NXP USA Inc. PCA9536D,118
NXP USA Inc. PCA9536D,118
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NXP USA Inc. PCA9536D,118

Interface -40°C~85°C 1.27mm 2.5/5V I/O Expander

Manufacturer No:

PCA9536D,118

Manufacturer:

NXP USA Inc.

Utmel No:

1786-PCA9536D,118

Package:

8-SOIC (0.154, 3.90mm Width)

Datasheet:

PCA9536

ECAD Model:

Description:

8 Termination 1.27mm 2.5/5V I/O Expander PCA9536 3V 8-SOIC (0.154, 3.90mm Width)

Quantity:

Unit Price: $0.985292

Ext Price: $0.99

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In Stock : 7

Minimum: 1 Multiples: 1

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Unit Price

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    $0.985292

    $0.99

  • 10

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    $9.30

  • 100

    $0.876906

    $87.69

  • 500

    $0.827270

    $413.64

  • 1000

    $0.780444

    $780.44

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PCA9536D,118 information

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NXP USA Inc. PCA9536D,118 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. PCA9536D,118.
  • Type
    Parameter
  • Factory Lead Time
    7 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    8-SOIC (0.154, 3.90mm Width)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of I/Os
    4
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2003
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    8
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    NICKEL PALLADIUM GOLD
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    2.3V~5.5V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3V
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    30
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    PCA9536
  • Pin Count

    a count of all of the component leads (or pins)

    8
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PDSO-G8
  • Output Type

    The "Output Type" parameter in electronic components refers to the type of signal or data that is produced by the component as an output. This parameter specifies the nature of the output signal, such as analog or digital, and can also include details about the voltage levels, current levels, frequency, and other characteristics of the output signal. Understanding the output type of a component is crucial for ensuring compatibility with other components in a circuit or system, as well as for determining how the output signal can be utilized or processed further. In summary, the output type parameter provides essential information about the nature of the signal that is generated by the electronic component as its output.

    Push-Pull
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    2.5/5V
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    I2C, SMBus
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    1
  • Number of Bits
    4
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    400kHz
  • Interrupt Output

    In electronic components, "Interrupt Output" refers to a feature that allows a device to signal the occurrence of a specific event or condition that requires immediate attention from the system or user. When the specified event occurs, the interrupt output generates a signal to pause the normal operation of the device and divert the attention to handle the urgent task. This feature is commonly used in microcontrollers, processors, and other integrated circuits to efficiently manage tasks and prioritize critical operations. By utilizing interrupt outputs, electronic systems can respond promptly to important events, improve overall performance, and enhance real-time responsiveness.

    No
  • Current - Output Source/Sink

    The parameter "Current - Output Source/Sink" in electronic components refers to the maximum amount of current that the component can either source (provide) or sink (absorb) at its output pin. This parameter is crucial in determining the capability of the component to drive external loads such as other components or devices. The source current indicates the maximum current that the component can supply to the load, while the sink current indicates the maximum current that the component can draw from the load. Understanding this parameter is essential for designing circuits that require specific current-handling capabilities to ensure proper functionality and reliability.

    10mA 25mA
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    POR
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    1.75mm
  • Width
    3.9mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for NXP USA Inc. PCA9536D,118.

PCA9536D,118 Overview

8-SOIC (0.154, 3.90mm Width) comes with the device enclosed in the packaging.The case comes in the Tape & Reel (TR) style.Votage is provided within 2.3V~5.5V.The mounting type recommended for it is Surface Mount.Devices work when the operating temperature ranges -40°C~85°C.The performance of the output frequency is determined by 400kHz.In terms of termination, it is characterized by 8 termination as a whole.In total, the part has 8 pins.There is voltage at 3V provided by the device.In order to run 260, the peak reflow temperature of this part is used.1 ports are available on the device.On the basis of the PCA9536 family, you can look for related parts.4 is the number of bits on an IC chip.At 2.5/5V, it is capable of delivering power.

PCA9536D,118 Features


PCA9536D,118 Applications

There are a lot of NXP USA Inc.
PCA9536D,118 I/O Expanders applications.


  • Single-Ended to Differential Conversion/Amplification
  • Low Voltage, Low Noise, Differential Signal Processing
  • Common Mode Voltage Translation
  • Portable Instrumentation
  • Multiprotocol RFID Readers: EPC-GEN2, ISD and IPX
  • IDEN, PHS, GSM Basestations
  • Repeaters, Radio Links, and Modems
  • Wireless Telemetry
  • JTRS
  • 802.11x Receivers
The three parts on the right have similar specifications to NXP USA Inc. & PCA9536D,118.
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