Samtec HQCD-090-12.00-TTR-STR-1

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

Thermal resistance of a package in electronic components refers to the ability of a package to dissipate heat generated by the component. It is quantified as the temperature rise of the package per unit of power dissipated, typically expressed in degrees Celsius per watt. A lower thermal resistance value indicates better heat dissipation capabilities, ensuring the component operates within safe temperature limits. This parameter is critical for maintaining performance, reliability, and longevity of electronic devices by preventing overheating.

"Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

Shielding in electronic components refers to the practice of enclosing or surrounding sensitive electronic circuits or components with a conductive material to protect them from electromagnetic interference (EMI) or radio frequency interference (RFI). The shielding material acts as a barrier that blocks or absorbs unwanted electromagnetic signals, preventing them from affecting the performance of the electronic device. Shielding can be achieved using materials such as metal enclosures, conductive coatings, or shielding tapes. Proper shielding is essential in electronic design to ensure the reliable operation of electronic devices in environments where electromagnetic interference is present.

Contact finish refers to the surface coating or treatment applied to the electrical contacts of electronic components. This finish is crucial for ensuring reliable electrical connections and preventing corrosion or oxidation of the contacts. Common contact finishes include gold, silver, tin, and nickel, each offering different levels of conductivity, durability, and resistance to environmental factors. The choice of contact finish depends on the specific application requirements, such as operating conditions, cost considerations, and compatibility with other components in the circuit. Selecting the appropriate contact finish is essential for maintaining the performance and longevity of electronic devices.

The parameter "Voltage - Forward (Vf) (Typ)" in electronic components refers to the typical forward voltage drop across the component when it is conducting current in the forward direction. It is a crucial characteristic of components like diodes and LEDs, indicating the minimum voltage required for the component to start conducting current. The forward voltage drop is typically specified as a typical value because it can vary slightly based on factors such as temperature and manufacturing tolerances. Designers use this parameter to ensure that the component operates within its specified voltage range and to calculate power dissipation in the component.

the angle at which a display can be viewed with acceptable visual performance.

Cable Termination is the connection of the wire or fiber to a device, such as equipment, panels or a wall outlet, which allows for connecting the cable to other cables or devices.

Current - Test is a parameter in electronic components that refers to the maximum current that the component can handle during testing without being damaged. This parameter is crucial for determining the operational limits of the component and ensuring its reliability under specified conditions. It is typically specified in the component's datasheet and is important for designers and engineers to consider when designing circuits to prevent overloading the component. Testing the component at or below the specified "Current - Test" value helps ensure its proper functioning and longevity in the intended application.

In the context of electronic components, "Usage" refers to the intended or recommended application or operation of the component within an electronic system. This parameter provides guidance on how the component should be utilized to ensure optimal performance, reliability, and longevity. It may include specifications such as voltage ratings, current ratings, temperature ranges, environmental conditions, and other factors that impact the proper functioning of the component. Understanding and adhering to the usage guidelines provided by the manufacturer is crucial in designing and implementing electronic circuits to prevent damage and ensure the component operates within its specified parameters.

The parameter "Pitch - Connector" in electronic components refers to the distance between the center of one pin or contact to the center of the adjacent pin or contact on a connector. It is a crucial specification that determines the compatibility and alignment of connectors with corresponding mating components. The pitch measurement is typically expressed in millimeters or inches and plays a significant role in ensuring proper electrical connections and signal integrity in electronic devices. Manufacturers provide detailed pitch specifications to help users select the right connectors for their specific applications.

Lumens/Watt @ Current - Test is a measurement used to evaluate the efficiency of light-emitting components, such as LEDs, under specific test conditions. It indicates the amount of luminous flux produced (in lumens) for every watt of electrical power consumed by the device at a given current level. This metric helps in assessing the brightness and energy efficiency of lighting solutions, allowing for better comparisons between different products and technologies. Higher values signify more efficient light sources that produce more light for less energy consumed.

The Color Rendering Index (CRI) is a measurement of how accurately a light source can render colors compared to natural light. It is a scale from 0 to 100, with higher values indicating better color rendering. A CRI value of 100 means the light source can accurately reproduce all colors. A high CRI is important in applications where color accuracy is crucial, such as in photography, art galleries, and retail settings. It helps ensure that colors appear true and vibrant under the light source.

The parameter "Pitch - Cable" in electronic components refers to the distance between adjacent conductors or wires in a cable assembly. It is typically measured in millimeters or inches and is an important specification to consider when designing or selecting cables for electronic applications. The pitch determines the spacing and arrangement of the conductors within the cable, which can impact factors such as signal integrity, crosstalk, and overall performance of the cable assembly. Choosing the appropriate pitch for a cable is crucial to ensure proper functionality and reliability in electronic systems.

The parameter "Current - Max" in electronic components refers to the maximum amount of electrical current that a component can safely handle without risking damage or degradation. Exceeding this current can lead to overheating, reduced performance, or failure of the component. This specification is crucial for ensuring reliable operation and longevity of electronic circuits and devices. It is typically specified in amperes (A) and is a key factor in circuit design and component selection.

Flux at 25°C, Current - Test refers to the amount of electrical current that flows through a material or component when tested under specified conditions at a temperature of 25 degrees Celsius. It indicates the performance and reliability of the electronic component under normal operating conditions. This parameter is crucial for evaluating the heat dissipation and efficiency of the component in various electronic applications.

The parameter "Flux @ 85°C, Current - Test" in electronic components refers to the measurement of the flow of electric current through a circuit or component when subjected to an elevated temperature of 85 degrees Celsius. It is often used to assess the performance and reliability of electronic materials and soldering processes under thermal stress. This parameter is critical for ensuring that components will function correctly in high-temperature environments, providing insights into their durability and operational effectiveness.

In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

Contact Finish Thickness refers to the measurement of the layer of conductive material applied to the surfaces of electrical contacts in electronic components. This thickness is critical as it influences the electrical conductivity, solderability, wear resistance, and overall performance of the connection. The materials used for the contact finish can include gold, silver, or other metals, and the specified thickness is designed to ensure reliable operation over the component's lifespan.