Rochester Electronics, LLC SN74ACT7882-15FN
Rochester Electronics, LLC SN74ACT7882-15FN
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Rochester Electronics, LLC SN74ACT7882-15FN

FIFOs Memory 74ACT Series 12ns ns FIFO memory IC

Manufacturer No:

SN74ACT7882-15FN

Utmel No:

2071-SN74ACT7882-15FN

Package:

68-LCC (J-Lead)

ECAD Model:

Description:

68 Terminations FIFO memory IC 74ACT Series 36K 2K x 18 12ns

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
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  • Vacuum packagingStep2:Vacuum packaging
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SN74ACT7882-15FN information

Specifications
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Product Details
Rochester Electronics, LLC SN74ACT7882-15FN technical specifications, attributes, parameters and parts with similar specifications to Rochester Electronics, LLC SN74ACT7882-15FN.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    68-LCC (J-Lead)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    74ACT
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    68
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    NICKEL PALLADIUM GOLD
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    4.5V~5.5V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    J BEND
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5V
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27mm
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PQCC-J68
  • Function

    The parameter "Function" in electronic components refers to the specific role or purpose that the component serves within an electronic circuit. It defines how the component interacts with other elements, influences the flow of electrical signals, and contributes to the overall behavior of the system. Functions can include amplification, signal processing, switching, filtering, and energy storage, among others. Understanding the function of each component is essential for designing effective and efficient electronic systems.

    Synchronous
  • Current - Supply (Max)

    The parameter "Current - Supply (Max)" in electronic components refers to the maximum amount of current that a component can draw from a power supply for its operation. This parameter is critical for ensuring that the power supply can adequately meet the demands of the component without causing damage or malfunction. Exceeding this specified maximum current can lead to overheating, reduced performance, or failure of the component. It is essential to consider this value when designing or integrating components into electronic circuits to maintain reliability and functionality.

    400μA
  • Qualification Status

    An indicator of formal certification of qualifications.

    COMMERCIAL
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    5.5V
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    4.5V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    36K 2K x 18
  • Access Time

    Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

    12ns
  • Data Rate

    Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

    67MHz
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    2KX18
  • Memory Width

    Memory width refers to the number of bits that can be read or written to memory at one time. It is an important specification in electronic components, particularly in memory devices like RAM and cache. A wider memory width allows for greater data throughput, enabling faster performance as more data can be processed simultaneously. Memory width can vary among different types of memory and can impact both the complexity and efficiency of data handling within electronic systems.

    18
  • Memory Density

    Memory density in electronic components refers to the amount of data that can be stored in a given physical space or memory module. It is typically measured in bits or bytes per unit area, such as bits per square inch. Higher memory density means that more data can be stored in a smaller space, which is important for devices with limited physical size or power constraints. Memory density is a key factor in determining the capacity and performance of memory devices, such as RAM, ROM, and flash memory, and is a critical consideration in the design and manufacturing of electronic products.

    36864 bit
  • Parallel/Serial

    The parameter "Parallel/Serial" in electronic components refers to the method of data transmission or communication within the component. In parallel communication, multiple bits of data are transmitted simultaneously over multiple channels or wires. This allows for faster data transfer rates but requires more physical connections and can be more susceptible to signal interference.On the other hand, in serial communication, data is transmitted sequentially over a single channel or wire. While serial communication may have slower data transfer rates compared to parallel communication, it is more cost-effective, requires fewer connections, and is less prone to signal interference.The choice between parallel and serial communication depends on the specific requirements of the electronic component and the overall system design, balancing factors such as speed, cost, complexity, and reliability.

    PARALLEL
  • Bus Directional

    Bus Directional is a parameter in electronic components that refers to the ability of a bus to transmit data bidirectionally, meaning it can send and receive data signals. In a bus system, multiple devices are connected to a common communication line, and the bus directional feature allows for efficient data transfer between these devices. This parameter is important for ensuring smooth and reliable communication within a system, as it enables devices to both send and receive data over the same bus line. Having a bus directional capability helps in simplifying the design of electronic systems and facilitates seamless data exchange between connected devices.

    Uni-Directional
  • Retransmit Capability

    Retransmit Capability in electronic components refers to the ability of a device to resend or retransmit data packets that were not successfully received by the intended recipient. This feature is commonly found in communication systems, such as wireless networks, where data transmission may be affected by interference or signal loss. By having retransmit capability, the device can detect when data packets are lost or corrupted and automatically resend them to ensure reliable communication. This helps improve the overall performance and reliability of the system by reducing the chances of data loss or errors during transmission.

    No
  • Programmable Flags Support

    Programmable Flags Support refers to a feature in electronic components that allows users to set specific flags or indicators based on certain conditions or events. These flags can be programmed to trigger actions, alerts, or responses within the component or system. By utilizing programmable flags support, users can customize the behavior of the component to suit their specific requirements or applications. This feature enhances flexibility, control, and automation in electronic systems, enabling more efficient and tailored operation.

    Yes
  • Output Enable

    Output Enable is a parameter in electronic components that refers to a control signal used to enable or disable the output of the component. When the Output Enable signal is active, the component will allow the output to function and provide the desired functionality. Conversely, when the Output Enable signal is inactive, the output will be disabled, preventing any signals or data from passing through the component. This feature is commonly used in integrated circuits, such as multiplexers, buffers, and memory devices, to control the flow of data and manage power consumption. By utilizing the Output Enable parameter, designers can effectively manage the operation of electronic components in a system.

    YES
  • Expansion Type

    Expansion Type in electronic components refers to the method by which a circuit can be expanded or enhanced to accommodate additional functionalities or increased performance. It typically involves the use of expansion slots or connectors that allow for the insertion of additional cards or modules. This enables the integration of extra features, such as increased memory, additional processing power, or specialized functions, while maintaining compatibility with the existing system architecture.

    Depth, Width
  • Cycle Time

    Cycle time in electronic components refers to the duration it takes for a circuit or system to complete one full cycle of operation. It encompasses the time needed to perform a series of tasks, such as processing, data transfer, or signal propagation. Shorter cycle times lead to increased throughput and improved performance in digital systems, while longer cycle times may result in delays and reduced efficiency. Cycle time is a critical parameter in the design and evaluation of various electronic devices and systems, influencing their speed and responsiveness.

    15 ns
  • Length
    24.23mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    4.57mm
  • Width
    24.23mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Rochester Electronics, LLC SN74ACT7882-15FN.

SN74ACT7882-15FN Overview

68-LCC (J-Lead) is a package that contains FIFO memory chip.The package comes in a case of Tube.There is a memory of 36K 2K x 18 available for storing data and applications.It is recommended that the temperature be regulated to 0°C~70°C to ensure reliable operation.Mounting type Surface Mount is assigned to the FIFO memory.For operation, a voltage of 4.5V~5.5V is used.It is part of the 74ACT series of memory logics.As far as operating current is concerned, it has a maximum of 400μA.When the supply voltage is 5V, high efficiency is possible.I found that it has 68 terminations in FIFO means.There is a FIFO memory IC's maximum supply voltage of 5.5V .To ensure normal operation, make sure the supply voltage (Vsup) is above 4.5V .

SN74ACT7882-15FN Features

36K 2K x 18 memory size
74ACT series

SN74ACT7882-15FN Applications

There are a lot of Rochester Electronics, LLC
SN74ACT7882-15FN FIFOs Memory applications.


  • Cameras
  • Multimedia
  • TVs
  • Computers
  • Disk Controllers
  • Communications
  • Networking
  • Multi-stage synchronizer
  • Signal processing
  • Data communications
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