SkyHigh Memory Limited S34ML04G300TFV100
SkyHigh Memory Limited S34ML04G300TFV100
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SkyHigh Memory Limited S34ML04G300TFV100

Memory IC S34ML04G3 Memory IC

Manufacturer No:

S34ML04G300TFV100

Utmel No:

2292-S34ML04G300TFV100

Package:

TSOP-48

ECAD Model:

Description:

S34ML04G3 Memory IC S34ML04G3 Series

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User Guide

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
S34ML04G300TFV100 information

Specifications
Product Details
SkyHigh Memory Limited S34ML04G300TFV100 technical specifications, attributes, parameters and parts with similar specifications to SkyHigh Memory Limited S34ML04G300TFV100.
  • Type
    Parameter
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    TSOP-48
  • Mounting Styles
    SMD/SMT
  • Interface Type
    Parallel
  • Timing Type
    Asynchronous
  • Supply Voltage-Min
    2.7 V
  • Minimum Operating Temperature
    - 40 C
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 105 C
  • Active Read Current - Max
    35 mA
  • Factory Pack QuantityFactory Pack Quantity
    96
  • Supply Voltage-Max
    3.6 V
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    S34ML04G3
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    4 Gbit
  • Supply Current-Max

    Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.

    35 mA
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    8 bit
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    512 M x 8
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S34ML04G300TFV100 Overview

In addition, memory ics is available in a Tray case as well. Embedded in the TSOP-48 case, memory ics is a single file. On the chip, there is an 4 Gbit memory, which is the size of the chip's memory. It is an important component of the S34ML04G3 series memory devices used in a variety of applications. In order to operate your device, you will need to provide a maximum supply current of 35 mA.

S34ML04G300TFV100 Features

Package / Case: TSOP-48

S34ML04G300TFV100 Applications

There are a lot of SkyHigh Memory Limited
S34ML04G300TFV100 Memory applications.


  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card
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