, as it contributes to longer battery life and reduced energy consumption. Manufacturers specify this value to help engineers select components that meet specific power efficiency requirements in their designs.

    0.0001A
  • Screening Level

    In electronic components, the term "Screening Level" refers to the level of testing and inspection that a component undergoes to ensure its reliability and performance. This process involves subjecting the component to various tests, such as temperature cycling, burn-in, and electrical testing, to identify any defects or weaknesses that could affect its functionality. The screening level is typically determined based on the application requirements and the criticality of the component in the system. Components that undergo higher screening levels are generally more reliable but may also be more expensive. Overall, the screening level helps to ensure that electronic components meet the necessary quality standards for their intended use.

    AEC-Q100
  • Access Time (Max)

    Access Time (Max) is a parameter in electronic components, particularly in memory devices such as RAM (Random Access Memory) and storage devices like hard drives and SSDs (Solid State Drives). It refers to the maximum amount of time it takes for the component to retrieve data after receiving a request. In simpler terms, it measures the speed at which data can be accessed from the component. A lower access time indicates faster performance, as the component can quickly retrieve and deliver data to the system. Manufacturers often specify the maximum access time in the component's datasheet to help users understand its performance capabilities.

    25 ns
  • Data Polling

    Data Polling is a process used in electronic components to retrieve data at regular intervals from a sensor or device. It involves checking or querying the device for updated information, ensuring that the most current data is accessible for processing or analysis. This technique is commonly used in systems where continuous monitoring is necessary, allowing for timely responses based on the latest data collected. Data Polling can impact system performance, as it may introduce delays or consume resources depending on the polling frequency and the efficiency of the implemented protocol.

    NO
  • Toggle Bit

    The toggle bit is a control mechanism in electronic components that allows a circuit to switch between two states, typically representing binary values of 0 and 1. It is commonly used in digital systems to change the status of a device or memory cell each time it is activated. The toggle bit maintains its state until it receives a new signal that alters its value, making it essential for operations such as counters and flip-flops. This functionality enables efficient data storage, retrieval, and manipulation in various electronic applications.

    NO
  • Command User Interface

    The term "Command User Interface" in electronic components refers to the method by which a user interacts with a device or system through issuing commands. This interface allows users to input instructions or requests to control the operation of the electronic component. The Command User Interface can take various forms, such as physical buttons, touchscreens, voice commands, or software-based interfaces. It plays a crucial role in enabling users to interact with and utilize the functionalities of electronic components effectively. The design and implementation of a Command User Interface are essential considerations in ensuring user-friendly and intuitive operation of electronic devices.

    YES
  • Number of Sectors/Size
    4K
  • Sector Size

    Sector size in electronic components refers to the minimum unit of data that can be read or written to the storage device, such as a hard drive or solid-state drive. It represents the smallest amount of data that can be accessed at a time within a storage device. The sector size is typically measured in bytes, with common sizes being 512 bytes or 4 kilobytes.Having a larger sector size can improve the efficiency of data storage and retrieval processes, as it reduces the overhead associated with accessing and managing smaller units of data. However, the choice of sector size can also impact the overall performance and compatibility of the storage device with different systems and applications. It is important to consider the sector size when configuring storage devices and optimizing data access speeds.

    128K
  • Page Size

    In electronic components, "Page Size" refers to the amount of data that can be stored or accessed in a single page of memory. It is a crucial parameter in memory devices such as flash memory, where data is organized into pages for efficient reading and writing operations. The page size determines the granularity at which data can be written or read from the memory, impacting the speed and efficiency of data transfers. Choosing the appropriate page size is important for optimizing performance and storage capacity in electronic devices.

    2kB
  • Ready/Busy

    The "Ready/Busy" parameter in electronic components typically refers to a signal or status indicator that indicates whether a device is ready to accept new commands or data ("Ready") or is currently processing information and unavailable for new tasks ("Busy"). This parameter is commonly found in devices such as microcontrollers, memory modules, and storage devices.When the device is in the "Ready" state, it means that it is idle and can accept new instructions or data inputs. On the other hand, when the device is in the "Busy" state, it indicates that the device is currently engaged in a task and cannot accept new commands until it completes its current operation.Monitoring the "Ready/Busy" status is important for ensuring proper communication and coordination between different components in a system, especially in scenarios where multiple devices need to interact with each other. By checking the "Ready/Busy" status, a system can avoid conflicts and ensure that tasks are executed in a synchronized manner.

    YES
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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MT29F4G08ABADAWP-AITX:D Overview

It comes in a Tray. It is available in 48-TFSOP (0.724, 18.40mm Width) case. The memory size of the chip is 4Gb 512M x 8 Mb. This device utilizes a FLASH format memory which is of mainstream design. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. It is supplied votage within 2.7V~3.6V. Its recommended mounting type is Surface Mount. 48 terminations are planted on the chip. This memory device is enclosed in a 48-pin package. The operating supply voltage of this memory chip is noted to be 3.3V. This chip is configured to use Surface Mount mounting, a straight forward, high-efficiency mounting fashion. This ic memory chip has 4K specifically sized divisions in total.

MT29F4G08ABADAWP-AITX:D Features

Package / Case: 48-TFSOP (0.724, 18.40mm Width)
48 Pins
Operating Supply Voltage:3.3V

MT29F4G08ABADAWP-AITX:D Applications

There are a lot of Micron Technology Inc.
MT29F4G08ABADAWP-AITX:D Memory applications.


  • Cache memory
  • cell phones
  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
The three parts on the right have similar specifications to Micron Technology Inc. & MT29F4G08ABADAWP-AITX:D.
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