ON Semiconductor MC14052BDTR2G
ON Semiconductor MC14052BDTR2G
MC14051B, 52B, 53B Outline Dimensions_1
MC14051B, 52B, 53B Outline Dimensions_2
MC14051B, 52B, 53B Outline Dimensions_3
MC14051B, 52B, 53B Outline Dimensions_4
MC14051B, 52B, 53B Outline Dimensions_5
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ON Semiconductor MC14052BDTR2G

Multiplexers ICs 5V DP4T Analog Switches 16 Pins

Manufacturer No:

MC14052BDTR2G

Manufacturer:

ON Semiconductor

Utmel No:

1807-MC14052BDTR2G

Package:

16-TSSOP (0.173, 4.40mm Width)

ECAD Model:

Description:

DP4T 280Ohm Analog Switches BREAK-BEFORE-MAKE MC14052B 16 Pins 100nA 5V 16-TSSOP (0.173, 4.40mm Width)

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MC14052BDTR2G information

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ON Semiconductor MC14052BDTR2G technical specifications, attributes, parameters and parts with similar specifications to ON Semiconductor MC14052BDTR2G.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 2 days ago)
  • Factory Lead Time
    45 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Gold
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    16-TSSOP (0.173, 4.40mm Width)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    16
  • Turn Off Delay Time

    It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

    600 ns
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C~125°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2004
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    16
  • Resistance

    Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.

    280Ohm
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    500mW
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    MC14052B
  • Pin Count

    a count of all of the component leads (or pins)

    16
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5/15V
  • Number of Channels
    4
  • Number of Circuits
    2
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    18V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    3V
  • Analog IC - Other Type

    Analog IC - Other Type is a parameter used to categorize electronic components that are integrated circuits (ICs) designed for analog signal processing but do not fall into more specific subcategories such as amplifiers, comparators, or voltage regulators. These ICs may include specialized analog functions such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), voltage references, or signal conditioning circuits. They are typically used in various applications where precise analog signal processing is required, such as in audio equipment, instrumentation, communication systems, and industrial control systems. Manufacturers provide detailed specifications for these components to help engineers select the most suitable IC for their specific design requirements.

    DIFFERENTIAL MULTIPLEXER
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    500mW
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    75 ns
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    600 ns
  • Logic Function

    In electronic components, the term "Logic Function" refers to the specific operation or behavior of a component based on its input signals. It describes how the component processes the input signals to produce the desired output. Logic functions are fundamental to digital circuits and are used to perform logical operations such as AND, OR, NOT, and XOR.Each electronic component, such as logic gates or flip-flops, is designed to perform a specific logic function based on its internal circuitry. By understanding the logic function of a component, engineers can design and analyze complex digital systems to ensure proper functionality and performance. Different logic functions can be combined to create more complex operations, allowing for the creation of sophisticated digital devices and systems.

    Demultiplexer, Multiplexer
  • Number of Inputs
    8
  • Halogen Free

    The term "Halogen Free" in electronic components refers to a specific characteristic of the materials used in the manufacturing of the component. Halogens are a group of elements that include fluorine, chlorine, bromine, iodine, and astatine. These elements are commonly used in flame retardants and other materials in electronics. However, the presence of halogens can pose environmental and health risks when the components are disposed of or recycled.Therefore, electronic components labeled as "Halogen Free" are manufactured without the use of halogenated materials. This designation indicates that the components do not contain any halogens, making them safer for the environment and human health. Halogen-free components are becoming increasingly popular in the electronics industry due to the growing awareness of environmental concerns and regulations regarding hazardous substances in electronic products.

    Halogen Free
  • Supply Type

    Supply Type in electronic components refers to the classification of power sources used to operate the component. It indicates whether the component requires DC or AC power, and if DC, specifies the voltage levels such as low, medium, or high. Different supply types can affect the performance, compatibility, and application of the component in electronic circuits. Understanding the supply type is crucial for proper component selection and integration into electronic designs.

    Dual
  • On-State Resistance (Max)

    The "On-State Resistance (Max)" parameter in electronic components refers to the maximum resistance exhibited by the component when it is in the fully conducting state. This resistance is typically measured when the component is carrying the maximum specified current. A lower on-state resistance indicates better conductivity and efficiency of the component when it is in the on-state. It is an important parameter to consider when selecting components for applications where low power dissipation and high efficiency are critical factors.

    280Ohm
  • High Level Output Current

    High-level Output Current IOH The current flowing into the output at a specified high- level voltage. Low-level Output Current IOL The current flowing into the output at a specified low- level output voltage.

    25mA
  • Low Level Output Current

    The current into the output terminal with input conditions applied that, according to the product specification, will establish a low level at the output.

    25mA
  • Multiplexer/Demultiplexer Circuit

    A Multiplexer/Demultiplexer Circuit is an electronic component used in digital circuits to select one of several input signals and route it to a single output. A multiplexer, also known as a "mux," is used to combine multiple input signals into a single output, while a demultiplexer, also known as a "demux," is used to take a single input and route it to one of several possible outputs. These circuits are commonly used in data transmission, communication systems, and digital signal processing applications to efficiently manage and control the flow of data. Multiplexers and demultiplexers play a crucial role in optimizing the use of resources and improving the overall performance of electronic systems.

    2:4
  • Off-state Isolation-Nom

    Off-state Isolation-Nom is a parameter used to measure the level of isolation between two electronic components or circuits when one of them is in the off state. It indicates the ability of the component to prevent unwanted signals or interference from passing through when it is not actively conducting. The parameter is typically expressed in decibels (dB) and is an important consideration in designing and selecting components for applications where isolation between different parts of a circuit is critical to prevent crosstalk or interference. Higher values of Off-state Isolation-Nom indicate better isolation performance, leading to improved overall system reliability and performance.

    50 dB
  • Current - Leakage (IS(off)) (Max)

    Current - Leakage (IS(off)) (Max) refers to the maximum amount of current that flows through a device when it is in its off state, meaning it is not conducting or not intended to be active. This parameter is crucial in determining the efficiency of electronic components, especially in battery-operated devices, as higher leakage currents can lead to increased power consumption and reduced battery life. It is typically measured in microamperes (µA) or milliamperes (mA) and helps engineers assess the suitability of a component for low-power applications.

    100nA
  • Channel Capacitance (CS(off), CD(off))

    Channel capacitance (CS(off), CD(off)) in electronic components refers to the capacitance associated with the channel of a field-effect transistor (FET) when it is turned off. CS(off) represents the capacitance between the source and the gate of the FET, while CD(off) represents the capacitance between the drain and the gate. These capacitances play a crucial role in determining the high-frequency performance and switching characteristics of the FET. Understanding and controlling these capacitances is essential for optimizing the performance of electronic circuits, especially in high-speed applications where minimizing parasitic capacitances is critical for achieving desired signal integrity and efficiency.

    7.5pF
  • On-state Resistance Match-Nom

    On-state Resistance Match-Nom refers to the nominal or standard value of the on-state resistance for a specific electronic component, such as a transistor or a MOSFET, when it is in its "on" state. This parameter indicates how much resistance the component presents to current flow during its conducting phase, which affects power dissipation and efficiency. Matching this value across multiple devices is crucial for ensuring consistent performance in applications where several components operate together.

    25Ohm
  • Switch Circuit

    establishes connections between links, on demand and as available, in order to establish an end-to-end circuit between devices.

    DP4T
  • Channel-to-Channel Matching (ΔRon)

    Channel-to-Channel Matching (ΔRon) refers to the variation in the on-resistance of multiple channels within a multi-channel electronic component, such as a multiplexer or a switch. It is a measure of how closely the on-resistance values of different channels match each other. The lower the ΔRon value, the better the matching between channels, which is important for ensuring consistent performance across all channels in a system. Channel-to-Channel Matching is critical in applications where precise and uniform signal processing is required, such as in instrumentation, audio equipment, and communication systems. Manufacturers provide specifications for ΔRon to help designers select components that meet their performance requirements.

    10 Ω
  • Switching

    In electronic components, "Switching" refers to the process of turning a device on or off, or changing its state from one condition to another. This parameter is crucial in determining the speed and efficiency of a component's operation. It is often measured in terms of switching time, which is the time taken for a device to transition from one state to another. The switching characteristics of a component play a significant role in its overall performance and reliability in electronic circuits.

    BREAK-BEFORE-MAKE
  • Voltage - Supply, Single (V+)

    Voltage - Supply, Single (V+) refers to the positive voltage supply needed for an electronic component to operate. It indicates the range of voltage levels that can be applied to the component from a single power source. This parameter is crucial for determining compatibility with other components in a circuit and ensuring proper functionality. It typically defines the minimum and maximum voltage limits within which the device can safely and effectively operate.

    3V~18V
  • Length
    5mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for ON Semiconductor MC14052BDTR2G.

Product Description:

The ON Semiconductor MC14052BDTR2G is a high-performance, surface-mount, dual-supply, differential multiplexer/demultiplexer (MUX/DEMUX) IC. This device is designed to provide high-speed, low-power, and low-leakage current switching for various analog and digital applications. The IC features a 2:4 multiplexer/demultiplexer circuit with four channels, two circuits, and one function, making it an ideal solution for applications requiring high channel density and low power consumption.

Features:

  • High-Speed Operation: The MC14052BDTR2G operates at a high frequency of up to 100 MHz, making it suitable for high-speed data transmission and processing applications.
  • Low Power Consumption: The IC has a low power dissipation of 500 mW, reducing heat generation and energy consumption.
  • Low Leakage Current: The device features a low leakage current of 100 nA, ensuring minimal current draw when in the off-state.
  • High Channel Density: The IC has four channels, allowing for multiple signals to be switched and processed simultaneously.
  • Dual Supply Operation: The MC14052BDTR2G can operate with dual supplies of 5V and 15V, providing flexibility in power supply design.
  • Surface Mount Package: The IC is available in a 16-pin TSSOP package, making it easy to integrate into surface-mount designs.

Applications:

  • Primary Applications:
  • High-speed data acquisition and processing systems
  • Analog-to-digital and digital-to-analog converters
  • Switched-capacitor filters and amplifiers
  • High-frequency signal processing and transmission systems
  • Secondary Applications:
  • Medical devices and equipment
  • Industrial control systems
  • Automotive electronics
  • Aerospace and defense systems

Alternative Parts:

  • MC14052B: The base part number for the MC14052BDTR2G, which is a similar device without the lead-free and halogen-free features.
  • MC14052BDTR1G: A variant of the MC14052BDTR2G with a different package type.

Embedded Modules:

  • Analog-to-Digital Converters (ADCs)
  • Digital-to-Analog Converters (DACs)
  • Switched-Capacitor Filters and Amplifiers

FAQs:

Q: What is the operating temperature range of the MC14052BDTR2G? A: The operating temperature range is -55°C to 125°C.

Q: What is the maximum power dissipation of the IC? A: The maximum power dissipation is 500 mW.

Q: Is the MC14052BDTR2G compatible with RoHS3 standards? A: Yes, the IC is ROHS3 compliant.

Q: What is the package type of the MC14052BDTR2G? A: The package type is a 16-pin TSSOP (0.173, 4.40mm Width) with a tape and reel packaging.

Q: Is the IC suitable for high-frequency applications? A: Yes, the MC14052BDTR2G operates at high frequencies up to 100 MHz, making it suitable for high-speed data transmission and processing applications.

The three parts on the right have similar specifications to ON Semiconductor & MC14052BDTR2G.
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