Renesas Electronics America Inc. ISL6612CR
Renesas Electronics America Inc. ISL6612CR
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Renesas Electronics America Inc. ISL6612CR

Gate Drivers ICs Surface Mount Tube Obsolete Gate Drivers ICs EAR99

Manufacturer No:

ISL6612CR

Utmel No:

2038-ISL6612CR

Package:

10-VFDFN Exposed Pad

ECAD Model:

Description:

Surface Mount Tube Obsolete EAR99 Gate Drivers ICs Non-Inverting 2 36V V 10-VFDFN Exposed Pad ISL6612

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ISL6612CR information

Specifications
Documents & Media
Product Details
Renesas Electronics America Inc. ISL6612CR technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc. ISL6612CR.
  • Type
    Parameter
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    10-VFDFN Exposed Pad
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Driver Configuration
    Half-Bridge
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~125°C TJ
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn) - annealed
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    10.8V~13.2V
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    ISL6612
  • Pin Count

    a count of all of the component leads (or pins)

    10
  • Input Type

    Input type in electronic components refers to the classification of the signal or data that a component can accept for processing or conversion. It indicates whether the input is analog, digital, or a specific format such as TTL or CMOS. Understanding input type is crucial for ensuring compatibility between different electronic devices and circuits, as it determines how signals are interpreted and interacted with.

    Non-Inverting
  • Rise / Fall Time (Typ)

    The parameter "Rise / Fall Time (Typ)" in electronic components refers to the time it takes for a signal to transition from a specified low level to a specified high level (rise time) or from a high level to a low level (fall time). It is typically measured in nanoseconds or picoseconds and is an important characteristic in determining the speed and performance of a component, such as a transistor or integrated circuit. A shorter rise/fall time indicates faster signal switching and can impact the overall speed and efficiency of a circuit. Designers often consider this parameter when selecting components for high-speed applications to ensure proper signal integrity and timing.

    26ns 18ns
  • Channel Type

    In electronic components, the parameter "Channel Type" refers to the type of channel through which electrical signals or current flow within the component. This parameter is commonly associated with field-effect transistors (FETs) and other semiconductor devices. The channel type can be categorized as either N-channel or P-channel, depending on the polarity of the majority charge carriers (electrons or holes) that carry the current within the channel. N-channel devices have an electron-conducting channel, while P-channel devices have a hole-conducting channel. Understanding the channel type is crucial for proper circuit design and component selection to ensure compatibility and optimal performance.

    Synchronous
  • Number of Drivers
    2
  • Gate Type

    In electronic components, the term "Gate Type" typically refers to the type of logic gate used in digital circuits. A logic gate is a fundamental building block of digital circuits that performs a specific logical operation based on the input signals it receives. Common types of logic gates include AND, OR, NOT, NAND, NOR, XOR, and XNOR gates.The Gate Type parameter specifies the specific logic function that the gate performs, such as AND, OR, or NOT. Different gate types have different truth tables that define their behavior based on the input signals. By selecting the appropriate gate type for a given application, designers can implement various logical functions and operations in digital circuits.Understanding the gate type is essential for designing and analyzing digital circuits, as it determines how the circuit processes and manipulates binary data. Choosing the right gate type is crucial for ensuring the correct functionality and performance of the digital system being designed.

    N-Channel MOSFET
  • Current - Peak Output (Source, Sink)

    The parameter "Current - Peak Output (Source, Sink)" in electronic components refers to the maximum amount of current that the component can either supply (source) or sink (absorb) under peak conditions. This parameter is important for understanding the capability of the component to handle sudden surges or spikes in current without being damaged. The peak output current is typically specified in datasheets and is crucial for designing circuits that require high current handling capabilities. It is essential to consider this parameter to ensure the component operates within its safe operating limits and to prevent potential damage or malfunction.

    1.25A 2A
  • High Side Voltage - Max (Bootstrap)

    The parameter "High Side Voltage - Max (Bootstrap)" in electronic components refers to the maximum voltage that can be applied to the high side of a bootstrap circuit. Bootstrap circuits are commonly used in power electronics to drive high-side MOSFETs or IGBTs efficiently. This parameter is crucial for ensuring the proper operation and reliability of the bootstrap circuit, as exceeding the maximum voltage can lead to component failure or malfunction. Designers must carefully consider this specification when selecting components and designing circuits to prevent damage and ensure optimal performance.

    36V
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
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Download datasheets and manufacturer documentation for Renesas Electronics America Inc. ISL6612CR.

Product Description

ISL6612CR Gate Driver IC from Renesas Electronics America Inc.

The ISL6612CR is a half-bridge gate driver integrated circuit (IC) designed by Renesas Electronics America Inc. This IC is specifically engineered to drive high-side and low-side N-channel MOSFETs in various power management applications. Despite being an obsolete part, it remains a reliable choice for many existing designs due to its robust performance and compatibility with a wide range of power management systems.

Features

  • High Performance Gate Driving: The ISL6612CR features two high-performance gate drivers with a rise and fall time of 26ns and 18ns respectively, ensuring fast switching times and minimal propagation delay.
  • Wide Operating Voltage Range: This IC operates within a supply voltage range of 10.8V to 13.2V, making it suitable for a variety of power management configurations.
  • High-Side Bootstrap Capability: The IC supports high-side voltage up to 36V through its bootstrap configuration, enabling efficient operation in high-voltage applications.
  • Surface Mount Technology: Designed for surface mount technology (SMT), the ISL6612CR is easy to integrate into modern PCB designs without compromising performance.
  • Non-Inverting Input Type: The non-inverting input type simplifies the control logic and reduces the complexity of the overall system design.

Applications

Primary Applications: 1. Power Supplies: The ISL6612CR is ideal for use in power supplies where high efficiency and fast switching times are crucial. 2. DC-DC Converters: This IC is well-suited for driving MOSFETs in DC-DC converters, ensuring stable and efficient operation. 3. Motor Control Systems: It can be used in motor control systems where precise control over gate signals is necessary.

Secondary Applications: 1. Battery Management Systems (BMS): The ISL6612CR can be used in BMS to manage charging and discharging processes efficiently. 2. Audio Amplifiers: It may also find application in audio amplifier designs where high-speed switching is required.

Alternative Parts

If you are looking for alternative parts due to obsolescence or specific requirements, consider the following options:

  1. ISL6612A: This is a newer version of the ISL6612 series with improved specifications and additional features.
  2. Other Renesas Gate Drivers: Renesas offers a range of gate drivers that might meet your specific needs depending on the application requirements.

Embedded Modules

The ISL6612CR is commonly used in various embedded modules designed for power management applications:

  1. Power Management Boards: Many power management boards incorporate this IC for efficient power conversion and control.
  2. Industrial Control Systems: It is often embedded in industrial control systems where reliable and fast switching times are essential.

While the ISL6612CR is an obsolete part, its robust performance makes it a reliable choice for many existing designs requiring high-speed gate driving capabilities within a specific voltage range. Always verify compatibility with newer components if you're planning to integrate it into a modern system design.


This detailed description provides a comprehensive overview of the ISL6612CR gate driver IC from Renesas Electronics America Inc., highlighting its key features, primary and secondary applications, alternative parts, and embedded modules where it is commonly used.