Rochester Electronics LLC XPC8240LZU200E
Rochester Electronics LLC XPC8240LZU200E
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Rochester Electronics LLC XPC8240LZU200E

Microprocessor 32-Bit

Manufacturer No:

XPC8240LZU200E

Utmel No:

2071-XPC8240LZU200E

Package:

-

ECAD Model:

Description:

1.27 mm 32-bit Microprocessor

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User Guide

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
XPC8240LZU200E information

Specifications
Documents & Media
Product Details
Rochester Electronics LLC XPC8240LZU200E technical specifications, attributes, parameters and parts with similar specifications to Rochester Electronics LLC XPC8240LZU200E.
  • Type
    Parameter
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    352
  • Rohs Code
    No
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    ROCHESTER ELECTRONICS LLC
  • Part Package Code
    BGA
  • Package Description
    35 X 35 MM, 1.27 MM PITCH, TBGA-352
  • Clock Frequency-Max
    66 MHz
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    LBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE
  • Supply Voltage-Max
    2.625 V
  • Supply Voltage-Min
    2.375 V
  • Supply Voltage-Nom
    2.5 V
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e0
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    Yes
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    TIN LEAD
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    ALSO REQUIRES 3.3V I/O SUPPLY
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    220
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27 mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    unknown
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    30
  • Pin Count

    a count of all of the component leads (or pins)

    352
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    S-PBGA-B352
  • Qualification Status

    An indicator of formal certification of qualifications.

    COMMERCIAL
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    200 MHz
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    MICROPROCESSOR, RISC
  • Bit Size

    In electronic components, "Bit Size" refers to the number of bits that can be processed or stored by a particular component. A bit is the smallest unit of data in computing and can have a value of either 0 or 1. The Bit Size parameter is commonly used to describe the capacity or performance of components such as microprocessors, memory modules, and data buses. A larger Bit Size generally indicates a higher processing capability or storage capacity, allowing for more complex operations and larger amounts of data to be handled efficiently. It is an important specification to consider when selecting electronic components for specific applications that require certain levels of performance and data processing capabilities.

    32
  • Seated Height-Max

    Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.

    1.65 mm
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    32
  • Boundary Scan

    Boundary scan is a testing technique used in electronic components to verify the interconnections between integrated circuits on a printed circuit board. It allows for the testing of digital circuits by providing a way to shift data in and out of devices through a serial interface. This method helps in identifying faults such as short circuits, open circuits, and incorrect connections without the need for physical access to the individual components. Boundary scan is commonly used during manufacturing, testing, and debugging processes to ensure the quality and reliability of electronic products.

    YES
  • Low Power Mode

    Low Power Mode is a feature found in electronic components, such as microcontrollers, processors, and devices, that allows them to operate at reduced power consumption levels. When activated, the component typically reduces its clock speed, voltage, or disables certain functions to conserve energy. This mode is often used to extend battery life in portable devices or reduce overall power consumption in energy-efficient systems. Low Power Mode can be triggered automatically based on certain conditions, such as low battery levels, or manually by the user or software. It is a crucial feature in modern electronics to balance performance with energy efficiency.

    YES
  • External Data Bus Width

    The External Data Bus Width refers to the number of bits that can be transmitted simultaneously between a microprocessor and external components, such as memory or peripherals. It determines the amount of data that can be transferred in a single clock cycle. A wider data bus allows for faster data transfer rates and can improve overall system performance. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with larger widths generally offering higher throughput but requiring more complex circuitry. The External Data Bus Width is an important parameter to consider when designing or evaluating electronic components to ensure compatibility and optimal performance.

    32
  • Format

    In electronic components, the parameter "Format" typically refers to the physical size, shape, and configuration of the component. It describes the overall dimensions and layout of the component, including factors such as package type, lead spacing, and mounting options. The format of an electronic component is important for determining how it can be installed, connected, and integrated into a circuit or system. Different formats are designed to meet specific requirements for space constraints, heat dissipation, electrical performance, and compatibility with other components. Manufacturers often provide detailed specifications for the format of their components to ensure proper selection and usage in electronic designs.

    FLOATING POINT
  • Integrated Cache

    Integrated Cache refers to a type of memory storage that is built directly into a microprocessor or other electronic component. It is used to temporarily store frequently accessed data and instructions to speed up processing and reduce latency. The integrated cache is designed to provide quick access to data that the processor needs to perform its tasks efficiently. By storing data closer to the processor, the integrated cache helps improve overall system performance by reducing the time it takes to retrieve information from the main memory. The size and speed of the integrated cache can have a significant impact on the performance of the electronic component, making it an important parameter to consider when evaluating the capabilities of a device.

    YES
  • Saturation Current

    Saturation current is the maximum current that flows through a diode when it is in the forward-biased condition, and additional increases in voltage do not lead to significant increases in current. It represents the point where all available carriers have been used for conduction, and further increases in voltage only result in a minimal change in current. In transistors, saturation current refers to the collector current in a saturated state, where the transistor is fully ON and providing the maximum amplification of input signals. This parameter is crucial for understanding the behavior of semiconductor devices in various operating conditions.

    3
  • Length
    35 mm
  • Width
    35 mm
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Download datasheets and manufacturer documentation for Rochester Electronics LLC XPC8240LZU200E.

XPC8240LZU200E Overview

As far as the uPs/uCs/Peripheral ICs type is concerned, this is a MICROPROCESSOR, RISC. It has a 32-Bit architecture. This CPU has a wide external data Bus width of 32. 352 pins are injected into the part body. Don’t miss additional features of the embedded microprocessor such as: ALSO REQUIRES 3.3V I/O SUPPLY.

XPC8240LZU200E Features

32-Bit Structure

XPC8240LZU200E Applications

There are a lot of Rochester Electronics LLC
XPC8240LZU200E Microprocessor applications.


  • Measurement and control field
  • Automatic control
  • Equipment control
  • Instrument control
  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan