TDK Electronics Inc. B66329G1000X127

The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

The parameter "Finish" in electronic components refers to the surface treatment or coating applied to the metal parts of the component, such as connectors or circuit boards. This finish can affect electrical conductivity, corrosion resistance, and solderability. Common finishes include gold plating, nickel plating, and tin plating, each offering different properties and levels of protection against environmental factors. The choice of finish can influence the overall performance and longevity of the electronic device.

Core type in electronic components refers to the material and shape used in the core of inductors, transformers, and other magnetic devices. It significantly affects the device's magnetic properties, efficiency, and frequency response. Common core types include ferrite, iron, and air cores, each with distinct characteristics suitable for specific applications. The choice of core type impacts factors such as inductance, saturation level, and operational bandwidth.

In electronic components, the term "Gap" typically refers to the distance between two conductive elements or components within a circuit. This distance is crucial as it determines the insulation or isolation between the components, preventing unintended electrical connections or short circuits. The gap is often specified in terms of physical distance or voltage rating, indicating the maximum voltage that can be safely applied across the gap without causing breakdown or arcing. Properly managing the gap in electronic components is essential for ensuring the reliability, safety, and performance of the circuit.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.