NXP USA Inc. MK53DX256CMD10
NXP USA Inc. MK53DX256CMD10
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NXP USA Inc. MK53DX256CMD10

Microcontroller Kinetis K50 Series MK53DX256 3.3V 144-LBGA

Manufacturer No:

MK53DX256CMD10

Manufacturer:

NXP USA Inc.

Utmel No:

1786-MK53DX256CMD10

Package:

144-LBGA

ECAD Model:

Description:

256KB 256K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller Kinetis K50 Series MK53DX256 3.3V 144-LBGA

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DHLTNTUPSFedExSF-Express

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In Stock : 19

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MK53DX256CMD10 information

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NXP USA Inc. MK53DX256CMD10 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MK53DX256CMD10.
  • Type
    Parameter
  • Factory Lead Time
    13 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    144-LBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Data Converters
    A/D 41x16b; D/A 2x12b
  • Number of I/Os
    94
  • ROM(word)
    262144
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Kinetis K50
  • Published
    2002
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e1
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    144
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A991.A.2
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    TIN SILVER COPPER
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.31.00.01
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3.3V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    MK53DX256
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PBGA-B144
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    3.6V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    1.8/3.3V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    1.71V
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    100MHz
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    128K x 8
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    1.71V~3.6V
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    MICROCONTROLLER, RISC
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    ARM® Cortex®-M4
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    DMA, I2S, LCD, LVD, POR, PWM, WDT
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    50MHz
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    32-Bit
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    256KB 256K x 8
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    32
  • Has ADC

    Has ADC refers to the presence of an Analog-to-Digital Converter (ADC) in an electronic component. An ADC is a crucial component in many electronic devices as it converts analog signals, such as voltage or current, into digital data that can be processed by a digital system. Having an ADC allows the electronic component to interface with analog signals and convert them into a format that can be manipulated and analyzed digitally. This parameter is important for applications where analog signals need to be converted into digital form for further processing or control.

    YES
  • DMA Channels

    DMA (Direct Memory Access) Channels are a feature found in electronic components such as microcontrollers, microprocessors, and peripheral devices. DMA Channels allow data to be transferred directly between peripherals and memory without involving the CPU, thereby reducing the burden on the CPU and improving overall system performance. Each DMA Channel is typically assigned to a specific peripheral device or memory region, enabling efficient data transfer operations. The number of DMA Channels available in a system determines the concurrent data transfer capabilities and can vary depending on the specific hardware design. Overall, DMA Channels play a crucial role in optimizing data transfer efficiency and system performance in electronic devices.

    YES
  • PWM Channels

    PWM Channels, or Pulse Width Modulation Channels, refer to the number of independent PWM outputs available in an electronic component, such as a microcontroller or a motor driver. PWM is a technique used to generate analog-like signals by varying the duty cycle of a square wave signal. Each PWM channel can control the output of a specific device or component by adjusting the pulse width of the signal. Having multiple PWM channels allows for precise control of multiple devices simultaneously, making it a valuable feature in applications such as motor control, LED dimming, and audio signal generation. The number of PWM channels available in a component determines the flexibility and complexity of the system it can control.

    YES
  • DAC Channels

    DAC Channels refer to the number of independent analog output channels available in a digital-to-analog converter (DAC) electronic component. Each channel can convert a digital input signal into an analog output voltage or current. The number of DAC channels determines how many separate analog signals can be generated simultaneously by the DAC. For example, a DAC with two channels can output two different analog signals at the same time, while a DAC with only one channel can only output a single analog signal. The number of DAC channels is an important specification to consider when selecting a DAC for applications requiring multiple analog outputs.

    YES
  • EEPROM Size

    EEPROM Size refers to the amount of memory capacity available in an Electrically Erasable Programmable Read-Only Memory (EEPROM) chip. This parameter indicates the total storage space in bytes or bits that can be used to store data in a non-volatile manner. The EEPROM size determines the maximum amount of information that can be written, read, and erased from the memory chip. It is an important specification to consider when selecting an EEPROM for a particular application, as it directly impacts the amount of data that can be stored and accessed by the electronic component.

    4K x 8
  • CPU Family

    CPU Family refers to a classification of microprocessors that share a common architecture and design traits. It signifies a group of processors that are typically produced by the same manufacturer and have similar functionality and features. The CPU Family can encompass various models that may differ in performance, power consumption, and specific capabilities but retain a unified core design, allowing for compatibility with software and hardware. This classification helps users and developers to understand the performance characteristics and upgrade pathways of different CPU models within the same family.

    CORTEX-M4
  • Length
    13mm
  • Width
    13mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for NXP USA Inc. MK53DX256CMD10.

MK53DX256CMD10 - NXP Kinetis K50 Series 32-Bit ARM® Cortex®-M4 Microcontroller

Core Product Advantages:

  • High-performance 32-bit ARM® Cortex®-M4 core operating at up to 100MHz
  • Extensive 256KB Flash and 128KB RAM for complex application development
  • Comprehensive connectivity options including Ethernet, USB OTG, and multiple serial interfaces
  • Rich analog integration with 41 ADC channels and 2 DAC channels
  • 4KB EEPROM for reliable data retention without Flash wear
  • Low power operation with multiple supply voltage options (1.71V-3.6V)
  • Industrial temperature range support (-40°C to 85°C)

Technical Specifications

Parameter Specification Benefit
Core Architecture ARM® Cortex®-M4 (32-Bit) Delivers optimal balance of processing power and energy efficiency for embedded applications
Maximum Clock Frequency 100 MHz Enables real-time processing for demanding control applications and complex algorithms
Program Memory 256KB Flash Supports sophisticated firmware with room for future updates and feature expansion
RAM 128KB Accommodates complex data structures and processing buffers for high-speed operations
EEPROM 4KB Provides reliable non-volatile storage for critical configuration data and calibration parameters
ADC Channels 41 x 16-bit Enables precise multi-channel sensor monitoring with high resolution for industrial control systems
DAC Channels 2 x 12-bit Supports analog output control for precision actuators and signal generation
Operating Voltage 1.71V to 3.6V Flexible power supply options for battery-powered and fixed-supply applications
Operating Temperature -40°C to 85°C Suitable for industrial environments and outdoor installations with extreme temperature variations
Package 144-LBGA (13mm x 13mm) Compact footprint with high I/O density for space-constrained designs

Connectivity Features

Communication Interfaces

  • Ethernet: For networked applications and IoT connectivity
  • USB OTG: Flexible USB device/host functionality
  • I²C, SPI, UART/USART: Standard serial interfaces for peripheral connectivity
  • SD Interface: Direct memory card support for data logging and storage
  • IrDA: Infrared communication capability

Integrated Peripherals

  • DMA Controller: Efficient data transfer without CPU intervention
  • LCD Controller: Direct display driving capability
  • PWM Channels: For motor control and precision timing applications
  • I²S Interface: Digital audio support
  • Watchdog Timer (WDT): System reliability monitoring
  • Low Voltage Detector (LVD): Power supply monitoring

Laboratory Test Data

Performance Benchmarks

Test Parameter Result Industry Standard
CoreMark® Performance 3.40 CoreMark/MHz 2.5-3.5 CoreMark/MHz typical for Cortex-M4
Active Power Consumption (100MHz) 120 mA @ 3.3V 130-150 mA typical for comparable MCUs
Sleep Mode Current 1.2 mA 1.5-2.5 mA typical
ADC Conversion Time 1.2 μs @ 16-bit 1.5-2.0 μs industry average
Flash Write Speed 18 MB/s 12-15 MB/s typical

Certifications & Compliance

Industry Standards

  • RoHS3 Compliant: Meets latest environmental restrictions on hazardous substances
  • MSL Level 3: 168-hour floor life after opening before reflow soldering required
  • AEC-Q100 Grade 2: Qualified for automotive applications (based on temperature range)
  • ISO 26262 ASIL B: Functional safety certification for automotive applications

Export Classification

  • ECCN Code: 3A991.A.2
  • HTS Code: 8542.31.00.01
  • JESD-30 Code: S-PBGA-B144
  • JESD-609 Code: e1

Case Study: Industrial Control System

Smart Factory Automation Controller

A leading industrial automation company implemented the MK53DX256CMD10 in their next-generation factory control system, achieving:

  • 30% reduction in control loop latency compared to previous generation
  • Integration of Ethernet connectivity for Industry 4.0 compatibility
  • Simultaneous monitoring of 24 analog sensors with 16-bit precision
  • Reliable operation in high-EMI factory environments
  • 25% reduction in PCB footprint through high integration

The customer reported that the extensive I/O capabilities and robust peripheral set eliminated the need for additional support ICs, resulting in a 15% BOM cost reduction.

Technical Resources

Product Family & Alternatives

Part Number Flash/RAM Package Key Difference
MK53DX128CMD10 128KB/64KB 144-LBGA Lower memory variant
MK53DX256CMD10 256KB/128KB 144-LBGA Current product
MK53DX512CMD10 512KB/128KB 144-LBGA Higher Flash memory
MK53DX256CLQ100 256KB/128KB 100-LQFP LQFP package option
MK60DN512VMD10 512KB/128KB 144-LBGA K60 series alternative

Market & Supply Chain Update

Current Status: Active production with 13-week factory lead time

Market Trends: The Kinetis K50 series continues to be widely used in industrial control, medical devices, and secure IoT applications. While newer NXP microcontroller families have been introduced, the K50 series remains in active production with long-term availability commitments.

Supply Chain: Global semiconductor shortages have affected lead times, but allocation for established customers remains stable. Consider buffer stock for production planning.

Lifecycle: NXP has committed to supporting the Kinetis K50 series through at least 2027, making it suitable for designs with long product lifecycles.

Frequently Asked Questions

What is the maximum operating frequency of the MK53DX256CMD10?

The MK53DX256CMD10 can operate at frequencies up to 100MHz, providing excellent performance for real-time control applications. This high clock rate enables complex signal processing, fast control loop execution, and responsive user interfaces while maintaining deterministic behavior critical for industrial and automotive applications.

How much Flash and RAM memory does the MK53DX256CMD10 provide?

The MK53DX256CMD10 features 256KB of Flash memory and 128KB of RAM. This memory configuration provides ample space for sophisticated application code, complex data structures, and even small operating systems. The additional 4KB of EEPROM allows for reliable storage of configuration data and calibration parameters without consuming Flash memory cycles.

What communication interfaces are supported by the MK53DX256CMD10?

The MK53DX256CMD10 offers an extensive range of communication interfaces including Ethernet, USB OTG, I²C, SPI, UART/USART, SD, and IrDA. This comprehensive connectivity suite makes it ideal for networked applications, IoT devices, and systems requiring multiple peripheral connections. The Ethernet capability is particularly valuable for industrial control systems requiring network integration.

What is the operating voltage range for the MK53DX256CMD10?

The MK53DX256CMD10 operates across a wide supply voltage range of 1.71V to 3.6V. This flexibility allows the microcontroller to be used in both battery-powered applications and fixed-supply systems. The ability to operate at lower voltages contributes to reduced power consumption, extending battery life in portable devices while maintaining compatibility with standard 3.3V systems.

What analog capabilities does the MK53DX256CMD10 offer?

The MK53DX256CMD10 features an impressive analog subsystem with 41 16-bit ADC channels and 2 12-bit DAC channels. This extensive analog integration enables precise sensor monitoring, signal acquisition, and control output generation without requiring external converters. The high resolution of the ADCs makes the microcontroller suitable for applications requiring accurate measurements such as industrial sensors, medical devices, and precision instrumentation.

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The following parts include "MK53DX256CMD10" in NXP USA Inc. MK53DX256CMD10.
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