Nexperia USA Inc. 74LVC2G53GD,125

Multiplexers ICs 2.7V SPDT 3.8ns, 3.8ns Analog Switches 8 Pins

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

The center distance from one pole to the next.

Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

a count of all of the component leads (or pins)

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

Operating Supply Current, also known as supply current or quiescent current, is a crucial parameter in electronic components that indicates the amount of current required for the device to operate under normal conditions. It represents the current drawn by the component from the power supply while it is functioning. This parameter is important for determining the power consumption of the component and is typically specified in datasheets to help designers calculate the overall power requirements of their circuits. Understanding the operating supply current is essential for ensuring proper functionality and efficiency of electronic systems.

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

the flight time of packets over the transmission link and is limited by the speed of light.

Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

In electronic components, the term "Logic Function" refers to the specific operation or behavior of a component based on its input signals. It describes how the component processes the input signals to produce the desired output. Logic functions are fundamental to digital circuits and are used to perform logical operations such as AND, OR, NOT, and XOR.Each electronic component, such as logic gates or flip-flops, is designed to perform a specific logic function based on its internal circuitry. By understanding the logic function of a component, engineers can design and analyze complex digital systems to ensure proper functionality and performance. Different logic functions can be combined to create more complex operations, allowing for the creation of sophisticated digital devices and systems.

Supply Type in electronic components refers to the classification of power sources used to operate the component. It indicates whether the component requires DC or AC power, and if DC, specifies the voltage levels such as low, medium, or high. Different supply types can affect the performance, compatibility, and application of the component in electronic circuits. Understanding the supply type is crucial for proper component selection and integration into electronic designs.

In electronic components, "Bandwidth" refers to the range of frequencies over which the component can effectively operate or pass signals without significant loss or distortion. It is a crucial parameter for devices like amplifiers, filters, and communication systems. The bandwidth is typically defined as the difference between the upper and lower frequencies at which the component's performance meets specified criteria, such as a certain level of signal attenuation or distortion. A wider bandwidth indicates that the component can handle a broader range of frequencies, making it more versatile for various applications. Understanding the bandwidth of electronic components is essential for designing and optimizing circuits to ensure proper signal transmission and reception within the desired frequency range.

Supply Current-Max (Isup) refers to the maximum amount of current that an electronic component can draw from its power supply during operation. It represents the peak current demand of the device under normal operating conditions and is critical for ensuring that the power supply can adequately support the component's needs without risking damage or malfunction. This parameter is essential for designing circuits and selecting appropriate power supply units to prevent overloading and ensure reliable performance.

The "On-State Resistance (Max)" parameter in electronic components refers to the maximum resistance exhibited by the component when it is in the fully conducting state. This resistance is typically measured when the component is carrying the maximum specified current. A lower on-state resistance indicates better conductivity and efficiency of the component when it is in the on-state. It is an important parameter to consider when selecting components for applications where low power dissipation and high efficiency are critical factors.

A Multiplexer/Demultiplexer Circuit is an electronic component used in digital circuits to select one of several input signals and route it to a single output. A multiplexer, also known as a "mux," is used to combine multiple input signals into a single output, while a demultiplexer, also known as a "demux," is used to take a single input and route it to one of several possible outputs. These circuits are commonly used in data transmission, communication systems, and digital signal processing applications to efficiently manage and control the flow of data. Multiplexers and demultiplexers play a crucial role in optimizing the use of resources and improving the overall performance of electronic systems.

Off-state Isolation-Nom is a parameter used to measure the level of isolation between two electronic components or circuits when one of them is in the off state. It indicates the ability of the component to prevent unwanted signals or interference from passing through when it is not actively conducting. The parameter is typically expressed in decibels (dB) and is an important consideration in designing and selecting components for applications where isolation between different parts of a circuit is critical to prevent crosstalk or interference. Higher values of Off-state Isolation-Nom indicate better isolation performance, leading to improved overall system reliability and performance.

Current - Leakage (IS(off)) (Max) refers to the maximum amount of current that flows through a device when it is in its off state, meaning it is not conducting or not intended to be active. This parameter is crucial in determining the efficiency of electronic components, especially in battery-operated devices, as higher leakage currents can lead to increased power consumption and reduced battery life. It is typically measured in microamperes (µA) or milliamperes (mA) and helps engineers assess the suitability of a component for low-power applications.

Channel capacitance (CS(off), CD(off)) in electronic components refers to the capacitance associated with the channel of a field-effect transistor (FET) when it is turned off. CS(off) represents the capacitance between the source and the gate of the FET, while CD(off) represents the capacitance between the drain and the gate. These capacitances play a crucial role in determining the high-frequency performance and switching characteristics of the FET. Understanding and controlling these capacitances is essential for optimizing the performance of electronic circuits, especially in high-speed applications where minimizing parasitic capacitances is critical for achieving desired signal integrity and efficiency.

establishes connections between links, on demand and as available, in order to establish an end-to-end circuit between devices.

The parameter "Switch Time (Ton, Toff) (Max)" in electronic components refers to the maximum time it takes for a device to transition between its on and off states. Ton represents the turn-on time, which is the time taken for the device to switch from the off state to the on state, while Toff represents the turn-off time, which is the time taken for the device to switch from the on state to the off state. This parameter is crucial in determining the speed and efficiency of the device's switching operation. A shorter switch time generally indicates faster switching speeds and better performance of the electronic component.

A Charge injection in analog switches and multiplexers is a level change caused by stray capacitance associated with the NMOS and PMOS transistors that make up the analog switch.

In electronic components, "Switching" refers to the process of turning a device on or off, or changing its state from one condition to another. This parameter is crucial in determining the speed and efficiency of a component's operation. It is often measured in terms of switching time, which is the time taken for a device to transition from one state to another. The switching characteristics of a component play a significant role in its overall performance and reliability in electronic circuits.

Voltage - Supply, Single (V+) refers to the positive voltage supply needed for an electronic component to operate. It indicates the range of voltage levels that can be applied to the component from a single power source. This parameter is crucial for determining compatibility with other components in a circuit and ensuring proper functionality. It typically defines the minimum and maximum voltage limits within which the device can safely and effectively operate.

Signal Current-Max is a parameter in electronic components that specifies the maximum current that can safely flow through the component while maintaining proper functionality. This parameter is crucial for ensuring the component's reliability and preventing damage due to excessive current flow. It is important to adhere to the Signal Current-Max rating to avoid overheating, performance degradation, or even permanent failure of the component. Manufacturers provide this specification to help users operate the component within safe limits and optimize its performance in various electronic circuits.

Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.