TE Connectivity 2057445-3

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

The parameter "Housing Material" in electronic components refers to the material used to encase or protect the internal circuitry of the component. The housing material plays a crucial role in providing physical protection, insulation, and environmental resistance to the electronic component. Common housing materials include plastics, metals, ceramics, and composites, each offering different levels of durability, heat resistance, and electrical properties. The choice of housing material is important in determining the overall performance, reliability, and longevity of the electronic component in various operating conditions.

The PCB Mounting Orientation refers to the specific position or alignment in which an electronic component is mounted onto a printed circuit board (PCB). This parameter is crucial for ensuring proper functionality and performance of the component within the electronic system. The orientation can include factors such as the physical placement, angle, and direction in which the component is mounted on the PCB. It is important to follow the manufacturer's guidelines and specifications for the correct PCB Mounting Orientation to avoid potential issues such as electrical shorts, mechanical stress, or interference with other components on the board.

Underplate Material in electronic components refers to the material used for the underplate layer, which is a thin metallic coating applied to the surface of a component. The underplate material is typically chosen based on its ability to provide a stable and reliable surface for subsequent processes such as soldering or wire bonding. Common materials used for underplate include nickel, gold, silver, and tin. The choice of underplate material can impact the component's performance, durability, and overall quality. It is important to select the appropriate underplate material based on the specific requirements of the electronic component and its intended application.

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

In electronic components, "Pitch" refers to the distance between the center of one pin or lead to the center of the adjacent pin or lead on a component, such as an integrated circuit (IC) or a connector. It is a crucial parameter as it determines the spacing and alignment of the pins or leads on a component, which in turn affects how the component can be mounted on a circuit board or connected to other components.The pitch measurement is typically expressed in millimeters (mm) or inches (in) and plays a significant role in determining the overall size and layout of a circuit board. Components with different pitches may require specific types of circuit boards or connectors to ensure proper alignment and connection. Designers must carefully consider the pitch of components when designing circuit layouts to ensure compatibility and proper functionality of the electronic system.

In electronic components, the parameter "Orientation" refers to the specific alignment or positioning of the component with respect to its intended installation or operation. This parameter is crucial for ensuring proper functionality and performance of the component within a circuit or system. Orientation may include factors such as the physical orientation of the component on a circuit board, the direction of current flow through the component, or the alignment of specific features or terminals for correct connection. Manufacturers often provide orientation guidelines in datasheets or technical specifications to help users correctly install and use the component. Paying attention to the orientation of electronic components is essential to prevent errors, ensure reliability, and optimize the overall performance of electronic devices.

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

Housing color in electronic components refers to the color of the protective casing or enclosure that surrounds the component. It can play a role in visual identification, aiding in easy recognition during assembly or maintenance. Additionally, the housing color may also have implications for heat dissipation, aesthetic considerations, or regulatory compliance depending on the application or industry standards.

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

The parameter "Contact Style" in electronic components refers to the specific design and arrangement of the contact points that enable electrical connection in various devices. It dictates how components interface with each other, affecting factors such as reliability, durability, and performance. Different contact styles can include configurations like pin, socket, blade, or surface mount, each designed to cater to specific applications and requirements in circuit assembly.

the space needed between rows to allow room for people or farm equipment to get through.

The "Max Current Rating" parameter in electronic components refers to the maximum amount of electrical current that the component can safely handle without being damaged. It is an important specification to consider when designing or selecting components for a circuit, as exceeding the maximum current rating can lead to overheating, malfunction, or even permanent damage to the component. The max current rating is typically provided in amperes (A) and is determined by the component's internal construction, materials used, and thermal characteristics. It is crucial to ensure that the current flowing through the component does not exceed this specified limit to maintain the component's reliability and longevity.

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

The parameter "Sealable" in electronic components refers to the ability of the component to be securely sealed or enclosed to protect it from environmental factors such as moisture, dust, and other contaminants. Components that are sealable are designed to prevent damage or malfunction caused by exposure to these external elements. This sealing can be achieved through various methods such as encapsulation, potting, or conformal coating. Ensuring that electronic components are sealable is important for maintaining their reliability and longevity in various operating conditions.

The current rating of a contact is defined as the current level that creates a certain temperature rise of the contact spring — usually 20°C or 30°C. Both electrical and thermal factors govern the heat created by the current.

Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

The "Hole Diameter" parameter in electronic components refers to the size of the hole that is designed to accommodate a lead or pin of another component for soldering or connection purposes. It is a critical dimension that ensures proper alignment and fit between components during assembly. The hole diameter is typically specified in millimeters or inches and plays a crucial role in determining the mechanical stability and electrical connectivity of the overall circuit or device. Manufacturers provide specific hole diameter requirements to ensure compatibility and reliability in electronic assemblies.

Mating alignment in electronic components refers to the precise positioning and orientation required for two components to connect or fit together properly. This parameter is crucial for ensuring that electrical connections are made correctly and securely. It involves factors such as the physical dimensions, shape, and alignment features of the components that need to be matched for successful mating. Proper mating alignment is essential for maintaining signal integrity, preventing damage to the components, and ensuring reliable performance of the electronic system. Manufacturers often provide specifications and guidelines for mating alignment to help users achieve optimal connections and functionality.

The parameter "Stackable" in electronic components refers to the ability of certain components to be physically layered or stacked on top of each other without compromising their functionality or performance. This feature is particularly common in modules, such as memory or power supplies, allowing for compact designs and efficient use of space in electronic systems. Stackable components often include features like alignment guides or electrical interconnects that facilitate easy assembly and reliable connections in multi-layer configurations.

"Make First / Break Last" is a term used in the context of relay contacts in electronic components. It refers to the sequence in which the contacts of a relay make or break connection when the relay is activated or deactivated. In a "Make First / Break Last" configuration, the contacts make connection first when the relay is activated, ensuring a smooth and uninterrupted flow of current. Conversely, when the relay is deactivated, the contacts break connection last, allowing the current to stop flowing only after all other components have safely disengaged.This configuration is often preferred in applications where maintaining a continuous and stable electrical connection is critical to prevent any disruptions or damage to the circuit. It helps to minimize the risk of arcing and ensures reliable operation of the relay and the connected components.

Differential signaling is a method used in electronic components to transmit data over a pair of wires. It involves sending two complementary signals, one positive and one negative, to represent the data. This technique helps improve signal integrity and reduce noise interference, making it ideal for high-speed data transmission applications. By comparing the voltage difference between the two signals, the receiver can accurately interpret the transmitted data, even in the presence of noise or other disturbances. Differential signaling is commonly used in interfaces such as USB, Ethernet, and HDMI to ensure reliable and high-speed communication between devices.

Differential Pairs per Column is a parameter in electronic components that refers to the number of pairs of differential signals that can be accommodated within a single column of the component. A differential pair consists of two signals that are equal in magnitude and opposite in polarity, commonly used in high-speed digital communication to reduce noise and improve signal integrity. Having multiple pairs per column allows for more efficient routing and better signal performance in complex circuit designs. This parameter is important in applications where signal integrity and noise immunity are critical, such as in high-speed data transmission or precision measurement systems.

Plating thickness in electronic components refers to the measurement of the thickness of the metal plating applied to various surfaces of the component. This plating is typically done to enhance the component's conductivity, corrosion resistance, and solderability. The plating thickness is an important parameter as it directly affects the performance and reliability of the electronic component. Manufacturers specify the required plating thickness to ensure that the component meets the desired electrical and mechanical properties for its intended application. Testing and quality control measures are often employed to verify that the plating thickness meets the specified requirements.

PCB thickness refers to the measurement of the thickness of a printed circuit board, typically expressed in millimeters or mils. It plays a crucial role in determining the mechanical strength, flexibility, and thermal performance of the PCB. Standard thicknesses commonly range from 0.2 mm to 3.2 mm, with the most common thickness being 1.6 mm. The choice of PCB thickness affects the overall design and functionality of electronic devices, influencing factors such as signal integrity and power management.

Stack height in electronic components refers to the distance between the top and bottom surfaces of a component when multiple components are stacked on top of each other. This parameter is important in applications where space constraints are a concern, as it determines the overall height of the stacked components. Designers need to consider the stack height when selecting components to ensure proper fit and functionality within the given space. Additionally, stack height can impact the overall performance and thermal management of the electronic system, making it a critical consideration in the design process.

The Flammability Rating of electronic components refers to the material's ability to resist catching fire or burning when exposed to heat or flames. It is an important safety consideration in electronic design and manufacturing, especially for components that may be used in environments where fire hazards are a concern. The rating is typically expressed using a standardized scale, such as UL94, which classifies materials based on their flammability characteristics. Components with higher flammability ratings are more resistant to ignition and contribute to overall fire safety in electronic devices. It is crucial to select components with appropriate flammability ratings to ensure the reliability and safety of electronic products.