Renesas Electronics America Inc. HI9P0546-9Z96
Renesas Electronics America Inc. HI9P0546-9Z96
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Renesas Electronics America Inc. HI9P0546-9Z96

Multiplexers ICs 15V 300ns, 300ns (Typ) Analog Switches 28 Pins

Manufacturer No:

HI9P0546-9Z96

Utmel No:

2038-HI9P0546-9Z96

Package:

28-SOIC (0.295, 7.50mm Width)

Usage Grade:

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ECAD Model:

Description:

300ns, 300ns (Typ) 1.8kOhm DUAL Analog Switches HI-546 28 Pins 30pA Typ 15V 28-SOIC (0.295, 7.50mm Width)

Quantity:

Unit Price: $53.137969

Ext Price: $53.14

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 39

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $53.137969

    $53.14

  • 10

    $50.130159

    $501.30

  • 100

    $47.292603

    $4,729.26

  • 500

    $44.615663

    $22,307.83

  • 1000

    $42.090249

    $42,090.25

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
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  • Vacuum packagingStep2:Vacuum packaging
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HI9P0546-9Z96 information

Specifications
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Product Details
Renesas Electronics America Inc. HI9P0546-9Z96 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc. HI9P0546-9Z96.
  • Type
    Parameter
  • Factory Lead Time
    3 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    28-SOIC (0.295, 7.50mm Width)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Usage Level
    Industrial grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    28
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn) - annealed
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    OVERVOLTAGE PROTECTION
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    15V
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    40
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    HI-546
  • Pin Count

    a count of all of the component leads (or pins)

    28
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PDSO-G28
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Number of Channels
    16
  • Number of Circuits
    1
  • Analog IC - Other Type

    Analog IC - Other Type is a parameter used to categorize electronic components that are integrated circuits (ICs) designed for analog signal processing but do not fall into more specific subcategories such as amplifiers, comparators, or voltage regulators. These ICs may include specialized analog functions such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), voltage references, or signal conditioning circuits. They are typically used in various applications where precise analog signal processing is required, such as in audio equipment, instrumentation, communication systems, and industrial control systems. Manufacturers provide detailed specifications for these components to help engineers select the most suitable IC for their specific design requirements.

    SINGLE-ENDED MULTIPLEXER
  • Neg Supply Voltage-Nom (Vsup)

    The parameter "Neg Supply Voltage-Nom (Vsup)" in electronic components refers to the nominal negative supply voltage that the component requires to operate within its specified performance characteristics. This parameter indicates the minimum voltage level that must be provided to the component's negative supply pin for proper functionality. It is important to ensure that the negative supply voltage provided to the component does not exceed the maximum specified value to prevent damage or malfunction. Understanding and adhering to the specified negative supply voltage requirements is crucial for the reliable operation of the electronic component in a circuit.

    -15V
  • On-State Resistance (Max)

    The "On-State Resistance (Max)" parameter in electronic components refers to the maximum resistance exhibited by the component when it is in the fully conducting state. This resistance is typically measured when the component is carrying the maximum specified current. A lower on-state resistance indicates better conductivity and efficiency of the component when it is in the on-state. It is an important parameter to consider when selecting components for applications where low power dissipation and high efficiency are critical factors.

    1.8kOhm
  • Multiplexer/Demultiplexer Circuit

    A Multiplexer/Demultiplexer Circuit is an electronic component used in digital circuits to select one of several input signals and route it to a single output. A multiplexer, also known as a "mux," is used to combine multiple input signals into a single output, while a demultiplexer, also known as a "demux," is used to take a single input and route it to one of several possible outputs. These circuits are commonly used in data transmission, communication systems, and digital signal processing applications to efficiently manage and control the flow of data. Multiplexers and demultiplexers play a crucial role in optimizing the use of resources and improving the overall performance of electronic systems.

    16:1
  • Off-state Isolation-Nom

    Off-state Isolation-Nom is a parameter used to measure the level of isolation between two electronic components or circuits when one of them is in the off state. It indicates the ability of the component to prevent unwanted signals or interference from passing through when it is not actively conducting. The parameter is typically expressed in decibels (dB) and is an important consideration in designing and selecting components for applications where isolation between different parts of a circuit is critical to prevent crosstalk or interference. Higher values of Off-state Isolation-Nom indicate better isolation performance, leading to improved overall system reliability and performance.

    68 dB
  • Current - Leakage (IS(off)) (Max)

    Current - Leakage (IS(off)) (Max) refers to the maximum amount of current that flows through a device when it is in its off state, meaning it is not conducting or not intended to be active. This parameter is crucial in determining the efficiency of electronic components, especially in battery-operated devices, as higher leakage currents can lead to increased power consumption and reduced battery life. It is typically measured in microamperes (µA) or milliamperes (mA) and helps engineers assess the suitability of a component for low-power applications.

    30pA Typ
  • Channel Capacitance (CS(off), CD(off))

    Channel capacitance (CS(off), CD(off)) in electronic components refers to the capacitance associated with the channel of a field-effect transistor (FET) when it is turned off. CS(off) represents the capacitance between the source and the gate of the FET, while CD(off) represents the capacitance between the drain and the gate. These capacitances play a crucial role in determining the high-frequency performance and switching characteristics of the FET. Understanding and controlling these capacitances is essential for optimizing the performance of electronic circuits, especially in high-speed applications where minimizing parasitic capacitances is critical for achieving desired signal integrity and efficiency.

    10pF 52pF
  • On-state Resistance Match-Nom

    On-state Resistance Match-Nom refers to the nominal or standard value of the on-state resistance for a specific electronic component, such as a transistor or a MOSFET, when it is in its "on" state. This parameter indicates how much resistance the component presents to current flow during its conducting phase, which affects power dissipation and efficiency. Matching this value across multiple devices is crucial for ensuring consistent performance in applications where several components operate together.

    126Ohm
  • Switch Time (Ton, Toff) (Max)

    The parameter "Switch Time (Ton, Toff) (Max)" in electronic components refers to the maximum time it takes for a device to transition between its on and off states. Ton represents the turn-on time, which is the time taken for the device to switch from the off state to the on state, while Toff represents the turn-off time, which is the time taken for the device to switch from the on state to the off state. This parameter is crucial in determining the speed and efficiency of the device's switching operation. A shorter switch time generally indicates faster switching speeds and better performance of the electronic component.

    300ns, 300ns (Typ)
  • Channel-to-Channel Matching (ΔRon)

    Channel-to-Channel Matching (ΔRon) refers to the variation in the on-resistance of multiple channels within a multi-channel electronic component, such as a multiplexer or a switch. It is a measure of how closely the on-resistance values of different channels match each other. The lower the ΔRon value, the better the matching between channels, which is important for ensuring consistent performance across all channels in a system. Channel-to-Channel Matching is critical in applications where precise and uniform signal processing is required, such as in instrumentation, audio equipment, and communication systems. Manufacturers provide specifications for ΔRon to help designers select components that meet their performance requirements.

    126 Ω
  • Voltage - Supply, Dual (V±)

    The parameter "Voltage - Supply, Dual (V±)" refers to the range of dual supply voltages required for the operation of an electronic component. This specification indicates that the component can operate with both positive and negative voltage levels, typically represented as V+ for the positive voltage and V- for the negative voltage. It is commonly used in analog devices and operational amplifiers to facilitate signal processing that requires a reference point at ground level, allowing for both upwards and downwards signal variations. A typical example would be V+ = +15V and V- = -15V, indicating the component can operate effectively within that voltage range.

    ±15V
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    2.65mm
  • Width
    7.5mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Renesas Electronics America Inc. HI9P0546-9Z96.

HI9P0546-9Z96 Overview

Packed in 28-SOIC (0.295, 7.50mm Width), the electronic component is convenient for shipping overseas. Advanced packaging method Tape & Reel (TR) is used to provide high reliability. This analog switch is mounted in Surface Mount. The ratio between the number of multiplexer and demultiplexer circuits is 16:1. Extended operating temperature around -40°C~85°C TA. There are 28 terminations totally. By its 16 channels, the electronic component provides high-quality output. With a 15V voltage supply, the electrical component should be turned on and run. 28 pins are injected to the electronic part body. This multiplexer is composed of 1 circuits. If you are looking for variants of the digital switch, trying search with HI-546. Integrated with SINGLE-ENDED MULTIPLEXER analog IC. Don’t miss additional features of the electronic component such as: OVERVOLTAGE PROTECTION.

HI9P0546-9Z96 Features

16 Channels
Additional Features: OVERVOLTAGE PROTECTION

HI9P0546-9Z96 Applications

There are a lot of Renesas Electronics America Inc.
HI9P0546-9Z96 Analog Switches & Multiplexers ICs applications.


  • High-Voltage
  • Transmit
  • Low-Voltage
  • Isolation
  • Medical
  • Imaging
  • Ultrasound
  • Audio and video switching
  • Automatic test equipment
  • Precision data acquisition
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