

Silicon Labs SI5340B-B03975-GMR
Clock Timing IC Tape & Reel (TR) Timer IC Chip
Manufacturer No:
SI5340B-B03975-GMR
Tiny WHSLManufacturer:
Utmel No:
2258-SI5340B-B03975-GMR
Package:
-
Datasheet:
Description:
Clock Generators Tape & Reel (TR)
Quantity:
Unit Price: $20.937772
Ext Price: $20.94
Delivery:





Payment:











In Stock : 25
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$20.937772
$20.94
10
$19.752615
$197.53
100
$18.634543
$1,863.45
500
$17.579757
$8,789.88
1000
$16.584677
$16,584.68
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- TypeParameter
- Factory Lead Time4 Weeks
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active - Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures
2 (1 Year) - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
260 - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
40 - uPs/uCs/Peripheral ICs Type
The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.
CLOCK GENERATOR, PROCESSOR SPECIFIC - RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant