Panduit Corp CTH35U08-C30

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

The "Opening Size" parameter in electronic components refers to the physical dimensions of an opening or aperture within the component. This measurement typically specifies the size of the opening through which certain elements, such as light, air, or other materials, can pass. The opening size is crucial in determining the compatibility and functionality of the component within a larger system or circuit. It is important to consider the opening size when designing or selecting electronic components to ensure proper fit and performance.

The parameter "Panel Hole Size" in electronic components refers to the diameter of the hole required in a panel or enclosure to mount the component securely. This measurement is crucial for ensuring a proper fit and alignment during installation. It is important to match the panel hole size with the component's specifications to prevent any issues such as loose fitting or misalignment. Manufacturers provide this information to assist users in selecting the appropriate panel or enclosure for their electronic components. It is recommended to follow the specified panel hole size to maintain the integrity and functionality of the electronic component.

In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

Panel thickness in electronic components refers to the measurement of the thickness of the material used in the construction of a panel, such as a printed circuit board or housing enclosure. This parameter is crucial as it influences the mechanical stability, thermal conductivity, and overall durability of the component. Thicker panels can provide enhanced structural integrity and resistance to bending or warping, while thinner panels might be preferred for lightweight applications. The specific thickness needed often depends on the intended application and design requirements.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.