ON Semiconductor MOC256R2M
ON Semiconductor MOC256R2M
MOC256M Outline Dimensions_1
MOC256M Outline Dimensions_2
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ON Semiconductor MOC256R2M

Manufacturer No:

MOC256R2M

Manufacturer:

ON Semiconductor

Utmel No:

1807-MOC256R2M

Package:

SOIC

Datasheet:

MOC256M

ECAD Model:

Description:

Transistor Output Optocouplers SO-8 AC INPUT T/R

Quantity:

Delivery:

DHLTNTUPSFedExSF-Express

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In Stock : 50000

Please send RFQ , we will respond immediately.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
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MOC256R2M information

Specifications
Documents & Media
Product Comparison
ON Semiconductor MOC256R2M technical specifications, attributes, parameters and parts with similar specifications to ON Semiconductor MOC256R2M.
  • Type
    Parameter
  • Lifecycle Status

    Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

    ACTIVE (Last Updated: 1 day ago)
  • Factory Lead Time
    7 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    SOIC
  • Number of Pins
    8
  • Weight
    252mg
  • Number of Elements
    1
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2004
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin (Sn)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    100°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -40°C
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    UL RECOGNIZED, VDE APPROVED
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    250mW
  • Output Voltage

    Output voltage is a crucial parameter in electronic components that refers to the voltage level produced by the component as a result of its operation. It represents the electrical potential difference between the output terminal of the component and a reference point, typically ground. The output voltage is a key factor in determining the performance and functionality of the component, as it dictates the level of voltage that will be delivered to the connected circuit or load. It is often specified in datasheets and technical specifications to ensure compatibility and proper functioning within a given system.

    30V
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    SINGLE WITH BUILT-IN DIODE
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    250mW
  • Optoelectronic Device Type

    Optoelectronic Device Type refers to the classification of electronic components that can both detect and emit light. These devices convert electrical signals into light or vice versa, making them essential for applications such as optical communication, sensing, and display technologies. Common types of optoelectronic devices include light-emitting diodes (LEDs), photodiodes, phototransistors, and laser diodes. Understanding the optoelectronic device type is crucial for selecting the appropriate component for a specific application based on factors such as wavelength, power output, and sensitivity.

    AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER
  • Forward Current

    Current which flows upon application of forward voltage.

    60mA
  • Max Output Voltage

    The maximum output voltage refers to the dynamic area beyond which the output is saturated in the positive or negative direction, and is limited according to the load resistance value.

    30V
  • Output Current per Channel

    Output Current per Channel is a specification commonly found in electronic components such as amplifiers, audio interfaces, and power supplies. It refers to the maximum amount of electrical current that can be delivered by each individual output channel of the component. This parameter is important because it determines the capacity of the component to drive connected devices or loads. A higher output current per channel means the component can deliver more power to connected devices, while a lower output current may limit the performance or functionality of the component in certain applications. It is crucial to consider the output current per channel when selecting electronic components to ensure they can meet the power requirements of the intended system or setup.

    150mA
  • Forward Voltage

    the amount of voltage needed to get current to flow across a diode.

    1.5V
  • Collector Emitter Voltage (VCEO)

    Collector-Emitter Voltage (VCEO) is a key parameter in electronic components, particularly in transistors. It refers to the maximum voltage that can be applied between the collector and emitter terminals of a transistor while the base terminal is open or not conducting. Exceeding this voltage limit can lead to breakdown and potential damage to the transistor. VCEO is crucial for ensuring the safe and reliable operation of the transistor within its specified limits. Designers must carefully consider VCEO when selecting transistors for a circuit to prevent overvoltage conditions that could compromise the performance and longevity of the component.

    400mV
  • Max Collector Current

    Max Collector Current is a parameter used to specify the maximum amount of current that can safely flow through the collector terminal of a transistor or other electronic component without causing damage. It is typically expressed in units of amperes (A) and is an important consideration when designing circuits to ensure that the component operates within its safe operating limits. Exceeding the specified max collector current can lead to overheating, degradation of performance, or even permanent damage to the component. Designers must carefully consider this parameter when selecting components and designing circuits to ensure reliable and safe operation.

    150mA
  • Max Input Current

    Max Input Current is a parameter that specifies the maximum amount of electrical current that can safely flow into an electronic component without causing damage. It is an important consideration when designing or using electronic circuits to ensure that the component operates within its specified limits. Exceeding the maximum input current can lead to overheating, component failure, or even pose safety risks. Manufacturers provide this parameter in datasheets to help engineers and users understand the limitations of the component and ensure proper operation within the specified parameters.

    60mA
  • Input Current

    Input current is a parameter that refers to the amount of electrical current flowing into a specific electronic component or device. It is typically measured in amperes (A) and represents the current required for the component to operate properly. Understanding the input current is important for designing circuits and power supplies, as it helps determine the capacity and compatibility of the components being used. Monitoring the input current also helps ensure that the component is not being overloaded or underpowered, which can affect its performance and longevity.

    60mA
  • Isolation Voltage

    Isolation voltage refers to a test of the ability of an insulator to minimize the flow of electric current with a high applied voltage.

    2.5kV
  • Current Transfer Ratio

    Current Transfer Ratio (CTR) is the gain of the optocoupler. It is the ratio of the phototransistor collector current to the IRED forward current. CTR = (IC / IF) * 100 It is expressed as a percentage (%).

    150 %
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for ON Semiconductor MOC256R2M.
The three parts on the right have similar specifications to ON Semiconductor & MOC256R2M.
  • Image
    Part Number
    Manufacturer
    Package / Case
    Number of Pins
    Isolation Voltage
    Current Transfer Ratio
    Output Voltage
    Max Output Voltage
    Forward Voltage
    Forward Current
    Availability
    Price
    Quantity
    Compare Two Parts
    Compare Three Parts
  • MOC256R2M

    MOC256R2M

    SOIC

    8

    2.5 kV

    150 %

    30 V

    30 V

    1.5 V

    60 mA

    50000
    -
  • TLP2409(TP,F)

    8-SOIC (0.154, 3.90mm Width)

    8

    -

    130 %

    30 V

    30 V

    1.5 V

    60 mA

    10000
    -

    Same as the main part number.