Renesas Electronics America Inc. 70T659S10BFI
Renesas Electronics America Inc. 70T659S10BFI
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Renesas Electronics America Inc. 70T659S10BFI

Memory IC Memory IC

Manufacturer No:

70T659S10BFI

Utmel No:

2038-70T659S10BFI

Package:

208-LFBGA

Datasheet:

IDT70T651/9S

Usage Grade:

  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive
  • Military
  • Aerospace
  • Industrial
  • Commercial
  • Automotive

ECAD Model:

Description:

Memory IC IDT70T659

Quantity:

Unit Price: $273.379294

Ext Price: $273.38

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 2482

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $273.379294

    $273.38

  • 10

    $257.904994

    $2,579.05

  • 100

    $243.306598

    $24,330.66

  • 500

    $229.534527

    $114,767.26

  • 1000

    $216.542006

    $216,542.01

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
70T659S10BFI information

Specifications
Documents & Media
Product Details
Renesas Electronics America Inc. 70T659S10BFI technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc. 70T659S10BFI.
  • Type
    Parameter
  • Factory Lead Time
    18 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    208-LFBGA
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    208-CABGA (15x15)
  • Memory Types
    Volatile
  • Usage Level
    Industrial grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    4 (72 Hours)
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    2.4V~2.6V
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    IDT70T659
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    4.5Mb 128K x 36
  • Access Time

    Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

    10ns
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    SRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Write Cycle Time - Word, Page

    Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.

    10ns
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
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Download datasheets and manufacturer documentation for Renesas Electronics America Inc. 70T659S10BFI.

70T659S10BFI Overview

The case comes in the Tray style. The file is embedded in a 208-LFBGA case. This chip has an 4.5Mb 128K x 36 size of memory on it, so a lot of data can be stored on it. Memory data is stored in SRAM-format, which is common in mainstream devices. -40°C~85°C TA is an extended operating temperature range, making this device ideal for demanding applications. A supply voltage of 2.4V~2.6V can be applied to it. There is a recommended mounting type of Surface Mount for it. As the base part number for the device, IDT70T659 is frequently used to select similar items.

70T659S10BFI Features

Package / Case: 208-LFBGA

70T659S10BFI Applications

There are a lot of Renesas Electronics America Inc.
70T659S10BFI Memory applications.


  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic