Renesas R5F51306BGFM#30
Renesas R5F51306BGFM#30
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Renesas R5F51306BGFM#30

Microcontroller AFD Series 64-LQFP

Manufacturer No:

R5F51306BGFM#30

Manufacturer:

Renesas

Utmel No:

2038-R5F51306BGFM#30

Package:

64-LQFP

ECAD Model:

Description:

256KB (256K x 8) FLASH RX 32-Bit Single-Core Microcontroller AFD Series 64-LQFP

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  • Vacuum packagingStep2:Vacuum packaging
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R5F51306BGFM#30 information

Specifications
Product Details
Renesas R5F51306BGFM#30 technical specifications, attributes, parameters and parts with similar specifications to Renesas R5F51306BGFM#30.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    64-LQFP
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    64-LFQFP (10x10)
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Part # Aliases
    YAFD57-20-39PW6116
  • Manufacturer
    TE Connectivity
  • Brand
    TE Connectivity / DEUTSCH
  • Moisture Sensitive
    Yes
  • RoHS
    Details
  • Number of I/Os
    52
  • Package
    Tray
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    R5F51306
  • Mfr
    Renesas Electronics America Inc
  • Data Converters
    A/D 14x12b; D/A 2x8b
  • Product Status
    Discontinued at Digi-Key
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    AFD
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 105°C (TA)
  • Subcategory
    Circular Connectors
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    32MHz
  • RAM Size

    RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.

    32K x 8
  • Voltage - Supply (Vcc/Vdd)

    Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.

    1.8V ~ 5.5V
  • Core Processor

    The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.

    RX
  • Peripherals

    In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.

    DMA, LVD, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size

    Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.

    32-Bit Single-Core
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    256KB (256K x 8)
  • Connectivity

    In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.

    I²C, LINbus, SCI, SPI
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Circular MIL Spec Connector
  • EEPROM Size

    EEPROM Size refers to the amount of memory capacity available in an Electrically Erasable Programmable Read-Only Memory (EEPROM) chip. This parameter indicates the total storage space in bytes or bits that can be used to store data in a non-volatile manner. The EEPROM size determines the maximum amount of information that can be written, read, and erased from the memory chip. It is an important specification to consider when selecting an EEPROM for a particular application, as it directly impacts the amount of data that can be stored and accessed by the electronic component.

    8K x 8
  • Product Category

    a particular group of related products.

    Circular MIL Spec Connector
  • Width
    10 mm
  • Height
    1.7 mm
  • Length
    10 mm
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R5F51306BGFM#30 Overview

Packaged in a 64-LQFP format, this MCU is available in a compact size. It is important to note that the Microcontroller has a Surface Mount mounting type. 32-Bit Single-Core core is the basis for this Microcontroller. This program has a type of memory called FLASH for this MCU's program memory. Temperatures in this range are operated by this Microcontroller. The AFD series includes this electrical component. There is 256KB (256K x 8) bytes of program memory in MCU, which corresponds to the size of the program. With a RX Core processor, MCU is equipped with the latest technology available.

R5F51306BGFM#30 Features

64-LQFP package
Mounting type of Surface Mount
Circular Connectors subcategory

R5F51306BGFM#30 Applications

There are a lot of Renesas
R5F51306BGFM#30 Microcontroller applications.


  • Equipment control
  • Instrument control
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights