Samtec, Inc. QMS-052-06.75-L-D-PT8

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

The parameter "Housing Material" in electronic components refers to the material used to encase or protect the internal circuitry of the component. The housing material plays a crucial role in providing physical protection, insulation, and environmental resistance to the electronic component. Common housing materials include plastics, metals, ceramics, and composites, each offering different levels of durability, heat resistance, and electrical properties. The choice of housing material is important in determining the overall performance, reliability, and longevity of the electronic component in various operating conditions.

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

In electronic components, "Pitch" refers to the distance between the center of one pin or lead to the center of the adjacent pin or lead on a component, such as an integrated circuit (IC) or a connector. It is a crucial parameter as it determines the spacing and alignment of the pins or leads on a component, which in turn affects how the component can be mounted on a circuit board or connected to other components.The pitch measurement is typically expressed in millimeters (mm) or inches (in) and plays a significant role in determining the overall size and layout of a circuit board. Components with different pitches may require specific types of circuit boards or connectors to ensure proper alignment and connection. Designers must carefully consider the pitch of components when designing circuit layouts to ensure compatibility and proper functionality of the electronic system.

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

"Termination style" in electronic components refers to the method used to connect the component to a circuit board or other electronic devices. It determines how the component's leads or terminals are designed for soldering or mounting onto the circuit board. Common termination styles include through-hole, surface mount, and wire lead terminations.Through-hole components have leads that are inserted through holes in the circuit board and soldered on the other side. Surface mount components have flat terminals that are soldered directly onto the surface of the circuit board. Wire lead terminations involve attaching wires to the component for connection.The choice of termination style depends on factors such as the type of component, the manufacturing process, and the space available on the circuit board. Different termination styles offer various advantages in terms of ease of assembly, reliability, and space efficiency in electronic designs.

In the context of electronic components, the parameter "Product" typically refers to the specific item or device being discussed or analyzed. It can refer to a physical electronic component such as a resistor, capacitor, transistor, or integrated circuit. The product parameter may also encompass more complex electronic devices like sensors, displays, microcontrollers, or communication modules.Understanding the product parameter is crucial in electronics as it helps identify the characteristics, specifications, and functionality of the component or device in question. This information is essential for selecting the right components for a circuit design, troubleshooting issues, or comparing different products for a particular application. Manufacturers often provide detailed product datasheets that outline key specifications, performance characteristics, and application guidelines to assist engineers and designers in utilizing the component effectively.

The "Mounting Angle" parameter in electronic components refers to the angle at which a component is mounted on a circuit board or within an electronic system. It is important to consider the mounting angle during the design and assembly process to ensure proper functionality and performance of the component. The mounting angle can affect factors such as signal integrity, thermal management, and mechanical stress on the component. Manufacturers often provide specific guidelines or recommendations for the mounting angle of their components to ensure optimal operation and reliability.

Stack height in electronic components refers to the distance between the top and bottom surfaces of a component when multiple components are stacked on top of each other. This parameter is important in applications where space constraints are a concern, as it determines the overall height of the stacked components. Designers need to consider the stack height when selecting components to ensure proper fit and functionality within the given space. Additionally, stack height can impact the overall performance and thermal management of the electronic system, making it a critical consideration in the design process.