

sullins corp RMC49MMSD
Manufacturer No:
RMC49MMSD
Tiny WHSLManufacturer:
Utmel No:
2386-RMC49MMSD
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RMC49MMSD datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from sullins corp stock available at Utmel
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- TypeParameter
- Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
- - Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
- - Supplier Device Package
The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.
- - Material - Insulation
Material - Insulation is a parameter that refers to the type of material used to provide insulation in electronic components. Insulation is crucial in electronic devices to prevent electrical current from flowing where it is not intended to go, thus avoiding short circuits and other potential hazards. The material used for insulation can vary depending on the specific requirements of the component, such as temperature resistance, dielectric strength, and environmental factors. Common insulation materials include plastics, ceramics, and various types of coatings designed to provide reliable and effective insulation in electronic components.
Polyphenylene Sulfide (PPS) - Product StatusLast Time Buy
- Data ConvertersA/D 8x10b
- MfrRohm Semiconductor
- Base Product Number
"Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.
ML610Q112 - PackageBulk
- Number of I/Os25
- Contact MaterialsPhosphor Bronze
- Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
- - Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-40°C ~ 105°C (TA) - Termination
Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.
Solder - Number of Positions98
- ColorBlack
- Number of Rows2
- Gender
In the context of electronic components, the parameter "Gender" typically refers to the physical characteristics of connectors or interfaces that determine how they can be mated together. Connectors are often designed with specific gender types, such as male or female, to ensure proper alignment and connection between devices. A male connector typically has protruding pins or plugs that fit into a corresponding female connector, which has receptacles or sockets to receive the pins. This design helps prevent incorrect connections and ensures a secure and reliable electrical connection. Understanding the gender of connectors is crucial when designing or assembling electronic systems to ensure compatibility and proper functionality. It is essential to match the gender of connectors correctly to avoid damage and ensure optimal performance of the electronic components.
Male - Contact Type
Contact Type in electronic components refers to the specific design and configuration of the electrical contacts used to establish connections between components or devices. The contact type determines how the electrical signals are transmitted between the components, and it can vary based on factors such as the application requirements, signal type, and environmental conditions. Common contact types include pin contacts, socket contacts, surface mount contacts, and wire-to-board contacts. Understanding the contact type is crucial for ensuring proper connectivity and reliable performance in electronic systems.
- - Pitch
In electronic components, "Pitch" refers to the distance between the center of one pin or lead to the center of the adjacent pin or lead on a component, such as an integrated circuit (IC) or a connector. It is a crucial parameter as it determines the spacing and alignment of the pins or leads on a component, which in turn affects how the component can be mounted on a circuit board or connected to other components.The pitch measurement is typically expressed in millimeters (mm) or inches (in) and plays a significant role in determining the overall size and layout of a circuit board. Components with different pitches may require specific types of circuit boards or connectors to ensure proper alignment and connection. Designers must carefully consider the pitch of components when designing circuit layouts to ensure compatibility and proper functionality of the electronic system.
0.100 (2.54mm) - Contact Finish
Contact finish refers to the surface coating or treatment applied to the electrical contacts of electronic components. This finish is crucial for ensuring reliable electrical connections and preventing corrosion or oxidation of the contacts. Common contact finishes include gold, silver, tin, and nickel, each offering different levels of conductivity, durability, and resistance to environmental factors. The choice of contact finish depends on the specific application requirements, such as operating conditions, cost considerations, and compatibility with other components in the circuit. Selecting the appropriate contact finish is essential for maintaining the performance and longevity of electronic devices.
Gold - Card Type
In the context of electronic components, the parameter "Card Type" typically refers to the physical form factor or shape of the component. It describes the specific design and layout of the component, which can vary depending on its intended use and compatibility with other components or systems. For example, common card types in electronics include PCI cards, SIM cards, and memory cards, each designed for specific functions and applications. Understanding the card type is important for ensuring proper installation, compatibility, and functionality within an electronic system.
Fits Female Edgecards - Read Out
the process of removing information from an automatic device (such as a computer or sensor) and displaying it in an understandable form.
Dual - Number of Positions/Bay/Row49
- Flange Feature
In electronic components, the term "Flange Feature" refers to a specific design element that involves a protruding rim or edge around the perimeter of the component. This flange feature serves multiple purposes, such as providing mechanical support, facilitating mounting or installation, enhancing stability, and improving heat dissipation. The flange feature can vary in size, shape, and material depending on the specific requirements of the component and its intended application. Overall, the presence of a flange feature in electronic components helps ensure proper functionality, durability, and ease of integration within electronic systems.
Flush Mount, Top Opening, Unthreaded, 0.125 (3.18mm) Dia - Oscillator Type
Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.
Internal - Speed
In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.
8.4MHz - RAM Size
RAM size refers to the amount of random access memory (RAM) available in an electronic component, such as a computer or smartphone. RAM is a type of volatile memory that stores data and instructions that are actively being used by the device's processor. The RAM size is typically measured in gigabytes (GB) and determines how much data the device can store and access quickly for processing. A larger RAM size allows for smoother multitasking, faster loading times, and better overall performance of the electronic component. It is an important factor to consider when choosing a device, especially for tasks that require a lot of memory, such as gaming, video editing, or running multiple applications simultaneously.
4K x 8 - Voltage - Supply (Vcc/Vdd)
Voltage - Supply (Vcc/Vdd) is a key parameter in electronic components that specifies the voltage level required for the proper operation of the device. It represents the power supply voltage that needs to be provided to the component for it to function correctly. This parameter is crucial as supplying the component with the correct voltage ensures that it operates within its specified limits and performance characteristics. It is typically expressed in volts (V) and is an essential consideration when designing and using electronic circuits to prevent damage and ensure reliable operation.
2.7V ~ 5.5V - Core Processor
The term "Core Processor" typically refers to the central processing unit (CPU) of a computer or electronic device. It is the primary component responsible for executing instructions, performing calculations, and managing data within the system. The core processor is often considered the brain of the device, as it controls the overall operation and functionality. It is crucial for determining the speed and performance capabilities of the device, as well as its ability to handle various tasks and applications efficiently. In modern devices, core processors can have multiple cores, allowing for parallel processing and improved multitasking capabilities.
nX-U8/100 - Peripherals
In the context of electronic components, "Peripherals" refer to devices or components that are connected to a main system or device to enhance its functionality or provide additional features. These peripherals can include input devices such as keyboards, mice, and touchscreens, as well as output devices like monitors, printers, and speakers. Other examples of peripherals include external storage devices, network adapters, and cameras. Essentially, peripherals are external devices that expand the capabilities of a main electronic system or device.
POR, PWM, WDT - Program Memory Type
Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.
FLASH - Core Size
Core size in electronic components refers to the physical dimensions of the core material used in devices such as inductors and transformers. The core size directly impacts the performance characteristics of the component, including its inductance, saturation current, and frequency response. A larger core size typically allows for higher power handling capabilities and lower core losses, while a smaller core size may result in a more compact design but with limitations on power handling and efficiency. Designers must carefully select the core size based on the specific requirements of the application to achieve optimal performance and efficiency.
8-Bit - Program Memory Size
Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.
32KB (16K x 16) - Connectivity
In electronic components, "Connectivity" refers to the ability of a component to establish and maintain connections with other components or devices within a circuit. It is a crucial parameter that determines how easily signals can be transmitted between different parts of a circuit. Connectivity can be influenced by factors such as the number of input and output ports, the type of connectors used, and the overall design of the component. Components with good connectivity are essential for ensuring reliable and efficient operation of electronic systems.
I²C, SSP, UART/USART - EEPROM Size
EEPROM Size refers to the amount of memory capacity available in an Electrically Erasable Programmable Read-Only Memory (EEPROM) chip. This parameter indicates the total storage space in bytes or bits that can be used to store data in a non-volatile manner. The EEPROM size determines the maximum amount of information that can be written, read, and erased from the memory chip. It is an important specification to consider when selecting an EEPROM for a particular application, as it directly impacts the amount of data that can be stored and accessed by the electronic component.
2K x 16 - Features
In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.
- - Contact Finish Thickness
Contact Finish Thickness refers to the measurement of the layer of conductive material applied to the surfaces of electrical contacts in electronic components. This thickness is critical as it influences the electrical conductivity, solderability, wear resistance, and overall performance of the connection. The materials used for the contact finish can include gold, silver, or other metals, and the specified thickness is designed to ensure reliable operation over the component's lifespan.
30.0µin (0.76µm) - Card Thickness
Card Thickness in electronic components refers to the measurement of the thickness of a printed circuit board (PCB) or a card used in electronic devices. It is an important parameter as it determines the overall size and form factor of the electronic component. The card thickness can vary depending on the specific requirements of the device and the components it houses. It is typically measured in millimeters or mils (1 mil = 0.001 inches) and is a critical consideration in the design and manufacturing of electronic products to ensure proper fit and functionality.
0.062 (1.57mm)
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