

Rochester Electronics, LLC OMAP3530DCUSA
Microprocessor ARM® Cortex®-A8 OMAP-35xx Series 423-LFBGA, FCBGA
Manufacturer No:
OMAP3530DCUSA
Tiny WHSLManufacturer:
Utmel No:
2071-OMAP3530DCUSA
Package:
423-LFBGA, FCBGA
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Description:
ARM® Cortex®-A8 Microprocessor OMAP-35xx Series 423-LFBGA, FCBGA
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- TypeParameter
- Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
423-LFBGA, FCBGA - Supplier Device Package
The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.
423-FCBGA (16x16) - Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C~105°C TJ - Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
OMAP-35xx - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Obsolete - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
4 (72 Hours) - Speed
In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.
720MHz - Core Processor
The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.
ARM® Cortex®-A8 - Voltage - I/O
Voltage - I/O is a parameter that refers to the voltage levels at the input and output pins of an electronic component, such as an integrated circuit or a semiconductor device. It specifies the range of voltages that the component can accept at its input pins and the voltages it will output at its output pins under normal operating conditions. This parameter is crucial for ensuring proper functionality and compatibility with other components in a circuit. It helps designers determine the appropriate voltage levels to use when interfacing with the component to prevent damage and ensure reliable operation.
1.8V 3.0V - Number of Cores/Bus Width1 Core 32-Bit
- Graphics Acceleration
Graphics accelerators speed up the displaying of images on the monitor making it possible to achieve effects not otherwise possible - for example, the presentation of very large images or of interactive games in which images need to change quickly in response to user input.
Yes - RAM Controllers
RAM controllers are electronic components responsible for managing the flow of data to and from random access memory (RAM) in a computer system. They control the timing and data transfer between the CPU and RAM, ensuring efficient communication and data access. RAM controllers play a crucial role in determining the speed and performance of a computer system by optimizing memory access and utilization. These controllers are typically integrated into the motherboard or processor and are essential for the overall functioning of the system's memory subsystem.
LPDDR - USB
USB stands for Universal Serial Bus, which is a common interface used for connecting various electronic devices to a computer or other host device. It allows for the transfer of data, power, and communication between devices. USB ports are found on a wide range of devices such as computers, smartphones, printers, cameras, and more. The USB standard has evolved over the years to include different versions with varying data transfer speeds and power delivery capabilities. Overall, USB has become a widely adopted and versatile standard for connecting and interacting with electronic components.
USB 1.x (3), USB 2.0 (1) - Additional Interfaces
Additional Interfaces in electronic components refer to the extra connections or ports that allow the component to interact with other devices or systems. These interfaces can include various types of communication protocols such as USB, HDMI, Ethernet, or wireless connections like Bluetooth or Wi-Fi. The presence of additional interfaces expands the functionality and versatility of the electronic component, enabling it to send and receive data, signals, or power to and from external devices. Designers and users can utilize these interfaces to enhance the capabilities and connectivity of the electronic component within a larger system or network.
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART - Co-Processors/DSP
Co-processors and Digital Signal Processors (DSPs) are specialized electronic components designed to handle specific types of computation tasks more efficiently than a general-purpose CPU. Co-processors assist the main processor by executing complex mathematical calculations or processing data in parallel, often enhancing performance for applications like graphics rendering or scientific computations. DSPs, on the other hand, are optimized for processing digital signals in real-time, making them ideal for applications in audio processing, telecommunications, and image processing. Together, these components enable more efficient data handling and improved system performance in various electronic devices.
Signal Processing; C64x+, Multimedia; NEON™ SIMD - Display & Interface Controllers
A unit in a computer system consisting of channels and associated control circuitry that connect a number of visual display units with a central processor.
LCD - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant
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