ROHM Semiconductor BU4052BCFV-E2
ROHM Semiconductor BU4052BCFV-E2
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ROHM Semiconductor BU4052BCFV-E2

Multiplexers ICs 5V SP4T Analog Switches 16 Pins

Manufacturer No:

BU4052BCFV-E2

Manufacturer:

ROHM Semiconductor

Utmel No:

2078-BU4052BCFV-E2

Package:

16-LSSOP (0.173, 4.40mm Width)

ECAD Model:

Description:

SP4T 160Ohm DUAL Analog Switches BU4052 16 Pins 300nA 5V 16-LSSOP (0.173, 4.40mm Width)

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BU4052BCFV-E2 information

Specifications
Product Details
Product Comparison
ROHM Semiconductor BU4052BCFV-E2 technical specifications, attributes, parameters and parts with similar specifications to ROHM Semiconductor BU4052BCFV-E2.
  • Type
    Parameter
  • Factory Lead Time
    7 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    16-LSSOP (0.173, 4.40mm Width)
  • Number of Pins
    16
  • Turn Off Delay Time

    It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

    550 ns
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2008
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e2
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    16
  • Resistance

    Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.

    160Ohm
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    TIN COPPER
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    620mW
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65mm
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    10
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    BU4052
  • Pin Count

    a count of all of the component leads (or pins)

    16
  • Polarity

    In electronic components, polarity refers to the orientation or direction in which the component must be connected in a circuit to function properly. Components such as diodes, capacitors, and LEDs have polarity markings to indicate which terminal should be connected to the positive or negative side of the circuit. Connecting a component with incorrect polarity can lead to malfunction or damage. It is important to pay attention to polarity markings and follow the manufacturer's instructions to ensure proper operation of electronic components.

    Non-Inverting
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5/15V
  • Number of Channels
    4
  • Number of Circuits
    2
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    18V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    3V
  • Analog IC - Other Type

    Analog IC - Other Type is a parameter used to categorize electronic components that are integrated circuits (ICs) designed for analog signal processing but do not fall into more specific subcategories such as amplifiers, comparators, or voltage regulators. These ICs may include specialized analog functions such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), voltage references, or signal conditioning circuits. They are typically used in various applications where precise analog signal processing is required, such as in audio equipment, instrumentation, communication systems, and industrial control systems. Manufacturers provide detailed specifications for these components to help engineers select the most suitable IC for their specific design requirements.

    DIFFERENTIAL MULTIPLEXER
  • Operating Supply Current

    Operating Supply Current, also known as supply current or quiescent current, is a crucial parameter in electronic components that indicates the amount of current required for the device to operate under normal conditions. It represents the current drawn by the component from the power supply while it is functioning. This parameter is important for determining the power consumption of the component and is typically specified in datasheets to help designers calculate the overall power requirements of their circuits. Understanding the operating supply current is essential for ensuring proper functionality and efficiency of electronic systems.

    15μA
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    15 ns
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    550 ns
  • Logic Function

    In electronic components, the term "Logic Function" refers to the specific operation or behavior of a component based on its input signals. It describes how the component processes the input signals to produce the desired output. Logic functions are fundamental to digital circuits and are used to perform logical operations such as AND, OR, NOT, and XOR.Each electronic component, such as logic gates or flip-flops, is designed to perform a specific logic function based on its internal circuitry. By understanding the logic function of a component, engineers can design and analyze complex digital systems to ensure proper functionality and performance. Different logic functions can be combined to create more complex operations, allowing for the creation of sophisticated digital devices and systems.

    Demultiplexer, Multiplexer
  • Number of Inputs
    8
  • Supply Type

    Supply Type in electronic components refers to the classification of power sources used to operate the component. It indicates whether the component requires DC or AC power, and if DC, specifies the voltage levels such as low, medium, or high. Different supply types can affect the performance, compatibility, and application of the component in electronic circuits. Understanding the supply type is crucial for proper component selection and integration into electronic designs.

    Single
  • Supply Current-Max (Isup)

    Supply Current-Max (Isup) refers to the maximum amount of current that an electronic component can draw from its power supply during operation. It represents the peak current demand of the device under normal operating conditions and is critical for ensuring that the power supply can adequately support the component's needs without risking damage or malfunction. This parameter is essential for designing circuits and selecting appropriate power supply units to prevent overloading and ensure reliable performance.

    0.015mA
  • Max Dual Supply Voltage

    A Dual power supply is a regular direct current power supply. It can provide a positive as well as negative voltage. It ensures stable power supply to the device as well as it helps to prevent system damage.

    9V
  • On-State Resistance (Max)

    The "On-State Resistance (Max)" parameter in electronic components refers to the maximum resistance exhibited by the component when it is in the fully conducting state. This resistance is typically measured when the component is carrying the maximum specified current. A lower on-state resistance indicates better conductivity and efficiency of the component when it is in the on-state. It is an important parameter to consider when selecting components for applications where low power dissipation and high efficiency are critical factors.

    160Ohm
  • Min Dual Supply Voltage

    The parameter "Min Dual Supply Voltage" in electronic components refers to the minimum voltage required for the proper operation of a device that uses dual power supplies. Dual power supplies typically consist of a positive and a negative voltage source. The "Min Dual Supply Voltage" specification ensures that both the positive and negative supply voltages are within a certain range to guarantee the device functions correctly. It is important to adhere to this parameter to prevent damage to the component and ensure reliable performance.

    1.5V
  • Multiplexer/Demultiplexer Circuit

    A Multiplexer/Demultiplexer Circuit is an electronic component used in digital circuits to select one of several input signals and route it to a single output. A multiplexer, also known as a "mux," is used to combine multiple input signals into a single output, while a demultiplexer, also known as a "demux," is used to take a single input and route it to one of several possible outputs. These circuits are commonly used in data transmission, communication systems, and digital signal processing applications to efficiently manage and control the flow of data. Multiplexers and demultiplexers play a crucial role in optimizing the use of resources and improving the overall performance of electronic systems.

    4:1
  • Off-state Isolation-Nom

    Off-state Isolation-Nom is a parameter used to measure the level of isolation between two electronic components or circuits when one of them is in the off state. It indicates the ability of the component to prevent unwanted signals or interference from passing through when it is not actively conducting. The parameter is typically expressed in decibels (dB) and is an important consideration in designing and selecting components for applications where isolation between different parts of a circuit is critical to prevent crosstalk or interference. Higher values of Off-state Isolation-Nom indicate better isolation performance, leading to improved overall system reliability and performance.

    50 dB
  • Current - Leakage (IS(off)) (Max)

    Current - Leakage (IS(off)) (Max) refers to the maximum amount of current that flows through a device when it is in its off state, meaning it is not conducting or not intended to be active. This parameter is crucial in determining the efficiency of electronic components, especially in battery-operated devices, as higher leakage currents can lead to increased power consumption and reduced battery life. It is typically measured in microamperes (µA) or milliamperes (mA) and helps engineers assess the suitability of a component for low-power applications.

    300nA
  • Channel Capacitance (CS(off), CD(off))

    Channel capacitance (CS(off), CD(off)) in electronic components refers to the capacitance associated with the channel of a field-effect transistor (FET) when it is turned off. CS(off) represents the capacitance between the source and the gate of the FET, while CD(off) represents the capacitance between the drain and the gate. These capacitances play a crucial role in determining the high-frequency performance and switching characteristics of the FET. Understanding and controlling these capacitances is essential for optimizing the performance of electronic circuits, especially in high-speed applications where minimizing parasitic capacitances is critical for achieving desired signal integrity and efficiency.

    10pF
  • On-state Resistance Match-Nom

    On-state Resistance Match-Nom refers to the nominal or standard value of the on-state resistance for a specific electronic component, such as a transistor or a MOSFET, when it is in its "on" state. This parameter indicates how much resistance the component presents to current flow during its conducting phase, which affects power dissipation and efficiency. Matching this value across multiple devices is crucial for ensuring consistent performance in applications where several components operate together.

    10Ohm
  • Switch Circuit

    establishes connections between links, on demand and as available, in order to establish an end-to-end circuit between devices.

    SP4T
  • Voltage - Supply, Single (V+)

    Voltage - Supply, Single (V+) refers to the positive voltage supply needed for an electronic component to operate. It indicates the range of voltage levels that can be applied to the component from a single power source. This parameter is crucial for determining compatibility with other components in a circuit and ensuring proper functionality. It typically defines the minimum and maximum voltage limits within which the device can safely and effectively operate.

    3V~18V
  • Length
    5mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Product Description:

The BU4052BCFV-E2 is a surface-mount, 16-pin, 4:1 differential multiplexer/demultiplexer from ROHM Semiconductor. This IC is designed to operate in a wide range of applications where high-speed, low-power, and low-leakage current are required. The device features a 4:1 multiplexer/demultiplexer circuit with 8 inputs and 4 channels, allowing for efficient signal routing and switching.

Features:

  • Low power consumption: Operating supply current of 15μA
  • Low leakage current: Maximum leakage current of 300nA
  • High isolation: Off-state isolation of 50 dB
  • Fast switching: Propagation delay of 15 ns
  • Wide operating temperature range: -40°C to 85°C
  • RoHS3 compliant and lead-free

Applications:

  • Primary applications: High-speed data acquisition systems, medical devices, and industrial automation systems
  • Secondary applications: Audio and video equipment, telecommunications, and automotive systems

Alternative Parts:

  • BU4052 (base part number)

Embedded Modules:

  • This component is used in various embedded systems, including data acquisition boards, medical devices, and industrial control systems.

Frequently Asked Questions:

Q: What is the maximum power dissipation of the BU4052BCFV-E2? A: The maximum power dissipation is 620mW.

Q: What is the operating supply voltage range of the device? A: The operating supply voltage range is 3V to 18V.

Q: What is the propagation delay of the BU4052BCFV-E2? A: The propagation delay is 15 ns.

Q: Is the BU4052BCFV-E2 radiation hardened? A: No, the device is not radiation hardened.

Q: What is the packaging type of the BU4052BCFV-E2? A: The packaging type is Tape & Reel (TR).

Q: What is the lead time for the BU4052BCFV-E2? A: The lead time is 7 weeks.

Q: Is the BU4052BCFV-E2 RoHS compliant? A: Yes, the device is RoHS3 compliant and lead-free.

The three parts on the right have similar specifications to ROHM Semiconductor & BU4052BCFV-E2.
BU4052BCFV-E2 Relevant information

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