NXP USA Inc. SC16C750IB64,151

Interface - UARTs (Universal Asynchronous Receiver Transmitter) 10mm mm Interface - UARTs (Universal Asynchronous Receiver Transmitter)

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

The center distance from one pole to the next.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

a count of all of the component leads (or pins)

JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

An indicator of formal certification of qualifications.

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

Boundary scan is a testing technique used in electronic components to verify the interconnections between integrated circuits on a printed circuit board. It allows for the testing of digital circuits by providing a way to shift data in and out of devices through a serial interface. This method helps in identifying faults such as short circuits, open circuits, and incorrect connections without the need for physical access to the individual components. Boundary scan is commonly used during manufacturing, testing, and debugging processes to ensure the quality and reliability of electronic products.

Low Power Mode is a feature found in electronic components, such as microcontrollers, processors, and devices, that allows them to operate at reduced power consumption levels. When activated, the component typically reduces its clock speed, voltage, or disables certain functions to conserve energy. This mode is often used to extend battery life in portable devices or reduce overall power consumption in energy-efficient systems. Low Power Mode can be triggered automatically based on certain conditions, such as low battery levels, or manually by the user or software. It is a crucial feature in modern electronics to balance performance with energy efficiency.

The External Data Bus Width refers to the number of bits that can be transmitted simultaneously between a microprocessor and external components, such as memory or peripherals. It determines the amount of data that can be transferred in a single clock cycle. A wider data bus allows for faster data transfer rates and can improve overall system performance. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with larger widths generally offering higher throughput but requiring more complex circuitry. The External Data Bus Width is an important parameter to consider when designing or evaluating electronic components to ensure compatibility and optimal performance.

Data Rate (Max) refers to the maximum rate at which data can be transferred or processed within an electronic component or device. It is typically measured in bits per second (bps) or megabits per second (Mbps). This parameter is important for determining the speed and efficiency of data transmission or processing in various electronic applications such as computer systems, networking devices, and memory modules. A higher data rate indicates that the component is capable of handling larger volumes of data at a faster pace, leading to improved performance and responsiveness in electronic systems. It is crucial to consider the Data Rate (Max) specification when selecting electronic components to ensure compatibility and optimal functionality for specific applications.

The parameter "Data Transfer Rate-Max" in electronic components refers to the maximum rate at which data can be transferred between different devices or components within a system. It is typically measured in bits per second (bps) or bytes per second (Bps) and indicates the peak speed at which data can be transmitted. This parameter is crucial for determining the overall performance and efficiency of a system, especially in applications where high-speed data transfer is essential, such as in networking equipment, storage devices, and communication systems. Manufacturers often specify the Data Transfer Rate-Max to help users understand the capabilities and limitations of the component when it comes to transferring data quickly and reliably.

In electronic components, the communication protocol refers to a set of rules and conventions that devices use to exchange information with each other. It defines the format, timing, sequencing, and error checking of data transmission between devices. Different communication protocols are used for various applications, such as serial communication (e.g., UART, SPI, I2C) and network communication (e.g., Ethernet, Wi-Fi, Bluetooth). Choosing the appropriate communication protocol is crucial for ensuring compatibility and reliable data transfer between electronic components in a system.

FIFO stands for First In, First Out. It is a buffering method used in electronic components to manage data flow. In a FIFO structure, the first data entered into the buffer is the first to be retrieved or processed, ensuring that events are handled in the order they occur. This is particularly useful in applications where timing and sequence are critical, such as data acquisition systems and network packet management.

The parameter "With Modem Control" in electronic components refers to the capability of the component to interface and communicate with a modem device. This feature allows the component to send and receive data signals to and from a modem for various purposes such as data transfer, remote control, or communication with other devices over a network.Components with modem control typically have built-in circuitry or protocols that enable them to establish a connection with a modem and exchange data using standard communication protocols like RS-232 or USB. This functionality is commonly found in devices like microcontrollers, sensors, and communication modules that need to interact with modems for data transmission.Having modem control capability in electronic components provides flexibility and convenience in integrating them into systems that require modem communication, making it easier to establish connections and exchange data with other devices or networks.

Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.