NXP USA Inc. 74AHCT241D,118

DUAL Buffer, Non-Inverting 4.5V~5.5V 3-State Buffers 74AHCT Series 74AHCT241 4 Bit per Element 20-SOIC (0.295, 7.50mm Width)

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.

Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

An indicator of formal certification of qualifications.

The "Output Type" parameter in electronic components refers to the type of signal or data that is produced by the component as an output. This parameter specifies the nature of the output signal, such as analog or digital, and can also include details about the voltage levels, current levels, frequency, and other characteristics of the output signal. Understanding the output type of a component is crucial for ensuring compatibility with other components in a circuit or system, as well as for determining how the output signal can be utilized or processed further. In summary, the output type parameter provides essential information about the nature of the signal that is generated by the electronic component as its output.

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

the amount of capacitance measured or computed across the crystal terminals on the PCB. Frequency Tolerance. Frequency tolerance refers to the allowable deviation from nominal, in parts per million (PPM), at a specific temperature, usually +25°C.

Logic Type in electronic components refers to the classification of circuits based on the logical operations they perform. It includes types such as AND, OR, NOT, NAND, NOR, XOR, and XNOR, each defining the relationship between binary inputs and outputs. The logic type determines how the inputs affect the output state based on specific rules of Boolean algebra. This classification is crucial for designing digital circuits and systems, enabling engineers to select appropriate components for desired functionalities.

Output polarity in electronic components refers to the orientation of the output signal in relation to the ground or reference voltage. It indicates whether the output voltage is positive or negative with respect to the ground. Positive output polarity means the signal is higher than the ground potential, while negative output polarity signifies that the signal is lower than the ground. This characteristic is crucial for determining compatibility with other components in a circuit and ensuring proper signal processing.

Max I(ol) refers to the maximum output current that a specific electronic component, such as a transistor or integrated circuit, can sink or source. This parameter is crucial in determining the capability of the component to drive external loads without being damaged. It is typically specified in the component's datasheet and is important for ensuring proper operation and reliability of the circuit in which the component is used. Designers must ensure that the output current requirements of the circuit do not exceed the specified "Max I(ol)" value to prevent overloading and potential failure of the component.

Control Type in electronic components refers to the method used to regulate or manipulate an electronic system's behavior or output. It can indicate whether the component operates in an analog or digital manner, and may include types such as on/off, proportional, or pulse-width modulation. Understanding the control type is crucial for determining how components interact with each other and the overall system's functionality.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.