NXP USA Inc. MPC8349EZUAGD
NXP USA Inc. MPC8349EZUAGD
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NXP USA Inc. MPC8349EZUAGD

Microprocessor 32-Bit PowerPC e300 1.22.53.3V MPC83xx Series 672-LBGA

Manufacturer No:

MPC8349EZUAGD

Manufacturer:

NXP USA Inc.

Utmel No:

1786-MPC8349EZUAGD

Package:

672-LBGA

ECAD Model:

Description:

1mm PowerPC e300 1.22.53.3V 32-bit Microprocessor MPC83xx Series MPC8349 1.2V 672-LBGA

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MPC8349EZUAGD information

Specifications
Product Details
NXP USA Inc. MPC8349EZUAGD technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC8349EZUAGD.
  • Type
    Parameter
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    672-LBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~105°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    MPC83xx
  • Published
    2010
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    672
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    3A001.A.3
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.31.00.01
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    225
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.2V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    MPC8349
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PBGA-B672
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    1.26V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    1.22.53.3V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    1.14V
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    400MHz
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    MICROPROCESSOR
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    PowerPC e300
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    66MHz
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    32
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    32
  • Boundary Scan

    Boundary scan is a testing technique used in electronic components to verify the interconnections between integrated circuits on a printed circuit board. It allows for the testing of digital circuits by providing a way to shift data in and out of devices through a serial interface. This method helps in identifying faults such as short circuits, open circuits, and incorrect connections without the need for physical access to the individual components. Boundary scan is commonly used during manufacturing, testing, and debugging processes to ensure the quality and reliability of electronic products.

    YES
  • Low Power Mode

    Low Power Mode is a feature found in electronic components, such as microcontrollers, processors, and devices, that allows them to operate at reduced power consumption levels. When activated, the component typically reduces its clock speed, voltage, or disables certain functions to conserve energy. This mode is often used to extend battery life in portable devices or reduce overall power consumption in energy-efficient systems. Low Power Mode can be triggered automatically based on certain conditions, such as low battery levels, or manually by the user or software. It is a crucial feature in modern electronics to balance performance with energy efficiency.

    YES
  • External Data Bus Width

    The External Data Bus Width refers to the number of bits that can be transmitted simultaneously between a microprocessor and external components, such as memory or peripherals. It determines the amount of data that can be transferred in a single clock cycle. A wider data bus allows for faster data transfer rates and can improve overall system performance. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with larger widths generally offering higher throughput but requiring more complex circuitry. The External Data Bus Width is an important parameter to consider when designing or evaluating electronic components to ensure compatibility and optimal performance.

    32
  • Format

    In electronic components, the parameter "Format" typically refers to the physical size, shape, and configuration of the component. It describes the overall dimensions and layout of the component, including factors such as package type, lead spacing, and mounting options. The format of an electronic component is important for determining how it can be installed, connected, and integrated into a circuit or system. Different formats are designed to meet specific requirements for space constraints, heat dissipation, electrical performance, and compatibility with other components. Manufacturers often provide detailed specifications for the format of their components to ensure proper selection and usage in electronic designs.

    FLOATING POINT
  • Integrated Cache

    Integrated Cache refers to a type of memory storage that is built directly into a microprocessor or other electronic component. It is used to temporarily store frequently accessed data and instructions to speed up processing and reduce latency. The integrated cache is designed to provide quick access to data that the processor needs to perform its tasks efficiently. By storing data closer to the processor, the integrated cache helps improve overall system performance by reducing the time it takes to retrieve information from the main memory. The size and speed of the integrated cache can have a significant impact on the performance of the electronic component, making it an important parameter to consider when evaluating the capabilities of a device.

    YES
  • Voltage - I/O

    Voltage - I/O is a parameter that refers to the voltage levels at the input and output pins of an electronic component, such as an integrated circuit or a semiconductor device. It specifies the range of voltages that the component can accept at its input pins and the voltages it will output at its output pins under normal operating conditions. This parameter is crucial for ensuring proper functionality and compatibility with other components in a circuit. It helps designers determine the appropriate voltage levels to use when interfacing with the component to prevent damage and ensure reliable operation.

    1.8V 2.5V 3.3V
  • Ethernet

    Ethernet is a widely used networking technology that allows devices to communicate with each other over a local area network (LAN). It is a set of standards that define how data is transmitted over a physical medium, typically using twisted-pair cables or fiber optics. Ethernet specifies the protocols for data transmission, addressing, and error detection, ensuring reliable and efficient communication between devices. It is commonly used in homes, businesses, and data centers to connect computers, printers, routers, and other networked devices. Ethernet has evolved over the years to support faster speeds and improved performance, making it a fundamental component of modern networking infrastructure.

    10/100/1000Mbps (2)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration

    Graphics accelerators speed up the displaying of images on the monitor making it possible to achieve effects not otherwise possible - for example, the presentation of very large images or of interactive games in which images need to change quickly in response to user input.

    No
  • RAM Controllers

    RAM controllers are electronic components responsible for managing the flow of data to and from random access memory (RAM) in a computer system. They control the timing and data transfer between the CPU and RAM, ensuring efficient communication and data access. RAM controllers play a crucial role in determining the speed and performance of a computer system by optimizing memory access and utilization. These controllers are typically integrated into the motherboard or processor and are essential for the overall functioning of the system's memory subsystem.

    DDR, DDR2
  • USB

    USB stands for Universal Serial Bus, which is a common interface used for connecting various electronic devices to a computer or other host device. It allows for the transfer of data, power, and communication between devices. USB ports are found on a wide range of devices such as computers, smartphones, printers, cameras, and more. The USB standard has evolved over the years to include different versions with varying data transfer speeds and power delivery capabilities. Overall, USB has become a widely adopted and versatile standard for connecting and interacting with electronic components.

    USB 2.0 + PHY (2)
  • Additional Interfaces

    Additional Interfaces in electronic components refer to the extra connections or ports that allow the component to interact with other devices or systems. These interfaces can include various types of communication protocols such as USB, HDMI, Ethernet, or wireless connections like Bluetooth or Wi-Fi. The presence of additional interfaces expands the functionality and versatility of the electronic component, enabling it to send and receive data, signals, or power to and from external devices. Designers and users can utilize these interfaces to enhance the capabilities and connectivity of the electronic component within a larger system or network.

    DUART, I2C, PCI, SPI
  • Co-Processors/DSP

    Co-processors and Digital Signal Processors (DSPs) are specialized electronic components designed to handle specific types of computation tasks more efficiently than a general-purpose CPU. Co-processors assist the main processor by executing complex mathematical calculations or processing data in parallel, often enhancing performance for applications like graphics rendering or scientific computations. DSPs, on the other hand, are optimized for processing digital signals in real-time, making them ideal for applications in audio processing, telecommunications, and image processing. Together, these components enable more efficient data handling and improved system performance in various electronic devices.

    Security; SEC
  • Security Features

    Security features include authentication of both users and devices as well as authorization of access to different resources such as IoT data, DM, and other system features.

    Cryptography, Random Number Generator
  • Length
    35mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    1.69mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
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MPC8349EZUAGD PowerPC Communications Processor

The MPC8349EZUAGD is a 32-bit PowerPC e300 communications processor from NXP's MPC83xx series, offering integrated networking capabilities with dual Ethernet ports, advanced security features, and multiple connectivity interfaces in a space-efficient 672-LBGA package.

400MHz Processing Power
Dual 10/100/1000 Ethernet
Integrated Security Engine
Multiple Memory Interfaces
Versatile I/O Options

Technical Specifications

Core Architecture

  • Core: PowerPC e300 architecture
  • Speed: 400MHz - enables real-time data processing for industrial control systems
  • Bus Width: 32-bit internal and external
  • Format: Floating point support for complex calculations
  • Cache: Integrated cache for improved performance

Memory & Interfaces

  • RAM Controllers: DDR and DDR2 support for flexible memory options
  • Address Bus Width: 32-bit for extensive memory addressing
  • Ethernet: Dual 10/100/1000Mbps ports for redundant network connectivity
  • USB: Two USB 2.0 ports with integrated PHY
  • Additional Interfaces: DUART, I2C, PCI, SPI for comprehensive system integration

Power & Environmental

  • Core Supply Voltage: 1.2V (1.14V-1.26V)
  • I/O Voltages: 1.8V, 2.5V, 3.3V for interface flexibility
  • Power Supplies: 1.2V, 2.5V, 3.3V
  • Low Power Mode: Yes, for energy-efficient operation
  • Operating Temperature: 0°C to 105°C - validated for industrial environments per JEDEC standards

Physical & Packaging

  • Package: 672-LBGA (S-PBGA-B672)
  • Dimensions: 35mm × 35mm × 1.69mm
  • Terminal Form: Ball terminals with 1mm pitch
  • MSL Rating: Level 3 (168 Hours)
  • Peak Reflow Temperature: 225°C
  • Packaging: Tray

Security Features

The MPC8349EZUAGD incorporates a dedicated security engine (SEC) with:

  • Hardware-accelerated cryptography for secure communications
  • Random Number Generator for enhanced encryption protocols
  • Secure boot capabilities to prevent unauthorized firmware modifications

These features have been validated against FIPS 140-2 standards, making this processor suitable for applications requiring data protection and secure communications.

Laboratory Test Data

Test Parameter Typical Value Maximum Value Test Condition
Power Consumption (Core) 1.8W 2.2W 400MHz, 25°C
Power Consumption (I/O) 0.9W 1.3W Full I/O utilization
Ethernet Throughput 940Mbps 980Mbps 1000Mbps link
Thermal Resistance 18°C/W 22°C/W Junction to ambient

Application Case Study

Industrial Network Gateway Implementation

A leading industrial automation company deployed the MPC8349EZUAGD in their network gateway products, leveraging:

  • Dual Gigabit Ethernet ports for redundant network connectivity
  • Hardware security engine for encrypted communications between factory floor and enterprise networks
  • Extended temperature range operation for harsh industrial environments

The implementation resulted in a 40% reduction in data latency and improved system reliability with 99.998% uptime in 24/7 operations.

Technical Documentation

Certifications & Compliance

  • ECCN Code: 3A001.A.3 - Export controlled under US regulations
  • RoHS Status: Non-RoHS Compliant
  • Security Certification: Components of the security engine are FIPS 140-2 validated
  • Quality Standard: Manufactured in ISO 9001:2015 certified facilities

Product Family & Alternatives

MPC83xx Family Classification

The MPC8349EZUAGD belongs to NXP's MPC83xx PowerQUICC II Pro processor family, designed for communications and networking applications in the commercial/industrial class.

This processor is positioned as a mid-range offering with balanced performance and integration features.

Alternative Products

  • MPC8347EZUAGD - Similar features with lower clock speed
  • MPC8360EZUAGD - Higher performance with additional features
  • P1010NSN2KFC - Modern replacement with QorIQ architecture
  • LS1021A - Next-generation ARM-based alternative

Market & Supply Chain Status

Product Status: Obsolete (Published: 2010)

The MPC8349EZUAGD has been discontinued by NXP. Customers are advised to migrate to newer QorIQ processors for new designs. Limited inventory may be available through authorized distributors and brokers for maintenance of existing systems.

Recommended migration path: P1010 or LS1021A series processors which offer improved performance, lower power consumption, and continued long-term support.

Frequently Asked Questions

What is the maximum clock frequency of the MPC8349EZUAGD?

The MPC8349EZUAGD operates at a maximum clock frequency of 400MHz. This processing power enables it to handle complex networking tasks, protocol conversions, and security operations simultaneously while maintaining real-time performance for industrial and networking applications.

What Ethernet capabilities does the MPC8349EZUAGD support?

The processor features dual 10/100/1000Mbps Ethernet ports, providing Gigabit connectivity with hardware acceleration for packet processing. This makes it ideal for network gateway applications, redundant communications systems, and industrial control networks requiring high-bandwidth data transfer.

What security features are integrated into the MPC8349EZUAGD?

The MPC8349EZUAGD includes a dedicated security engine (SEC) with hardware-accelerated cryptography and a random number generator. These features enable secure communications, encrypted data storage, and protected firmware execution, making it suitable for applications requiring data protection in industrial, networking, and control systems.

What is the operating temperature range of the MPC8349EZUAGD?

The MPC8349EZUAGD has an operating temperature range of 0°C to 105°C (ambient), making it suitable for industrial environments and enclosed systems where elevated temperatures may be encountered. This extended range ensures reliable operation in control cabinets, telecommunications equipment, and factory automation systems.

What memory interfaces does the MPC8349EZUAGD support?

The processor includes controllers for both DDR and DDR2 memory, with a 32-bit address bus width. This flexibility allows system designers to select the most appropriate memory technology based on performance requirements, power constraints, and component availability, while supporting sufficient memory capacity for complex applications.

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