SII Semiconductor S-24C08DI-J8T1U5
SII Semiconductor S-24C08DI-J8T1U5
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SII Semiconductor S-24C08DI-J8T1U5

Memory IC - Memory IC

Manufacturer No:

S-24C08DI-J8T1U5

Manufacturer:

SII Semiconductor

Utmel No:

2253-S-24C08DI-J8T1U5

Package:

14-SOIC (0.154, 3.90mm Width)

ECAD Model:

Description:

- Memory IC - Series

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
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S-24C08DI-J8T1U5 information

Specifications
Product Details
SII Semiconductor S-24C08DI-J8T1U5 technical specifications, attributes, parameters and parts with similar specifications to SII Semiconductor S-24C08DI-J8T1U5.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    14-SOIC (0.154, 3.90mm Width)
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    14-SOIC
  • Voltage - Supply Span (Max)
    36 V
  • Package
    Tube
  • Mfr
    Burr Brown
  • Product Status
    Active
  • Voltage - Supply Span (Min)
    4.5 V
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Other Names
    1662-2731-2 S-24C08DI-J8T1U5-ND
  • Memory Types
    Non-Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    -
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    EEPROM
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.7 V ~ 5.5 V
  • Output Type

    The "Output Type" parameter in electronic components refers to the type of signal or data that is produced by the component as an output. This parameter specifies the nature of the output signal, such as analog or digital, and can also include details about the voltage levels, current levels, frequency, and other characteristics of the output signal. Understanding the output type of a component is crucial for ensuring compatibility with other components in a circuit or system, as well as for determining how the output signal can be utilized or processed further. In summary, the output type parameter provides essential information about the nature of the signal that is generated by the electronic component as its output.

    -
  • Number of Circuits
    4
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    8Kb (1K x 8)
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    1MHz
  • Current - Supply

    Current - Supply is a parameter in electronic components that refers to the maximum amount of electrical current that the component can provide to the circuit it is connected to. It is typically measured in units of amperes (A) and is crucial for determining the power handling capability of the component. Understanding the current supply rating is important for ensuring that the component can safely deliver the required current without overheating or failing. It is essential to consider this parameter when designing circuits to prevent damage to the component and ensure proper functionality of the overall system.

    530µA (x4 Channels)
  • Access Time

    Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

    500ns
  • Slew Rate

    the maximum rate of output voltage change per unit time.

    2V/µs
  • Memory Format

    Memory Format in electronic components refers to the specific organization and structure of data storage within a memory device. It defines how data is stored, accessed, and managed within the memory module. Different memory formats include RAM (Random Access Memory), ROM (Read-Only Memory), and various types of flash memory. The memory format determines the speed, capacity, and functionality of the memory device, and it is crucial for compatibility with other components in a system. Understanding the memory format is essential for selecting the right memory module for a particular application or device.

    EEPROM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    I²C
  • Amplifier Type

    Amplifier Type refers to the classification or categorization of amplifiers based on their design, functionality, and characteristics. Amplifiers are electronic devices that increase the amplitude of a signal, such as voltage or current. The type of amplifier determines its specific application, performance capabilities, and operating characteristics. Common types of amplifiers include operational amplifiers (op-amps), power amplifiers, audio amplifiers, and radio frequency (RF) amplifiers. Understanding the amplifier type is crucial for selecting the right component for a particular circuit or system design.

    J-FET
  • Current - Input Bias

    The parameter "Current - Input Bias" in electronic components refers to the amount of current required at the input terminal of a device to maintain proper operation. It is a crucial specification as it determines the minimum input current needed for the component to function correctly. Input bias current can affect the performance and accuracy of the device, especially in precision applications where small signal levels are involved. It is typically specified in datasheets for operational amplifiers, transistors, and other semiconductor devices to provide users with important information for circuit design and analysis.

    5 pA
  • Gain Bandwidth Product

    The gain–bandwidth product (designated as GBWP, GBW, GBP, or GB) for an amplifier is the product of the amplifier's bandwidth and the gain at which the bandwidth is measured.

    1 MHz
  • Write Cycle Time - Word, Page

    Write Cycle Time - Word, Page refers to the duration required to write data to a specific memory cell or a page of memory in electronic components, particularly in non-volatile memories like Flash or EEPROM. It indicates the time taken to complete a writing operation for a single word or an entire page of data. This parameter is crucial for determining the performance and speed of memory devices in applications where quick data storage is essential. It impacts the overall efficiency in data handling, affecting both read and write speeds in memory-related operations.

    5ms
  • Voltage - Input Offset

    Voltage - Input Offset is a parameter that refers to the difference in voltage between the input terminals of an electronic component, such as an operational amplifier, when the input voltage is zero. It is an important characteristic that can affect the accuracy and performance of the component in various applications. A low input offset voltage is desirable as it indicates that the component will have minimal error in its output when the input signal is near zero. Manufacturers typically provide this specification in the component's datasheet to help users understand the component's behavior and make informed decisions when designing circuits.

    200 µV
  • Current - Output / Channel

    The parameter "Current - Output / Channel" in electronic components refers to the maximum amount of current that can be delivered by a single output channel of the component. This specification is important for determining the capacity of the component to drive external loads such as motors, LEDs, or other devices. It is typically expressed in units of amperes (A) and indicates the maximum current that can be safely drawn from the output channel without causing damage to the component. Designers and engineers use this parameter to ensure that the component can provide sufficient current to meet the requirements of the connected load while operating within its specified limits.

    18 mA
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S-24C08DI-J8T1U5 Overview

Case Tape & Reel (TR) is available. An embedded 14-SOIC (0.154, 3.90mm Width) case surrounds memory ics. It is estimated that the memory size on the chip is 8Kb (1K x 8). As with most mainstream devices, this one uses EEPROM-format memory. Due to its wide temperature range of -40°C ~ 85°C, this device is well suited to a wide range of applications that require high performance. With 1.7 V ~ 5.5 V as the supply voltage, it is capable of handling memory ics. It is recommended to mount it in the Surface Mount mounting type. In order to operate effectively, the memory rotates at a clock frequency within a range of 1MHz. This part, which belongs to the - series of memory devices, plays an important role in its target applications.

S-24C08DI-J8T1U5 Features

Package / Case: 14-SOIC (0.154, 3.90mm Width)

S-24C08DI-J8T1U5 Applications

There are a lot of SII Semiconductor
S-24C08DI-J8T1U5 Memory applications.


  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders