

MOTOROLA 108A/BGAJC
Manufacturer No:
108A/BGAJC
Tiny WHSLManufacturer:
Utmel No:
1668-108A/BGAJC
Package:
-
Usage Grade:
Military
Description:
108A/BGAJC datasheet pdf and Integrated Circuits (ICs) product details from MOTOROLA stock available at Utmel
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- TypeParameter
- Number of Terminals8
- Manufacturer Part Number108A/BGAJC
- Rohs CodeNo
- Part Life Cycle CodeObsolete
- Ihs ManufacturerMOTOROLA INC
- Risk Rank8.8
- Operating Temperature-Max125 °C
- Operating Temperature-Min-55 °C
- Package Body MaterialMETAL
- Package Equivalence CodeCAN8,.2
- Package ShapeROUND
- Package StyleCYLINDRICAL
- Usage LevelMilitary grade
- JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e0 - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Tin/Lead (Sn/Pb) - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
BOTTOM - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
WIRE - Number of Functions1
- Reach Compliance Code
Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.
unknown - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
O-MBCY-W8 - Qualification Status
An indicator of formal certification of qualifications.
Not Qualified - Power Supplies
an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?
+-5/+-20 V - Temperature Grade
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
MILITARY - Architecture
In electronic components, the parameter "Architecture" refers to the overall design and structure of the component. It encompasses the arrangement of internal components, the layout of circuitry, and the physical form of the component. The architecture of an electronic component plays a crucial role in determining its functionality, performance, and compatibility with other components in a system. Different architectures can result in variations in power consumption, speed, size, and other key characteristics of the component. Designers often consider the architecture of electronic components carefully to ensure optimal performance and integration within a larger system.
VOLTAGE-FEEDBACK - Amplifier Type
Amplifier Type refers to the classification or categorization of amplifiers based on their design, functionality, and characteristics. Amplifiers are electronic devices that increase the amplitude of a signal, such as voltage or current. The type of amplifier determines its specific application, performance capabilities, and operating characteristics. Common types of amplifiers include operational amplifiers (op-amps), power amplifiers, audio amplifiers, and radio frequency (RF) amplifiers. Understanding the amplifier type is crucial for selecting the right component for a particular circuit or system design.
OPERATIONAL AMPLIFIER - Low-Offset
Low-offset is a parameter used to describe the level of offset voltage in electronic components, particularly in operational amplifiers. Offset voltage refers to the small voltage difference that exists between the input terminals of the amplifier when the input voltage is zero. A low-offset value indicates that this voltage difference is minimal, which is desirable for accurate signal processing and amplification. Components with low-offset specifications are preferred in applications where precision and accuracy are critical, such as in instrumentation and measurement systems. Minimizing offset voltage helps reduce errors and ensures the faithful reproduction of input signals by the amplifier.
NO - Frequency Compensation
Frequency compensation is implemented by modifying the gain and phase characteristics of the amplifier's open loop output or of its feedback network, or both, in such a way as to avoid the conditions leading to oscillation. This is usually done by the internal or external use of resistance-capacitance networks.
NO - Screening Level
In electronic components, the term "Screening Level" refers to the level of testing and inspection that a component undergoes to ensure its reliability and performance. This process involves subjecting the component to various tests, such as temperature cycling, burn-in, and electrical testing, to identify any defects or weaknesses that could affect its functionality. The screening level is typically determined based on the application requirements and the criticality of the component in the system. Components that undergo higher screening levels are generally more reliable but may also be more expensive. Overall, the screening level helps to ensure that electronic components meet the necessary quality standards for their intended use.
38535Q/M;38534H;883B - Input Offset Voltage-Max
The parameter "Input Offset Voltage-Max" in electronic components refers to the maximum allowable difference in voltage between the input terminals of an operational amplifier or other analog circuitry before the output is affected. It is a measure of the device's ability to maintain precise and accurate signal processing. A higher Input Offset Voltage-Max value indicates a greater potential for error in the output signal due to input voltage differences. Designers must consider this parameter when selecting components to ensure the desired level of accuracy and performance in their circuits.
1000 µV