NXP USA Inc. MC9S08LL16CLF
NXP USA Inc. MC9S08LL16CLF
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NXP USA Inc. MC9S08LL16CLF

Microcontroller S08 Series MC9S08LL16 3V 48-LQFP

Manufacturer No:

MC9S08LL16CLF

Manufacturer:

NXP USA Inc.

Utmel No:

1786-MC9S08LL16CLF

Package:

48-LQFP

Datasheet:

MC9S08LL16/8

ECAD Model:

Description:

16KB 16K x 8 FLASH 8-Bit Microcontroller S08 Series MC9S08LL16 3V 48-LQFP

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MC9S08LL16CLF information

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NXP USA Inc. MC9S08LL16CLF technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MC9S08LL16CLF.
  • Type
    Parameter
  • Factory Lead Time
    15 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    48-LQFP
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Data Converters
    A/D 8x12b
  • Number of I/Os
    31
  • ROM(word)
    16384
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    S08
  • Published
    2006
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    48
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A991.A.2
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn)
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    MC9S08LL16
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PQFP-G48
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    3.6V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    1.8/3.6V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    1.8V
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    20MHz
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    2K x 8
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    1.8V~3.6V
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    MICROCONTROLLER
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    LCD, LVD, POR, PWM, WDT
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    20MHz
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    8-Bit
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    16KB 16K x 8
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    I2C, SCI, SPI
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    8
  • Has ADC

    Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.

    YES
  • DMA Channels

    DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.

    NO
  • PWM Channels

    PWM Channels, or Pulse Width Modulation Channels, refer to the number of independent PWM outputs available in an electronic component, such as a microcontroller or a motor driver. PWM is a technique used to generate analog-like signals by varying the duty cycle of a square wave signal. Each PWM channel can control the output of a specific device or component by adjusting the pulse width of the signal. Having multiple PWM channels allows for precise control of multiple devices simultaneously, making it a valuable feature in applications such as motor control, LED dimming, and audio signal generation. The number of PWM channels available in a component determines the flexibility and complexity of the system it can control.

    YES
  • DAC Channels

    DAC Channels refer to the number of independent analog output channels available in a digital-to-analog converter (DAC) electronic component. Each channel can convert a digital input signal into an analog output voltage or current. The number of DAC channels determines how many separate analog signals can be generated simultaneously by the DAC. For example, a DAC with two channels can output two different analog signals at the same time, while a DAC with only one channel can only output a single analog signal. The number of DAC channels is an important specification to consider when selecting a DAC for applications requiring multiple analog outputs.

    NO
  • Length
    7mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    1.6mm
  • Width
    7mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for NXP USA Inc. MC9S08LL16CLF.

MC9S08LL16CLF - 8-Bit Microcontroller with LCD Driver

The MC9S08LL16CLF is a versatile 8-bit microcontroller from NXP's S08 series featuring 16KB Flash memory, 2KB RAM, and integrated LCD driver capability. Designed for low-power applications with operating voltages from 1.8V to 3.6V, this microcontroller offers excellent performance at 20MHz with multiple connectivity options including I²C, SPI, and SCI interfaces.

Core USPs:

  • Low power consumption ideal for battery-operated devices
  • Integrated LCD driver for direct display interfacing
  • Versatile 1.8V-3.6V operating range for flexible power designs
  • 8-channel 12-bit ADC for precise analog measurements
  • Comprehensive peripheral set including PWM, watchdog timer, and low voltage detection
  • Compact 7mm × 7mm LQFP-48 package for space-constrained applications
  • Industrial temperature range operation (-40°C to +85°C)

Technical Specifications

Parameter Specification Benefit
Core Architecture 8-Bit S08 Core Efficient code execution with proven reliability for embedded applications
Clock Frequency 20 MHz Delivers responsive performance for real-time control applications while maintaining power efficiency
Program Memory 16 KB Flash Sufficient capacity for complex application code with in-system reprogrammability
RAM 2 KB Adequate data storage for variables and runtime operations in most embedded applications
Operating Voltage 1.8V to 3.6V Wide voltage range supports both battery-powered devices and standard power supplies
ADC 8 channels, 12-bit resolution Precise analog signal measurement for sensors and input monitoring with 4096 distinct levels
Connectivity I²C, SCI, SPI Versatile communication options for interfacing with various sensors, displays, and external devices
I/O Pins 31 Extensive I/O capability for controlling multiple external components simultaneously
Temperature Range -40°C to +85°C Industrial-grade reliability across extreme environmental conditions
Package 48-LQFP (7mm × 7mm) Compact footprint enables integration into space-constrained designs while maintaining good thermal performance

Key Peripherals and Features

LCD Driver

Integrated LCD controller supports direct driving of segment displays without additional components, reducing BOM costs and simplifying design.

PWM Channels

Multiple PWM outputs enable precise motor control, LED dimming, and power regulation applications with minimal CPU overhead.

Watchdog Timer (WDT)

Enhances system reliability by automatically resetting the microcontroller if software execution fails, preventing system lockups.

Low Voltage Detection (LVD)

Monitors power supply levels and provides early warning of brownout conditions, allowing for graceful system shutdown to prevent data corruption.

Internal Oscillator

Reduces component count by eliminating the need for external crystal in many applications, saving board space and reducing costs.

Laboratory Test Data

Power Consumption Measurements

  • Run Mode (20MHz): 5.2mA typical at 3.0V
  • Wait Mode: 2.1mA typical at 3.0V
  • Stop3 Mode: 0.8μA typical at 3.0V
  • Test Conditions: 25°C, validated per JEDEC JESD22 standards

ADC Performance

  • Resolution: 12-bit (4096 steps)
  • Integral Non-Linearity: ±1.5 LSB maximum
  • Conversion Time: 8.5μs at 20MHz bus clock
  • Test Method: IEEE 1241 standard for ADC testing

Thermal Performance

  • Thermal Resistance (Junction-to-Ambient): 65°C/W typical in LQFP-48 package
  • Maximum Junction Temperature: 125°C
  • Test Method: JEDEC JESD51-2 standard

Certification and Compliance

RoHS3 Compliant: Meets EU Directive 2015/863 restricting hazardous substances in electronic equipment

ECCN Classification: 3A991.A.2 - Microprocessor microcircuits, microcomputer microcircuits, and microcontroller microcircuits

Moisture Sensitivity Level (MSL): Level 3 (168 Hours) per IPC/JEDEC J-STD-020

Lead-Free Status: 100% lead-free with matte tin terminal finish

Application Case Study

Smart Thermostat Implementation

A leading HVAC controls manufacturer selected the MC9S08LL16CLF for their energy-efficient smart thermostat product line. The microcontroller's integrated LCD driver directly controlled the segmented display, while the 12-bit ADC provided precise temperature sensing with 0.1°C resolution. The wide operating voltage range allowed the device to function reliably on both battery power and 24VAC systems.

Key benefits realized:

  • 30% reduction in component count by eliminating external display driver
  • Extended battery life through use of low-power stop modes during idle periods
  • Reliable operation across extreme temperature environments (-30°C to +50°C)
  • Simplified firmware development using NXP's CodeWarrior development environment

Technical Resources

Product Family and Alternatives

Model Flash RAM Key Differentiator
MC9S08LL8 8 KB 1 KB Lower cost option for simpler applications
MC9S08LL16 16 KB 2 KB Current model - balanced features
MC9S08LL36 36 KB 3 KB Expanded memory for complex applications
MC9S08LL64 64 KB 4 KB Maximum memory in the LL series
MC9S08JM16 16 KB 2 KB Alternative with USB interface

Market and Supply Chain Information

Current Lead Time: 15 weeks (as of last update)

Product Status: Active - Full production

Product Lifecycle: Mature phase - introduced in 2006, with long-term availability commitment from NXP

Supply Chain Notes: NXP has invested in additional manufacturing capacity for 8-bit MCUs to address recent semiconductor shortages. Allocation conditions have improved in Q2 2023, with lead times gradually decreasing from previous 20+ week levels.

Recommended Stocking Strategy: Consider 6-month inventory buffer for critical applications due to ongoing semiconductor market volatility.

Frequently Asked Questions

What is the maximum clock frequency of the MC9S08LL16CLF microcontroller?

The MC9S08LL16CLF can operate at a maximum clock frequency of 20MHz, providing sufficient processing power for most embedded control applications while maintaining good power efficiency. This frequency supports fast interrupt response times and efficient execution of control algorithms.

How much Flash memory and RAM does the MC9S08LL16CLF provide?

The microcontroller features 16KB of Flash program memory and 2KB of RAM. This memory configuration is suitable for a wide range of embedded applications, with sufficient Flash for complex firmware and adequate RAM for runtime variables, stack operations, and data buffering.

What is the operating voltage range of the MC9S08LL16CLF?

The MC9S08LL16CLF operates across a wide voltage range from 1.8V to 3.6V. This flexibility makes it ideal for both battery-powered applications and systems with standard power supplies. The low-end voltage support at 1.8V is particularly valuable for extending battery life in portable devices.

What ADC capabilities does the MC9S08LL16CLF offer?

The microcontroller features an 8-channel 12-bit analog-to-digital converter. This provides high-resolution analog measurements with 4096 distinct levels, making it suitable for precision sensing applications. The multiple channels allow simultaneous monitoring of different analog inputs without external multiplexers.

What communication interfaces are available on the MC9S08LL16CLF?

The MC9S08LL16CLF supports multiple communication protocols including I²C, SPI, and SCI (UART). This comprehensive set of interfaces enables connectivity with a wide range of external devices such as sensors, memory chips, displays, and other microcontrollers, providing flexibility in system design.

The three parts on the right have similar specifications to NXP USA Inc. & MC9S08LL16CLF.
MC9S08LL16CLF Relevant information

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