National Semiconductor Corporation MM54HC574J/883C
National Semiconductor Corporation MM54HC574J/883C
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National Semiconductor Corporation MM54HC574J/883C

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MM54HC574J/883C

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1704-MM54HC574J/883C

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MM54HC574J/883C information

Specifications
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Product Details
National Semiconductor Corporation MM54HC574J/883C technical specifications, attributes, parameters and parts with similar specifications to National Semiconductor Corporation MM54HC574J/883C.
  • Type
    Parameter
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Terminals
    20
  • Rohs Code
    No
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    NATIONAL SEMICONDUCTOR CORP
  • Package Description
    DIP, DIP20,.3
  • Operating Temperature-Max
    125 °C
  • Operating Temperature-Min
    -55 °C
  • Package Body Material
    CERAMIC
  • Package Code
    DIP
  • Package Equivalence Code
    DIP20,.3
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e0
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Lead (Sn/Pb)
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Number of Functions
    8
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54 mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    compliant
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-XDIP-T20
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    MILITARY
  • Output Characteristics

    Output characteristics in electronic components refer to the relationship between the output voltage and output current across a range of input conditions. This parameter is essential for understanding how a device, such as a transistor or operational amplifier, behaves under various loads and operating points. It provides insights into the efficiency, performance, and limitations of the component, helping designers to make informed choices for circuits and applications.

    3-STATE
  • Logic IC Type

    Logic IC Type refers to the type of integrated circuit (IC) that is specifically designed to perform logical operations. These ICs are commonly used in digital electronic devices to process and manipulate binary data according to predefined logic functions. The Logic IC Type parameter typically specifies the specific logic family or technology used in the IC, such as TTL (Transistor-Transistor Logic), CMOS (Complementary Metal-Oxide-Semiconductor), or ECL (Emitter-Coupled Logic). Understanding the Logic IC Type is important for selecting the appropriate IC for a given application, as different logic families have varying characteristics in terms of speed, power consumption, and noise immunity.

    D FLIP-FLOP
  • Screening Level

    In electronic components, the term "Screening Level" refers to the level of testing and inspection that a component undergoes to ensure its reliability and performance. This process involves subjecting the component to various tests, such as temperature cycling, burn-in, and electrical testing, to identify any defects or weaknesses that could affect its functionality. The screening level is typically determined based on the application requirements and the criticality of the component in the system. Components that undergo higher screening levels are generally more reliable but may also be more expensive. Overall, the screening level helps to ensure that electronic components meet the necessary quality standards for their intended use.

    MIL-STD-883 Class C
  • Trigger Type

    Trigger Type in electronic components refers to the mechanism or method by which a device, such as a flip-flop or timer, responds to an input signal. It defines how the device transitions between states based on specific conditions, such as rising or falling edges of a signal, levels, or pulses. Different trigger types such as edge-triggered, level-triggered, or pulse-triggered influence the timing and behavior of the circuit, thereby determining how input signals affect the output in various applications.

    POSITIVE EDGE
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Download datasheets and manufacturer documentation for National Semiconductor Corporation MM54HC574J/883C.

MM54HC574J/883C Overview

There is a logic IC D FLIP-FLOP used in the system.

MM54HC574J/883C Features


MM54HC574J/883C Applications

There are a lot of National Semiconductor Corporation
MM54HC574J/883C Latches applications.


  • Motor Drives
  • PCs and Notebooks
  • Hammer
  • Parallel data storage
  • Digital bus buffer
  • Flip-flops
  • Parallel data synchronization
  • Parallel data storage
  • Shift register
  • Pattern generators