Micron Technology Inc. MT53E384M32D2DS-053 AAT:E
Micron Technology Inc. MT53E384M32D2DS-053 AAT:E
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Micron Technology Inc. MT53E384M32D2DS-053 AAT:E

Memory IC Memory IC

Manufacturer No:

MT53E384M32D2DS-053 AAT:E

Utmel No:

1616-MT53E384M32D2DS-053 AAT:E

Package:

200-WFBGA

ECAD Model:

Description:

Memory IC

Quantity:

Unit Price: $9.781463

Ext Price: $9.78

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 21

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $9.781463

    $9.78

  • 10

    $9.227795

    $92.28

  • 100

    $8.705467

    $870.55

  • 500

    $8.212705

    $4,106.35

  • 1000

    $7.747835

    $7,747.84

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
MT53E384M32D2DS-053 AAT:E information

Specifications
Product Details
Micron Technology Inc. MT53E384M32D2DS-053 AAT:E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT53E384M32D2DS-053 AAT:E.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    200-WFBGA
  • Memory Types
    Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~105°C TC
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    0.6V 1.1V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    12Gb 384M x 32
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    1.866GHz
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    DRAM
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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MT53E384M32D2DS-053 AAT:E Overview

It comes in a Tray. It is available in 200-WFBGA case. The memory size of the chip is 12Gb 384M x 32 Mb. This device utilizes a DRAM format memory which is of mainstream design. With an extended designed operating temperature of -40°C~105°C TC, this device is capable of lots of demanding applications. It is supplied votage within 0.6V 1.1V. Its recommended mounting type is Surface Mount. The memory has a clock frequency rotation within 1.866GHz.

MT53E384M32D2DS-053 AAT:E Features

Package / Case: 200-WFBGA

MT53E384M32D2DS-053 AAT:E Applications

There are a lot of Micron Technology Inc.
MT53E384M32D2DS-053 AAT:E Memory applications.


  • Cache memory
  • cell phones
  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications