TE Connectivity 1757250-1

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

"Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

the outer-most structure on the hull of a steel or aluminum ship or boat.

a three or four digit numerical code assigned by NCCI or a State Rating Bureau.

In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

Cavity A in electronic components refers to a physical space or chamber within the component where certain elements or materials are housed or contained. This cavity is designed to provide protection, insulation, or support for sensitive components or circuits within the electronic device. The size, shape, and material of the cavity can vary depending on the specific requirements of the component and its intended function. Cavity A may also be used for heat dissipation, electromagnetic shielding, or to prevent interference from external sources, contributing to the overall performance and reliability of the electronic component.

Cavity B in electronic components refers to a specific type of cavity or empty space within a component where other materials or components can be inserted. These cavities are designed to accommodate additional components or materials for various purposes such as tuning, filtering, or shielding. The size, shape, and location of the cavity B within the electronic component are carefully designed to ensure optimal performance and functionality of the overall device. Engineers and designers may utilize cavity B to enhance the capabilities or customize the characteristics of the electronic component for specific applications.

Cavity E refers to a specific type of resonant cavity used in electronic components, particularly in microwave and RF applications. It is designed to support electromagnetic waves at certain frequencies, allowing for efficient energy transfer and signal processing. The geometry of Cavity E is critical in determining its resonant frequency, bandwidth, and quality factor, making it essential for applications such as filters, oscillators, and amplifiers. Its design can affect the performance and efficiency of the overall electronic system in which it is implemented.