Renesas Electronics America Inc. 72265LA15PFGI

FIFOs Memory 7200 Series 10ns ns FIFO memory IC

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

The parameter "Function" in electronic components refers to the specific role or purpose that the component serves within an electronic circuit. It defines how the component interacts with other elements, influences the flow of electrical signals, and contributes to the overall behavior of the system. Functions can include amplification, signal processing, switching, filtering, and energy storage, among others. Understanding the function of each component is essential for designing effective and efficient electronic systems.

The parameter "Current - Supply (Max)" in electronic components refers to the maximum amount of current that a component can draw from a power supply for its operation. This parameter is critical for ensuring that the power supply can adequately meet the demands of the component without causing damage or malfunction. Exceeding this specified maximum current can lead to overheating, reduced performance, or failure of the component. It is essential to consider this value when designing or integrating components into electronic circuits to maintain reliability and functionality.

The memory capacity is the amount of data a device can store at any given time in its memory.

Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

Bus Directional is a parameter in electronic components that refers to the ability of a bus to transmit data bidirectionally, meaning it can send and receive data signals. In a bus system, multiple devices are connected to a common communication line, and the bus directional feature allows for efficient data transfer between these devices. This parameter is important for ensuring smooth and reliable communication within a system, as it enables devices to both send and receive data over the same bus line. Having a bus directional capability helps in simplifying the design of electronic systems and facilitates seamless data exchange between connected devices.

Retransmit Capability in electronic components refers to the ability of a device to resend or retransmit data packets that were not successfully received by the intended recipient. This feature is commonly found in communication systems, such as wireless networks, where data transmission may be affected by interference or signal loss. By having retransmit capability, the device can detect when data packets are lost or corrupted and automatically resend them to ensure reliable communication. This helps improve the overall performance and reliability of the system by reducing the chances of data loss or errors during transmission.

FWFT Support stands for First Word Fall Through Support and is a feature found in certain electronic components, particularly in memory devices such as cache memories. This feature allows the first word of a memory access to be read out immediately, even before the rest of the data is fully accessed. It helps to improve the overall performance of the memory system by reducing latency and increasing data throughput. Essentially, FWFT Support enables faster access to data by allowing the initial word to be retrieved without waiting for the entire data block to be accessed.

Programmable Flags Support refers to a feature in electronic components that allows users to set specific flags or indicators based on certain conditions or events. These flags can be programmed to trigger actions, alerts, or responses within the component or system. By utilizing programmable flags support, users can customize the behavior of the component to suit their specific requirements or applications. This feature enhances flexibility, control, and automation in electronic systems, enabling more efficient and tailored operation.

Expansion Type in electronic components refers to the method by which a circuit can be expanded or enhanced to accommodate additional functionalities or increased performance. It typically involves the use of expansion slots or connectors that allow for the insertion of additional cards or modules. This enables the integration of extra features, such as increased memory, additional processing power, or specialized functions, while maintaining compatibility with the existing system architecture.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.