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ON Semiconductor MC14044BCP

DUAL 3V ~ 18V SR-Type Flip Flops

Manufacturer No:

MC14044BCP

Manufacturer:

ON Semiconductor

Utmel No:

1807-MC14044BCP

Package:

16-DIP (0.300, 7.62mm)

ECAD Model:

Description:

3V ~ 18V 4 Bit SR-Type Flip Flop DUAL 16 Pins 4000B Series 16-DIP (0.300, 7.62mm)

Quantity:

Unit Price: $1.069477

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MC14044BCP information

Specifications
Documents & Media
Product Details
ON Semiconductor MC14044BCP technical specifications, attributes, parameters and parts with similar specifications to ON Semiconductor MC14044BCP.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Through Hole
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Through Hole
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    16-DIP (0.300, 7.62mm)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Pins
    16
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    16-PDIP
  • Number of Terminals
    16
  • Number of Inputs per Chip
    8
  • Set/Reset
    No
  • Number of Elements per Chip
    1
  • Supplier Package
    PDIP
  • Typical Operating Supply Voltage
    3.3/5/9/12/15 V
  • Minimum Operating Supply Voltage
    3 V
  • Maximum Propagation Delay Time @ Maximum CL
    350@5V/175@10V/120@15V ns
  • Number of Channels per Chip
    4
  • Bus Hold
    No
  • Number of Output Enables per Element
    1
  • Maximum Operating Supply Voltage
    18 V
  • Number of Outputs per Chip
    4
  • Latch Mode
    Transparent
  • Mounting
    Through Hole
  • Number of Elements
    1
  • RoHS
    Compliant
  • Package
    Tube
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    MC14044
  • Mfr
    onsemi
  • Product Status
    Active
  • Package Description
    PLASTIC, DIP-16
  • Package Style
    IN-LINE
  • Load Capacitance (CL)
    50 pF
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    DIP16,.3
  • Operating Temperature-Min
    -55 °C
  • Operating Temperature-Max
    125 °C
  • Rohs Code
    No
  • Manufacturer Part Number
    MC14044BCP
  • Supply Voltage-Nom (Vsup)
    5 V
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Manufacturer
    Motorola Semiconductor Products
  • Part Life Cycle Code
    Transferred
  • Ihs Manufacturer
    MOTOROLA INC
  • Risk Rank
    4.61
  • Prop.
    350 ns
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55 to 125 °C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Rail/Tube
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    4000B
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e0
  • Type
    SR-Type
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Lead (Sn/Pb)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    125 °C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -55 °C
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Subcategory
    FF/Latches
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    CMOS
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    3V ~ 18V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54 mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    16
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PDIP-T16
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Output Type

    The "Output Type" parameter in electronic components refers to the type of signal or data that is produced by the component as an output. This parameter specifies the nature of the output signal, such as analog or digital, and can also include details about the voltage levels, current levels, frequency, and other characteristics of the output signal. Understanding the output type of a component is crucial for ensuring compatibility with other components in a circuit or system, as well as for determining how the output signal can be utilized or processed further. In summary, the output type parameter provides essential information about the nature of the signal that is generated by the electronic component as its output.

    3-State
  • Circuit

    The parameter "Circuit" in electronic components refers to the interconnected arrangement of various electronic elements such as resistors, capacitors, inductors, and active devices like transistors. It defines the path through which electric current flows and establishes the operational behavior of the components within that system. Circuits can be classified as analog or digital, depending on the type of signals they handle, and can vary in complexity from simple series or parallel configurations to intricate designs used in advanced applications.

    1:1
  • Polarity

    In electronic components, polarity refers to the orientation or direction in which the component must be connected in a circuit to function properly. Components such as diodes, capacitors, and LEDs have polarity markings to indicate which terminal should be connected to the positive or negative side of the circuit. Connecting a component with incorrect polarity can lead to malfunction or damage. It is important to pay attention to polarity markings and follow the manufacturer's instructions to ensure proper operation of electronic components.

    Non-Inverting
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    18 V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5/15 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    MILITARY
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    3 V
  • Number of Circuits
    4
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    18 V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    3 V
  • Number of Bits
    4
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    120 ns
  • Quiescent Current

    The quiescent current is defined as the current level in the amplifier when it is producing an output of zero.

    6 nA
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    350 ns
  • Family

    In electronic components, the parameter "Family" typically refers to a categorization or classification system used to group similar components together based on their characteristics, functions, or applications. This classification helps users easily identify and select components that meet their specific requirements. The "Family" parameter can include various subcategories such as resistors, capacitors, diodes, transistors, integrated circuits, and more. Understanding the "Family" of an electronic component can provide valuable information about its compatibility, performance specifications, and potential uses within a circuit or system. It is important to consider the "Family" parameter when designing or troubleshooting electronic circuits to ensure proper functionality and compatibility with other components.

    4000/14000/40000
  • Logic Function

    In electronic components, the term "Logic Function" refers to the specific operation or behavior of a component based on its input signals. It describes how the component processes the input signals to produce the desired output. Logic functions are fundamental to digital circuits and are used to perform logical operations such as AND, OR, NOT, and XOR.Each electronic component, such as logic gates or flip-flops, is designed to perform a specific logic function based on its internal circuitry. By understanding the logic function of a component, engineers can design and analyze complex digital systems to ensure proper functionality and performance. Different logic functions can be combined to create more complex operations, allowing for the creation of sophisticated digital devices and systems.

    Latch
  • Output Characteristics

    Output characteristics in electronic components refer to the relationship between the output voltage and output current across a range of input conditions. This parameter is essential for understanding how a device, such as a transistor or operational amplifier, behaves under various loads and operating points. It provides insights into the efficiency, performance, and limitations of the component, helping designers to make informed choices for circuits and applications.

    3-STATE
  • Current - Output High, Low

    The parameter "Current - Output High, Low" refers to the maximum output current levels that an electronic component, such as a digital logic gate or microcontroller pin, can source or sink when in a high or low state. When the output is in the high state, it indicates the maximum current the component can provide to an external circuit while maintaining a voltage close to the supply voltage. Conversely, when in the low state, it shows the maximum current that the component can absorb from the external circuit while maintaining a voltage near ground. These parameters are critical for ensuring that the component operates within safe limits and interacts properly with other devices.

    8.8mA, 8.8mA
  • Seated Height-Max

    Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.

    4.44 mm
  • Logic Type

    Logic Type in electronic components refers to the classification of circuits based on the logical operations they perform. It includes types such as AND, OR, NOT, NAND, NOR, XOR, and XNOR, each defining the relationship between binary inputs and outputs. The logic type determines how the inputs affect the output state based on specific rules of Boolean algebra. This classification is crucial for designing digital circuits and systems, enabling engineers to select appropriate components for desired functionalities.

    S-R Latch
  • Output Polarity

    Output polarity in electronic components refers to the orientation of the output signal in relation to the ground or reference voltage. It indicates whether the output voltage is positive or negative with respect to the ground. Positive output polarity means the signal is higher than the ground potential, while negative output polarity signifies that the signal is lower than the ground. This characteristic is crucial for determining compatibility with other components in a circuit and ensuring proper signal processing.

    TRUE
  • Logic IC Type

    Logic IC Type refers to the type of integrated circuit (IC) that is specifically designed to perform logical operations. These ICs are commonly used in digital electronic devices to process and manipulate binary data according to predefined logic functions. The Logic IC Type parameter typically specifies the specific logic family or technology used in the IC, such as TTL (Transistor-Transistor Logic), CMOS (Complementary Metal-Oxide-Semiconductor), or ECL (Emitter-Coupled Logic). Understanding the Logic IC Type is important for selecting the appropriate IC for a given application, as different logic families have varying characteristics in terms of speed, power consumption, and noise immunity.

    R-S LATCH
  • Max I(ol)

    Max I(ol) refers to the maximum output current that a specific electronic component, such as a transistor or integrated circuit, can sink or source. This parameter is crucial in determining the capability of the component to drive external loads without being damaged. It is typically specified in the component's datasheet and is important for ensuring proper operation and reliability of the circuit in which the component is used. Designers must ensure that the output current requirements of the circuit do not exceed the specified "Max I(ol)" value to prevent overloading and potential failure of the component.

    0.0088 A
  • Trigger Type

    Trigger Type in electronic components refers to the mechanism or method by which a device, such as a flip-flop or timer, responds to an input signal. It defines how the device transitions between states based on specific conditions, such as rising or falling edges of a signal, levels, or pulses. Different trigger types such as edge-triggered, level-triggered, or pulse-triggered influence the timing and behavior of the circuit, thereby determining how input signals affect the output in various applications.

    LOW LEVEL
  • High Level Output Current

    High-level Output Current IOH The current flowing into the output at a specified high- level voltage. Low-level Output Current IOL The current flowing into the output at a specified low- level output voltage.

    -4.2 mA
  • Propagation Delay (tpd)

    Propagation delay (tpd) is a crucial parameter in electronic components, especially in digital circuits. It refers to the time taken for a signal to travel from the input of a component to its output. This delay is caused by various factors such as the internal circuitry, interconnections, and the physical properties of the component. Propagation delay is essential to consider in designing circuits to ensure proper timing and functionality. It is typically measured in nanoseconds or picoseconds and plays a significant role in determining the overall performance and speed of electronic systems.

    350 ns
  • Low Level Output Current

    The current into the output terminal with input conditions applied that, according to the product specification, will establish a low level at the output.

    32 mA
  • Number of Input Lines
    8
  • Independent Circuits

    The term "Independent Circuits" in electronic components refers to the ability of a device to function as a separate and self-contained circuit within a larger system. In the context of electronic components, having independent circuits means that each circuit can operate autonomously without being directly affected by other circuits in the system. This feature allows for better isolation, control, and troubleshooting of individual circuits within a complex electronic system. Independent circuits are commonly found in devices such as integrated circuits, where multiple functional blocks are designed to operate independently to perform specific tasks efficiently. Overall, the presence of independent circuits in electronic components enhances the reliability, flexibility, and performance of the system as a whole.

    4
  • Number of Output Lines
    4
  • Delay Time - Propagation

    Delay Time - Propagation is a parameter in electronic components that refers to the time it takes for a signal to travel from the input of a component to its output. It is a crucial characteristic in digital circuits as it determines the speed at which signals can propagate through the component. A shorter delay time means faster signal propagation, which is important for ensuring proper timing and performance in electronic systems. Engineers often analyze and optimize delay time propagation to improve the overall speed and efficiency of electronic devices.

    60ns
  • Width
    7.62 mm
  • Length
    19.175 mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Contains Lead
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Download datasheets and manufacturer documentation for ON Semiconductor MC14044BCP.

MC14044BCP Overview

16-DIP (0.300, 7.62mm)is the packaging method. The Rail/Tubepackage contains it. T flip flop is configured with an output of 3-State. This trigger is configured to use LOW LEVEL. In this case, the electronic component is mounted in the way of Through Hole. The JK flip flop operates with an input voltage of 3V ~ 18V volts. In the operating environment, the temperature is -55 to 125 °C. It is an electronic flip flop with the type SR-Type. This type of FPGA is a part of the 4000B series. It belongs to the family of electronic devices known as 4000/14000/40000. There is an electronic part that is mounted in the way of Through Hole. The 16pins are designed into the board. There is a FF/Latchesbase part number assigned to the RS flip flops. It is designed with 4bits. As soon as Vsup reaches 18 V, the maximum supply voltage is reached. For normal operation, the supply voltage (Vsup) should be kept above 3 V. The superior flexibility of this circuit is achieved by using 4 circuits. A total of 5/15 V power supplies are needed to run it. In order for the chip to function, it has 4output lines. A total of 8input lines have been provided. Quiescent current is consumed by the D latch in the amount of 6 nA. A -4.2 mAvalue is set for the high level output current. 32 mA is the low level output current. A temperature below 125 °Cis recommended for operation. It is recommended that the operating temperature be greater than -55 °C. Despite its minimal supply voltage of 3 V, it is capable of operating. 18 Vis the maximum supply voltage it supports. The logic IC it uses is R-S LATCH. As a result, it is equipped with 1 functions . This device is equipped with a pin count of 16.

MC14044BCP Features

Rail/Tube package
4000B series
16 pins
4 Bits
5/15 V power supplies
1 Functions
16 pin count

MC14044BCP Applications

There are a lot of ON Semiconductor
MC14044BCP Flip Flops applications.


  • Shift Registers
  • Storage Registers
  • Bounce elimination switch
  • Data storage
  • Data transfer
  • Latch
  • Registers
  • Memory
  • Frequency division
  • Memory