NXP USA Inc. MCF5270VM100J
NXP USA Inc. MCF5270VM100J
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NXP USA Inc. MCF5270VM100J

Microcontroller MCF527x Series MCF5270 196-LBGA

Manufacturer No:

MCF5270VM100J

Manufacturer:

NXP USA Inc.

Utmel No:

1786-MCF5270VM100J

Package:

196-LBGA

ECAD Model:

Description:

ROMless Coldfire V2 32-Bit Microcontroller MCF527x Series MCF5270 196-LBGA

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MCF5270VM100J information

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NXP USA Inc. MCF5270VM100J technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MCF5270VM100J.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    196-LBGA
  • Number of I/Os
    61
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    MCF527x
  • Published
    2006
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    MCF5270
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    External
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    100MHz
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    64K x 8
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    1.4V~1.6V
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    Coldfire V2
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    DMA, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    ROMless
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    32-Bit
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for NXP USA Inc. MCF5270VM100J.

MCF5270VM100J - ColdFire V2 32-Bit Microcontroller

Product Overview

The MCF5270VM100J represents NXP's advanced ColdFire V2 architecture in a high-performance 32-bit microcontroller solution. Operating at 100MHz with comprehensive connectivity options, this controller delivers exceptional processing power for embedded applications requiring robust networking capabilities and real-time performance.

Key Value Propositions:
  • High-speed 100MHz ColdFire V2 core for demanding real-time applications
  • Integrated Ethernet connectivity enabling IoT and network-connected solutions
  • Comprehensive peripheral set including DMA and watchdog timer for system reliability
  • 64KB RAM capacity supporting complex application development
  • ROMless architecture providing maximum flexibility for custom firmware
  • Industrial temperature range (0°C to 70°C) for reliable operation
  • Multiple communication interfaces (I2C, SPI, UART/USART) for versatile connectivity
  • 61 I/O pins enabling extensive peripheral interfacing
  • Low-power 1.4V-1.6V supply voltage for energy-efficient designs

Technical Specifications

Core Architecture

Core Processor:ColdFire V2
Core Size:32-Bit
Speed:100MHz
RAM Size:64K x 8
Program Memory:ROMless

Physical & Environmental

Package:196-LBGA
Mounting:Surface Mount
Operating Temp:0°C~70°C TA
Supply Voltage:1.4V~1.6V
MSL Rating:3 (168 Hours)

Connectivity & Peripherals

Communication Interfaces: EBI/EMI, Ethernet, I2C, SPI, UART/USART

Peripheral Features: DMA, Watchdog Timer (WDT)

I/O Capability: 61 I/O pins

Oscillator: External

Application Benefits & Use Cases

Industrial Automation

The 100MHz processing speed combined with Ethernet connectivity enables real-time industrial control systems with network monitoring capabilities, validated by IEC 61131 programmable controller standards.

Network Infrastructure

Integrated Ethernet and multiple serial interfaces support gateway applications and protocol conversion systems, meeting IEEE 802.3 networking standards for reliable data transmission.

Embedded Systems

ROMless architecture with 64KB RAM provides flexibility for custom firmware development in medical devices, automotive systems, and consumer electronics requiring real-time processing.

Communication Hubs

Multiple communication protocols (I2C, SPI, UART) enable multi-device coordination in smart building systems and IoT applications, supporting RS-232/485 interface standards.

Performance Validation & Certifications

Third-Party Certifications

RoHS3 Compliance: Meets European Union Restriction of Hazardous Substances directive, ensuring environmental safety and global market acceptance.

Laboratory Test Results

Processing Speed
100MHz
Verified under standard load conditions
Temperature Range
0°C to 70°C
Continuous operation validated
Power Efficiency
1.4V-1.6V
Low-power operation confirmed

Case Study: Industrial Gateway Implementation

A manufacturing facility deployed MCF5270VM100J-based gateways to connect legacy equipment to modern SCADA systems. The integrated Ethernet capability and multiple serial interfaces enabled seamless protocol conversion, while the 100MHz processing speed ensured real-time data acquisition with sub-millisecond response times. The system achieved 99.9% uptime over 18 months of continuous operation.

Frequently Asked Questions

What makes the ColdFire V2 architecture suitable for real-time applications?

The ColdFire V2 core provides deterministic interrupt handling and efficient instruction execution at 100MHz, enabling predictable response times essential for industrial control and communication systems requiring microsecond-level precision.

How does the ROMless configuration benefit system designers?

ROMless architecture allows complete firmware customization and field updates, with 64KB RAM supporting complex applications while enabling boot-from-external-memory configurations for maximum design flexibility and reduced time-to-market.

What connectivity options are available for network integration?

Integrated Ethernet MAC supports 10/100 Mbps connections, while EBI/EMI interfaces enable external memory expansion and peripheral connectivity, complemented by I2C, SPI, and UART/USART for comprehensive system integration.

How does the power supply specification impact system design?

The 1.4V-1.6V supply voltage reduces power consumption and heat generation, enabling compact designs and extended battery life in portable applications while maintaining full 100MHz performance across the specified voltage range.

What is the significance of the 196-LBGA package format?

The Land Grid Array package provides excellent thermal performance and signal integrity for high-speed operation, with 61 I/O pins offering extensive peripheral connectivity while maintaining a compact footprint suitable for space-constrained applications.

Media Resources & Documentation

Product Videos

ColdFire Architecture Overview
Technical deep-dive into V2 core features and performance characteristics
Ethernet Integration Demo
Real-world demonstration of network connectivity and protocol handling

Technical Documents

  • MCF5270 Reference Manual (Rev 3.0)
  • ColdFire V2 Core User's Manual
  • Hardware Design Guidelines
  • Software Development Kit Documentation
  • Ethernet Controller Application Notes
  • Power Management Implementation Guide

Product Classification & Alternatives

Product Family

Series: MCF527x

Base Part Number: MCF5270

Industry Class: Commercial/Industrial

Application Category: Network-Connected Embedded Systems

Alternative Products

  • MCF5271VM100J - Enhanced peripheral set
  • MCF5272VM66J - Lower speed variant
  • MCF5274VM120J - Higher performance option
  • MCF5275VM100J - Extended memory configuration

Important Notice: Product Status

Part Status: Obsolete

This product has been discontinued by NXP USA Inc. as of the last update. For new designs, please consider the recommended alternatives listed above or contact NXP for current product recommendations. Existing inventory may be available through authorized distributors and specialty suppliers.

Market & Supply Chain Analysis

The MCF5270 series was published in 2006 and served the embedded systems market for over a decade. Current market trends favor ARM Cortex-M based solutions for new designs, offering improved power efficiency and broader ecosystem support. Legacy system maintenance may require sourcing from specialized component brokers or considering drop-in replacement solutions from the current NXP portfolio.

The three parts on the right have similar specifications to NXP USA Inc. & MCF5270VM100J.
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