Sullins Connector Solutions MPP-1100-05-DS-4GR(S1402)

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The parameter "Housing Material" in electronic components refers to the material used to encase or protect the internal circuitry of the component. The housing material plays a crucial role in providing physical protection, insulation, and environmental resistance to the electronic component. Common housing materials include plastics, metals, ceramics, and composites, each offering different levels of durability, heat resistance, and electrical properties. The choice of housing material is important in determining the overall performance, reliability, and longevity of the electronic component in various operating conditions.

The parameter "Contact Material - Mating" in electronic components refers to the material used for the contact surfaces that come into direct physical contact when the components are connected or mated together. This parameter is crucial for ensuring reliable electrical connections and preventing issues such as signal degradation, corrosion, or mechanical wear over time.The choice of contact material can impact the overall performance and durability of the electronic component, as different materials have varying properties such as conductivity, hardness, and resistance to environmental factors. Common contact materials include gold, silver, copper, and various alloys, each offering different advantages and trade-offs in terms of cost, conductivity, and longevity.Manufacturers carefully select the contact material for electronic components based on the specific requirements of the application, considering factors such as signal integrity, power handling capabilities, environmental conditions, and expected mating cycles. Proper selection and maintenance of contact materials are essential for ensuring the reliability and longevity of electronic systems.

Contact Material - Post refers to the material used for the contact posts in electronic components such as connectors, switches, and relays. These contact posts are the physical points where electrical connections are made between the component and other parts of a circuit. The choice of contact material is crucial as it can affect the component's performance, reliability, and durability. Common materials used for contact posts include copper, brass, phosphor bronze, and various types of plating such as gold or silver. The selection of the contact material is based on factors such as electrical conductivity, corrosion resistance, wear resistance, and cost considerations to ensure optimal performance of the electronic component.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

Lead length refers to the distance from the body of an electronic component to the end of its leads or terminals. It is an important specification in component design and packaging, as it affects the ease of soldering, the overall fit within a circuit board, and the electrical performance. Longer leads can facilitate easier connections but may also introduce increased resistance or inductance in high-frequency applications. Proper lead length is crucial for ensuring reliable connections and optimal performance in electronic circuits.

Contact resistance refers to the resistance encountered at the point of contact between two conductive materials or components. It is a measure of how well the two materials make electrical contact with each other. High contact resistance can lead to voltage drops, power losses, and inefficient electrical connections. It is typically measured in ohms and is an important parameter to consider in electronic components such as connectors, switches, and relays. Lower contact resistance is desirable for ensuring reliable and efficient electrical connections in electronic circuits.

Termination Post Length refers to the specific length of the conductive post in a connector or electronic component that is designed to electrically connect to a circuit board or another component. This length is crucial for ensuring proper electrical performance, mechanical stability, and alignment of the component during assembly. It affects the impedance and signal integrity of high-frequency signals, making it an important parameter in the design and selection of electronic components for various applications.

Contact Finish Thickness - Mating is a parameter in electronic components that refers to the thickness of the plating or finish on the contact surfaces of a connector or terminal that come into direct contact with mating components. This parameter is crucial for ensuring proper electrical conductivity and mechanical stability during mating and unmating processes. The contact finish thickness affects the overall reliability and performance of the connection by influencing factors such as contact resistance, wear resistance, and corrosion resistance. Manufacturers specify this parameter to ensure compatibility and optimal performance in various applications.

Contact Finish Thickness - Post is a parameter in electronic components that refers to the thickness of the plating or finish applied to the contact post of a component. The contact post is the part of the component that makes physical contact with other components or connectors. The thickness of the contact finish is important as it can affect the overall performance and reliability of the component. A thicker contact finish can provide better conductivity and durability, while a thinner finish may be more cost-effective but could be more prone to wear and corrosion. Manufacturers specify the contact finish thickness to ensure proper functioning of the component in various operating conditions.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.