STMicroelectronics PSD853F2-70J
STMicroelectronics PSD853F2-70J
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STMicroelectronics PSD853F2-70J

Specialized ICs 52 Pin 52 Terminations Integrated circuit

Manufacturer No:

PSD853F2-70J

Manufacturer:

STMicroelectronics

Utmel No:

2381-PSD853F2-70J

Package:

52-LCC (J-Lead)

Datasheet:

PSD8xxFx

ECAD Model:

Description:

52 Terminations Programmable Peripherals IC 52 Pin PSD853F Specialized ICs 5V

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PSD853F2-70J information

Specifications
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Product Details
STMicroelectronics PSD853F2-70J technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics PSD853F2-70J.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    52-LCC (J-Lead)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    52
  • Memory Types
    FLASH
  • Number of I/Os
    27
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    52
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Type
    Programmable Peripherals IC
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Matte Tin (Sn)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    70°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    0°C
  • Applications

    The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

    8-Bit MCU Peripherals
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    J BEND
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    245
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    5V
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27mm
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    70GHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    PSD853F
  • Pin Count

    a count of all of the component leads (or pins)

    52
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    5.5V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    Parallel
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    976.6kB
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    4
  • Access Time

    Access time in electronic components refers to the amount of time it takes for a system to retrieve data from memory or storage once a request has been made. It is typically measured in nanoseconds or microseconds and indicates the speed at which data can be accessed. Lower access time values signify faster performance, allowing for more efficient processing in computing systems. Access time is a critical parameter in determining the overall responsiveness of electronic devices, particularly in applications requiring quick data retrieval.

    70 ns
  • Standby Current-Max

    Standby Current-Max refers to the maximum amount of current that an electronic component or device consumes while in a low-power standby mode. This parameter is critical for power management, especially in battery-operated devices, as it indicates how efficiently the device can conserve energy when not actively in use. A lower Standby Current-Max value is typically desirable, as it contributes to longer battery life and reduced energy consumption. Manufacturers specify this value to help engineers select components that meet specific power efficiency requirements in their designs.

    0.0002A
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    3000
  • Number of Macro Cells
    24
  • UV Erasable

    "UV Erasable" is a parameter commonly associated with certain types of programmable electronic components, such as EPROMs (Erasable Programmable Read-Only Memory) and PROMs (Programmable Read-Only Memory). These components can be programmed with data or instructions, and the UV erasable feature allows for the content to be erased using ultraviolet (UV) light. When exposed to UV light, the memory cells within the component are reset to their original state, effectively erasing the programmed data. This feature provides a way to reprogram the component multiple times, making it useful for applications where frequent updates or changes to the stored information are necessary.UV erasable components are often used in situations where flexibility and reusability are important, such as in development and testing environments, where the ability to quickly modify the programmed content is beneficial. However, it's worth noting that UV erasable components require special handling and precautions when erasing and reprogramming to avoid damage to the device.

    N
  • ROM Size (bits)

    The parameter "ROM Size (bits)" in electronic components refers to the amount of data that can be stored in a Read-Only Memory (ROM) chip, measured in bits. ROM is a type of non-volatile memory that retains its data even when the power is turned off. The ROM size indicates the total number of bits that can be stored in the memory chip, which determines the capacity for storing fixed data or instructions that are permanently programmed during manufacturing. The larger the ROM size in bits, the more data the chip can store, allowing for a greater variety of pre-programmed information to be accessed by the electronic device.

    1048576Bits
  • Length
    19.1mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    4.57mm
  • Width
    19.1mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for STMicroelectronics PSD853F2-70J.

PSD853F2-70J Overview

Package 52-LCC (J-Lead) contains the ICs.A package named Tube contains integrated circuit.Mounting is done using the Surface Mount method.Integrated circuit belongs to the class Programmable Peripherals IC.The PSD853F family contains similar integrated circuit systems.In 8-Bit MCU Peripherals, the ICs is appropriate.The ICs solutions has a total of 52 terminations.52 pins are available on the ICs applications.There should be 5V voltage applied to this logic gate IC.When integrated circuit chip's temperatures are below 70°C, you should utilize it.Temperatures below 0°C are not recommended for the integrated circuit system.On integrated circuit chip, there are 52 pins.A voltage of 5V can be delivered by logic gate IC.application specific integrated circuits are rated at 5.5V for their operating supply voltage.This logic IC has a frequency of 70GHz.As far as this memory is concerned, it has a size of 976.6kB.Embedded on the logic ICs are 4 ports.

PSD853F2-70J Features

Applications : 8-Bit MCU Peripherals
Supply power of 5V
Memory Size: 976.6kB

PSD853F2-70J Applications

There are a lot of STMicroelectronics
PSD853F2-70J Specialized ICs applications.


  • PDAs and Palmtop Devices
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  • Secure Download and Boot
  • Ecosystem Control
  • Anti-cloning
  • Message Security
  • µP Switch Interfacing
  • Industrial Instruments
  • PC-Based Instruments
  • Portable Instruments
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