Samtec Inc. FLE-122-01-G-DV

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

Contact shape in electronic components refers to the physical geometry of the interface where electrical connections are made. It plays a critical role in determining the quality and reliability of the connection, impacting factors such as resistance, current density, and heat dissipation. Various shapes, such as flat, cylindrical, or custom profiles, influence the contact area, enabling designers to optimize performance for specific applications. The contact shape also affects the mechanical stability of the connection, influencing wear and longevity.

The parameter "Housing Material" in electronic components refers to the material used to encase or protect the internal circuitry of the component. The housing material plays a crucial role in providing physical protection, insulation, and environmental resistance to the electronic component. Common housing materials include plastics, metals, ceramics, and composites, each offering different levels of durability, heat resistance, and electrical properties. The choice of housing material is important in determining the overall performance, reliability, and longevity of the electronic component in various operating conditions.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

There are 5 Main Types of Fastening Type: Screws, Nails, Bolts, Anchors, Rivets.

MIL Conformance refers to the compliance of electronic components with military standards set by the Department of Defense. These standards define rigorous requirements for reliability, performance, and durability under extreme conditions. Components that meet MIL Conformance are often used in defense, aerospace, and other critical applications where failure is not an option. Adherence to these standards ensures that the components can withstand harsh environments, such as extreme temperatures, vibrations, and humidity.

DIN Conformance refers to the compliance of an electronic component with the standards set by the Deutsches Institut für Normung (DIN), which is the German Institute for Standardization. DIN standards cover a wide range of technical specifications and requirements for various products, including electronic components. When a component is labeled as DIN-conformant, it means that it meets the specific criteria outlined by DIN for factors such as dimensions, materials, performance, and safety. Ensuring DIN conformance helps to guarantee interoperability, quality, and reliability of electronic components in various applications and industries. Manufacturers often adhere to DIN standards to demonstrate the quality and reliability of their products to customers and to ensure compatibility with other DIN-compliant devices.

IEC Conformance refers to the compliance of electronic components with standards set by the International Electrotechnical Commission (IEC). These standards ensure that the components meet specific safety, performance, and interoperability criteria. Adhering to IEC conformance helps manufacturers produce reliable and compatible products, facilitating international trade and promoting consumer safety. Components that conform to IEC standards are often preferred in global markets due to their quality assurance and regulatory acceptance.

In electronic components, the "Filter Feature" parameter refers to the capability of a component to filter or block certain frequencies of signals while allowing others to pass through. Filters are used to remove unwanted noise or interference from a signal, ensuring that only the desired frequencies are transmitted or received. The filter feature can be implemented using various techniques such as capacitors, inductors, resistors, or active components like operational amplifiers. Different types of filters, such as low-pass, high-pass, band-pass, and band-stop filters, are designed to cater to specific frequency ranges and applications. Overall, the filter feature plays a crucial role in maintaining signal integrity and improving the performance of electronic circuits.

Contact Type in electronic components refers to the specific design and configuration of the electrical contacts used to establish connections between components or devices. The contact type determines how the electrical signals are transmitted between the components, and it can vary based on factors such as the application requirements, signal type, and environmental conditions. Common contact types include pin contacts, socket contacts, surface mount contacts, and wire-to-board contacts. Understanding the contact type is crucial for ensuring proper connectivity and reliable performance in electronic systems.

In electronic components, "Mixed Contacts" refers to a type of contact arrangement where different types of contacts are used within the same component. This can include a combination of different contact materials, such as gold-plated contacts for signal transmission and silver-plated contacts for power connections. Mixed contacts can also refer to a combination of different contact styles, such as pin contacts and socket contacts within the same component.The use of mixed contacts allows for optimized performance and reliability in electronic components by leveraging the specific advantages of each contact type. For example, gold-plated contacts offer excellent conductivity and corrosion resistance, while silver-plated contacts provide high current-carrying capacity. By incorporating mixed contacts, manufacturers can tailor the component to meet the specific requirements of the application, ensuring efficient and reliable operation.

The parameter "Current Rating (Amps)" in electronic components refers to the maximum amount of electrical current that the component can safely handle without being damaged. It is typically measured in amperes (A) and is an important specification to consider when designing or selecting components for a circuit. Exceeding the current rating of a component can lead to overheating, malfunction, or even failure of the component. It is crucial to ensure that the current rating of a component matches the requirements of the circuit to prevent any potential issues and ensure reliable operation.

The parameter "Insulation Height" in electronic components refers to the distance between two conductive elements that are separated by an insulating material. It is a crucial specification that determines the level of electrical isolation and protection against short circuits or electrical interference. Insulation height is typically measured in millimeters or inches and is important for ensuring the safe and reliable operation of electronic devices by preventing unintended electrical connections between components. Manufacturers provide insulation height values in their product datasheets to help designers and engineers select the appropriate components for their applications.

In the context of electronic components, the parameter "Style" typically refers to the physical design or form factor of the component. This includes the shape, size, and layout of the component, as well as any specific features that distinguish it from other components. Different styles of components are often designed to fit specific applications or requirements, such as surface mount components for compact circuit board designs or through-hole components for more robust connections. Understanding the style of a component is important for selecting the right part for a particular electronic design and ensuring compatibility with other components and the overall system.

Pitch - Mating refers to the distance between the centers of two adjacent pins or contacts in a connector or electronic component when they are engaged or aligned for connection. This parameter is critical for ensuring proper alignment, compatibility, and spacing in electronic assemblies, influencing both mechanical and electrical performance. A correct mating pitch is essential for reliable signal transmission and to prevent issues such as short circuits or misalignment during assembly.

In the context of electronic components, the term "Reference Standard" typically refers to a specific set of guidelines, specifications, or requirements that serve as a benchmark for evaluating the quality, performance, and characteristics of the component. These standards are established by organizations such as the International Electrotechnical Commission (IEC), the Institute of Electrical and Electronics Engineers (IEEE), or specific industry bodies.Reference standards help ensure consistency and interoperability among different components, as they provide a common framework for manufacturers, designers, and users to adhere to. They outline parameters such as electrical properties, mechanical dimensions, environmental conditions, and safety considerations that the component must meet to be considered compliant.By referencing these standards, manufacturers can design and produce components that meet industry-recognized criteria, which in turn helps users select the right components for their applications with confidence. Adhering to reference standards also facilitates regulatory compliance and promotes overall quality and reliability in electronic systems.

Reliability in electronic components refers to the ability of a component to perform its required functions under stated conditions for a specified period of time. It is a measure of the likelihood that a component will not fail during its intended lifespan. High reliability indicates that the component is less likely to experience unexpected failures, which is crucial for maintaining the overall performance and safety of electronic systems. Factors affecting reliability include material quality, manufacturing processes, and environmental conditions.

Row Spacing - Mating is a parameter in electronic components that refers to the distance between rows of mating connectors or components. It is a critical specification that ensures proper alignment and connection between two mating parts. The row spacing is typically measured center-to-center between adjacent rows and is important for ensuring compatibility and proper functioning of the components. Manufacturers provide specific row spacing requirements to ensure that mating components fit together securely and function as intended in electronic systems.

The "PCB Contact Pattern" refers to the layout or arrangement of contact points on a printed circuit board (PCB) where electronic components are mounted or connected. This pattern determines how components will be physically and electrically connected to the PCB. The contact pattern typically includes pads, vias, traces, and other features that facilitate the soldering or mounting of components onto the board. It is crucial for ensuring proper electrical connections and reliable performance of the electronic device. Designing an appropriate PCB contact pattern is essential for the functionality, efficiency, and durability of the electronic components and the overall circuitry.

Mating Information in electronic components refers to the specifications and details related to how a particular component connects or interfaces with other components or systems. This information typically includes details such as the type of connectors, pin configurations, voltage and current ratings, signal compatibility, and physical dimensions required for proper mating and connection. Understanding the mating information is crucial for ensuring compatibility and proper functioning of electronic components within a system or circuit. Manufacturers provide detailed mating information in datasheets to help engineers and designers select and integrate components effectively.

Body breadth in electronic components refers to the width of the physical body of a component, such as a resistor, capacitor, or integrated circuit. This measurement is crucial for ensuring proper fit within a circuit board or enclosure. It can affect the component's thermal performance, mechanical stability, and overall compatibility with other components in a design. Body breadth is typically specified in millimeters or inches and is an important factor in the selection and design of electronic assemblies.

Housing color in electronic components refers to the color of the protective casing or enclosure that surrounds the component. It can play a role in visual identification, aiding in easy recognition during assembly or maintenance. Additionally, the housing color may also have implications for heat dissipation, aesthetic considerations, or regulatory compliance depending on the application or industry standards.

Contact resistance refers to the resistance encountered at the point of contact between two conductive materials or components. It is a measure of how well the two materials make electrical contact with each other. High contact resistance can lead to voltage drops, power losses, and inefficient electrical connections. It is typically measured in ohms and is an important parameter to consider in electronic components such as connectors, switches, and relays. Lower contact resistance is desirable for ensuring reliable and efficient electrical connections in electronic circuits.

Mating Contact Pitch refers to the distance between the center of one contact point to the center of the adjacent contact point in electronic components such as connectors or sockets. This parameter is crucial for ensuring proper alignment and connection between mating components. It helps determine the compatibility and interchangeability of different components, as components with the same mating contact pitch can be easily connected and disconnected. Manufacturers provide specifications for mating contact pitch to help users select compatible components for their electronic systems.

PCB Contact Row Spacing refers to the distance between the centers of adjacent contact rows in a printed circuit board (PCB). It is an important parameter in the design and layout of electronic components, particularly for connectors and sockets. Proper row spacing ensures compatibility with corresponding component leads and facilitates efficient circuit assembly and operation. The spacing can affect the overall footprint of the component and influences layout considerations for routing traces on the PCB.

Durability in electronic components refers to the ability of a component to withstand various environmental conditions, mechanical stress, and operational factors over an extended period of time without degradation in performance. It is a measure of the component's reliability and longevity in different operating conditions. Factors that can affect the durability of electronic components include temperature fluctuations, humidity, vibration, shock, and electrical stress. Manufacturers often provide durability ratings or specifications to indicate the expected lifespan or performance under specific conditions, helping users select components that meet their durability requirements for a given application. Ensuring the durability of electronic components is crucial for maintaining the overall reliability and functionality of electronic devices.

Insertion Force-Max is a parameter used to specify the maximum force required to insert an electronic component into its corresponding socket or connector. It is a critical specification as it ensures that the component is securely and properly seated in the socket without causing any damage. This parameter is typically measured in units of force, such as Newtons or pounds-force, and is important for ensuring the reliability and longevity of the electronic assembly. Manufacturers provide this specification to help users understand the amount of force that can be safely applied during the insertion process to prevent any potential issues or failures.

Plating thickness in electronic components refers to the measurement of the thickness of the metal plating applied to various surfaces of the component. This plating is typically done to enhance the component's conductivity, corrosion resistance, and solderability. The plating thickness is an important parameter as it directly affects the performance and reliability of the electronic component. Manufacturers specify the required plating thickness to ensure that the component meets the desired electrical and mechanical properties for its intended application. Testing and quality control measures are often employed to verify that the plating thickness meets the specified requirements.

Contact Finish Thickness - Mating is a parameter in electronic components that refers to the thickness of the plating or finish on the contact surfaces of a connector or terminal that come into direct contact with mating components. This parameter is crucial for ensuring proper electrical conductivity and mechanical stability during mating and unmating processes. The contact finish thickness affects the overall reliability and performance of the connection by influencing factors such as contact resistance, wear resistance, and corrosion resistance. Manufacturers specify this parameter to ensure compatibility and optimal performance in various applications.

Contact Finish Thickness - Post is a parameter in electronic components that refers to the thickness of the plating or finish applied to the contact post of a component. The contact post is the part of the component that makes physical contact with other components or connectors. The thickness of the contact finish is important as it can affect the overall performance and reliability of the component. A thicker contact finish can provide better conductivity and durability, while a thinner finish may be more cost-effective but could be more prone to wear and corrosion. Manufacturers specify the contact finish thickness to ensure proper functioning of the component in various operating conditions.

The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.