

Renesas Electronics America Inc. ISL89163FRTAZ-T
Gate Drivers ICs Surface Mount Tape & Reel (TR) Active Gate Drivers ICs EAR99
Manufacturer No:
ISL89163FRTAZ-T
Tiny WHSLManufacturer:
Utmel No:
2038-ISL89163FRTAZ-T
Package:
8-WDFN Exposed Pad
Datasheet:
Usage Grade:
Industrial
Description:
Surface Mount Tape & Reel (TR) Active EAR99 Gate Drivers ICs Non-Inverting 2 8-WDFN Exposed Pad ISL89163
Quantity:
Unit Price: $2.334302
Ext Price: $2.33
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In Stock : 270
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$2.334302
$2.33
10
$2.202172
$22.02
100
$2.077520
$207.75
500
$1.959925
$979.96
1000
$1.848986
$1,848.99
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- TypeParameter
- Factory Lead Time6 Weeks
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Surface Mount - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
8-WDFN Exposed Pad - Driver ConfigurationLow-Side
- Logic voltage-VIL, VIH1.22V 2.08V
- Usage LevelIndustrial grade
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~125°C TJ - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e3 - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
1 (Unlimited) - ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
Matte Tin (Sn) - Voltage - Supply
Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.
4.5V~16V - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
NOT SPECIFIED - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
NOT SPECIFIED - Base Part Number
The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.
ISL89163 - Pin Count
a count of all of the component leads (or pins)
8 - Input Type
Input type in electronic components refers to the classification of the signal or data that a component can accept for processing or conversion. It indicates whether the input is analog, digital, or a specific format such as TTL or CMOS. Understanding input type is crucial for ensuring compatibility between different electronic devices and circuits, as it determines how signals are interpreted and interacted with.
Non-Inverting - Rise / Fall Time (Typ)
The parameter "Rise / Fall Time (Typ)" in electronic components refers to the time it takes for a signal to transition from a specified low level to a specified high level (rise time) or from a high level to a low level (fall time). It is typically measured in nanoseconds or picoseconds and is an important characteristic in determining the speed and performance of a component, such as a transistor or integrated circuit. A shorter rise/fall time indicates faster signal switching and can impact the overall speed and efficiency of a circuit. Designers often consider this parameter when selecting components for high-speed applications to ensure proper signal integrity and timing.
20ns 20ns - Interface IC Type
The parameter "Interface IC Type" in electronic components refers to the type of integrated circuit (IC) that is used to facilitate communication between different electronic devices or subsystems. This IC is responsible for managing the exchange of data and control signals between the devices, ensuring proper communication and coordination. The specific type of interface IC used can vary depending on the requirements of the system, such as serial communication (e.g., UART, SPI, I2C), parallel communication, or specialized interfaces like USB or Ethernet. Choosing the appropriate interface IC type is crucial for ensuring compatibility, reliability, and efficiency in electronic systems.
AND GATE BASED MOSFET DRIVER - Channel Type
In electronic components, the parameter "Channel Type" refers to the type of channel through which electrical signals or current flow within the component. This parameter is commonly associated with field-effect transistors (FETs) and other semiconductor devices. The channel type can be categorized as either N-channel or P-channel, depending on the polarity of the majority charge carriers (electrons or holes) that carry the current within the channel. N-channel devices have an electron-conducting channel, while P-channel devices have a hole-conducting channel. Understanding the channel type is crucial for proper circuit design and component selection to ensure compatibility and optimal performance.
Independent - Number of Drivers2
- Gate Type
In electronic components, the term "Gate Type" typically refers to the type of logic gate used in digital circuits. A logic gate is a fundamental building block of digital circuits that performs a specific logical operation based on the input signals it receives. Common types of logic gates include AND, OR, NOT, NAND, NOR, XOR, and XNOR gates.The Gate Type parameter specifies the specific logic function that the gate performs, such as AND, OR, or NOT. Different gate types have different truth tables that define their behavior based on the input signals. By selecting the appropriate gate type for a given application, designers can implement various logical functions and operations in digital circuits.Understanding the gate type is essential for designing and analyzing digital circuits, as it determines how the circuit processes and manipulates binary data. Choosing the right gate type is crucial for ensuring the correct functionality and performance of the digital system being designed.
N-Channel MOSFET - Current - Peak Output (Source, Sink)
The parameter "Current - Peak Output (Source, Sink)" in electronic components refers to the maximum amount of current that the component can either supply (source) or sink (absorb) under peak conditions. This parameter is important for understanding the capability of the component to handle sudden surges or spikes in current without being damaged. The peak output current is typically specified in datasheets and is crucial for designing circuits that require high current handling capabilities. It is essential to consider this parameter to ensure the component operates within its safe operating limits and to prevent potential damage or malfunction.
6A 6A - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant
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