NTE ELECT 47-23148-CL

In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Shelf life in electronic components refers to the duration that a component can remain in storage under recommended conditions without significant degradation in its performance or reliability. It is an important factor for manufacturers and users, as prolonged storage may lead to changes in the material properties or functionality of the component. Typically, shelf life is specified for components such as capacitors, resistors, and semiconductors to ensure they perform as intended when implemented in electronic systems. Proper storage conditions, including temperature and humidity control, are crucial to preserving the shelf life of electronic components.

The parameter "Storage/Refrigeration Temperature" in electronic components refers to the recommended temperature range at which the components should be stored to maintain their integrity and functionality. This parameter indicates the temperature limits within which the components can be safely stored without risking damage or degradation. Storage temperature is crucial for preserving the performance and reliability of electronic components over time, especially for sensitive components such as integrated circuits and semiconductors. Refrigeration temperature may be specified for certain components that require lower temperatures to prevent degradation or prolong shelf life. It is important to adhere to the recommended storage/refrigeration temperature guidelines to ensure the longevity and proper functioning of electronic components.

Shelf Life Start refers to the point in time when the shelf life of an electronic component begins. The shelf life is the duration for which a component can be stored under specific conditions and still meet its performance specifications. The Shelf Life Start is typically marked by the date of manufacture or the date when the component is packaged and sealed. It is important to adhere to the specified shelf life guidelines to ensure the reliability and functionality of electronic components, especially in critical applications where performance is crucial.

The shrinkage ratio in electronic components refers to the ratio of the original size of a component to its reduced size after a specific process, such as heat treatment or molding. This parameter is commonly used in the manufacturing of components like heat shrink tubing or molded plastic parts. The shrinkage ratio is important to consider to ensure that the final dimensions of the component meet the required specifications after the shrinking process. It is typically expressed as a percentage or a decimal value, indicating how much the component will shrink in size relative to its original dimensions.

Common polyolefin materials have a recommended shrink temperature of around 9°C, although other materials offer shrink temperatures, notably Teflon, as high as 25°C.

In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

The "Shrink Ratio" in electronic components refers to the ratio of the original size of a component to its final size after a shrinking process. This parameter is commonly associated with heat shrink tubing, which is a type of insulation material used to protect and cover wires, cables, and other components. The shrink ratio is typically expressed as a numerical value, such as 2:1 or 3:1, indicating how much the tubing will shrink in size when heat is applied.For example, a heat shrink tubing with a shrink ratio of 2:1 will reduce to half of its original diameter when heated. This property allows the tubing to tightly conform to the shape of the component it is covering, providing insulation, protection, and strain relief. It is important to select the appropriate shrink ratio for the application to ensure a secure and effective fit.

In electronic components, the parameter "Diameter" typically refers to the measurement of the width of a circular component, such as a resistor, capacitor, or inductor. It is a crucial dimension that helps determine the physical size and fit of the component within a circuit or on a circuit board. The diameter is usually measured in millimeters (mm) or inches (in) and is important for ensuring proper placement and soldering of the component during assembly. Understanding the diameter of electronic components is essential for selecting the right size for a specific application and ensuring compatibility with other components and the overall design of the circuit.

Recovered Wall Thickness refers to the thickness of the insulation material that remains on an electronic component after the recovery process, typically involving heat application. It is a critical measurement that ensures the electrical integrity and performance of the component by providing adequate insulation and protection against environmental factors. This parameter also influences the overall durability and reliability of the component in various applications.