Nexperia USA Inc. 74LVC2G08GXX
Nexperia USA Inc. 74LVC2G08GXX
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Nexperia USA Inc. 74LVC2G08GXX

Gates & Inverters Gates & Inverters

Manufacturer No:

74LVC2G08GXX

Manufacturer:

Nexperia USA Inc.

Utmel No:

1729-74LVC2G08GXX

Package:

8-XFDFN Exposed Pad

Datasheet:

74LVC2G08

ECAD Model:

Description:

1.35mm mm Gates & Inverters 1.65V~5.5V V

Quantity:

Unit Price: $0.087173

Ext Price: $0.09

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

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In Stock : 126

Minimum: 1 Multiples: 1

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Unit Price

Ext Price

  • 1

    $0.087173

    $0.09

  • 500

    $0.064098

    $32.05

  • 1000

    $0.053415

    $53.42

  • 2000

    $0.049004

    $98.01

  • 5000

    $0.045799

    $229.00

  • 10000

    $0.042603

    $426.03

  • 15000

    $0.041202

    $618.03

  • 50000

    $0.040514

    $2,025.70

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74LVC2G08GXX information

Specifications
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Product Details
Nexperia USA Inc. 74LVC2G08GXX technical specifications, attributes, parameters and parts with similar specifications to Nexperia USA Inc. 74LVC2G08GXX.
  • Type
    Parameter
  • Factory Lead Time
    13 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    8-XFDFN Exposed Pad
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Logic Level-High
    0.95V ~ 3.4V
  • Logic Level-Low
    0.7V ~ 0.8V
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~125°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    74LVC
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    8
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.65V~5.5V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BUTT
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Number of Functions
    2
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    2.3V
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PBCC-B8
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    5.5V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    1.65V
  • Number of Circuits
    2
  • Family

    In electronic components, the parameter "Family" typically refers to a categorization or classification system used to group similar components together based on their characteristics, functions, or applications. This classification helps users easily identify and select components that meet their specific requirements. The "Family" parameter can include various subcategories such as resistors, capacitors, diodes, transistors, integrated circuits, and more. Understanding the "Family" of an electronic component can provide valuable information about its compatibility, performance specifications, and potential uses within a circuit or system. It is important to consider the "Family" parameter when designing or troubleshooting electronic circuits to ensure proper functionality and compatibility with other components.

    LVC/LCX/Z
  • Number of Inputs
    2
  • Logic Type

    Logic Type in electronic components refers to the classification of circuits based on the logical operations they perform. It includes types such as AND, OR, NOT, NAND, NOR, XOR, and XNOR, each defining the relationship between binary inputs and outputs. The logic type determines how the inputs affect the output state based on specific rules of Boolean algebra. This classification is crucial for designing digital circuits and systems, enabling engineers to select appropriate components for desired functionalities.

    AND Gate
  • Max Propagation Delay @ V, Max CL

    The parameter "Max Propagation Delay @ V, Max CL" in electronic components refers to the maximum amount of time it takes for a signal to propagate through the component from input to output when operating at a specific voltage (V) and driving a maximum specified load capacitance (CL). This parameter is crucial in determining the speed and performance of the component in a circuit. A shorter propagation delay indicates faster signal processing and better overall performance. Designers use this parameter to ensure that signals can be transmitted and received within the required timing constraints in their electronic systems.

    4.8ns @ 5V, 50pF
  • Propagation Delay (tpd)

    Propagation delay (tpd) is a crucial parameter in electronic components, especially in digital circuits. It refers to the time taken for a signal to travel from the input of a component to its output. This delay is caused by various factors such as the internal circuitry, interconnections, and the physical properties of the component. Propagation delay is essential to consider in designing circuits to ensure proper timing and functionality. It is typically measured in nanoseconds or picoseconds and plays a significant role in determining the overall performance and speed of electronic systems.

    11.3 ns
  • Current - Quiescent (Max)

    The parameter "Current - Quiescent (Max)" in electronic components refers to the maximum amount of current that a device consumes when it is in a quiescent or idle state. This parameter is important because it indicates the minimum power consumption of the device when it is not actively performing any tasks. It is typically measured in units of amperes (A) and helps in determining the overall power efficiency and battery life of the electronic component. Designers and engineers use this parameter to ensure that the device meets power consumption requirements and operates within specified limits during standby or idle modes.

    4μA
  • Length
    1.35mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    0.35mm
  • Width
    0.8mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Nexperia USA Inc. 74LVC2G08GXX.

Product Description

74LVC2G08GXX - Dual 2-Input AND Gate with 8-Ball Array Package

The 74LVC2G08GXX is a high-performance, low-voltage dual 2-input AND gate integrated circuit (IC) designed by Nexperia USA Inc. This IC is part of the 74LVC family, which is known for its low power consumption and high-speed operation. The device is packaged in an 8-XFDFN exposed pad package, making it suitable for surface mount technology (SMT).

Features

  • Low Power Consumption: The IC has a maximum quiescent current of 4μA, making it ideal for battery-powered devices.
  • High-Speed Operation: With a propagation delay of 11.3 ns, this IC ensures fast switching times.
  • Wide Operating Temperature Range: The device operates between -40°C and 125°C, providing flexibility in various environmental conditions.
  • Compliance with RoHS3: The IC is compliant with RoHS3 standards, ensuring environmental sustainability.
  • Surface Mount Capable: The 8-XFDFN package allows for easy integration into modern SMT designs.

Applications

  1. Primary Applications:
  2. Logic circuits in digital systems.
  3. Microcontroller and microprocessor interfacing.
  4. High-speed data processing applications.

  5. Secondary Applications:

  6. Embedded systems.
  7. Automotive electronics.
  8. Industrial control systems.

Alternative Parts

If the 74LVC2G08GXX is not available, alternative parts can be considered:

  • 74AUC2G08GXX (similar functionality but with different package type).
  • 74LVC2G32GXX (dual 2-input OR gate with similar characteristics).

Embedded Modules

The 74LVC2G08GXX is commonly used in various embedded modules due to its high-speed operation and low power consumption:

  • Microcontroller Boards: Often used in microcontroller boards like Arduino or Raspberry Pi for logic operations.
  • FPGA Designs: Integrated into Field-Programmable Gate Array (FPGA) designs for complex digital logic operations.
  • System-on-Chip (SoC) Designs: Used in SoC designs where low power consumption is crucial.

Summary

The 74LVC2G08GXX is a reliable and efficient dual 2-input AND gate IC suitable for a wide range of digital logic applications. Its low power consumption, high-speed operation, and compliance with RoHS3 standards make it an excellent choice for modern electronics design.